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GB/T 42676-2023 半导体单晶晶体质量的测试 X射线衍射法(中英文版) Testing the quality of semiconductor single crystals X-ray diffraction method |
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GB/T 42848-2023 半导体集成电路 直接数字频率合成器测试方法(中英文版) Semiconductor integrated circuits - Test methods for direct digital frequency synthesizers |
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GB/T 8446.2-2022 电力半导体器件用散热器? 第2部分:热阻和流阻测量方法(中英文版) Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop |
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GB/T 21548-2021 光通信用高速直接调制半导体激光器的测量方法(中英文版) Methods of measurement of the high speed semiconductor lasers directly modulated for optical fiber communication systems |
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GB/T 11498-2018 半导体器件-集成电路-第21部分:膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)半导体器件-集成电路-第21部分:膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)(中英文版) Semiconductor devices—Integrated circuits—Part 21:Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures |
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GB/T 13062-2018 半导体器件-集成电路-第21-1部分:膜集成电路和混合膜集成电路空白详细规范(采用鉴定批准程序)(中英文版) Semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures |
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GB/T 4937.201-2018 半导体器件 机械和气候试验方法 第20-1部分:对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输(中英文版) Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
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GB/T 4937.20-2018 半导体器件 机械和气候试验方法 第20部分:塑封表面安装器件耐潮湿和焊接热综合影响(中英文版) Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
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GB/T 35010.6-2018 半导体芯片产品 第6部分:热仿真要求(中英文版) Semiconductor die products—Part 6: Requirements for concerning thermal simulation |
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GB/T 249-2017 半导体分立器件型号命名方法(中英文版) The rule of type designation for discrete semiconductor devices |
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GB/T 13539.4-2016 低压熔断器 第4部分:半导体设备保护用熔断体的补充要求(中英文版) Low-voltage fuses—Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices |
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GB/T 1555-2009 半导体单晶晶向测定方法(中英文版) Testing methods for determining the orientation of a semiconductor single crystal |
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GB/T 13539.4-2009 低压熔断器 第4部分:半导体设备保护用熔断体的补充要求(中英文版) Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices |
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GB/T 21548-2008 光通信用高速直接调制半导体激光器的测量方法(中英文版) Methods of measurement of the high speed semiconductor lasers directly modulated for optical fiber communication systems |
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GB/T 8446.2-2004 电力半导体器件用散热器 第2部分:热阻和流阻测试方法(中英文版) Heat sink for power semiconductor device--Part 2:Measuring method of thermal resistance and inputfluid-output fluid pressure difference |
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GB/T 17950-2000 半导体变流器 第6部分:使用熔断器保护半导体变流器防止过电流的应用导则(中英文版) Semiconductor converter--Part 6:Application guide for the protection of semiconductor converters against overcurrent by fuses |
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GB/T 16438-1996 半导体少长针消雷装置使用的安全要求(中英文版) The safety demands of using semiconductor lightning eliminator |
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GB/T 14862-1993 半导体集成电路封装结到外壳热阻测试方法(中英文版) Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits |
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GB/T 3430-1989 半导体集成电路型号命名方法(中英文版) The rule of type designation for semiconductor integrated circuits |
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GB/T 249-1989 半导体分立器件型号命名方法(中英文版) The rule of type designation for discrete semiconductor devices |
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GB/T 4298-1984 半导体硅材料中杂质元素的活化分析方法(中英文版) The activation analysis method for the determination of elemental impurities in semiconductor silicon materials |
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