“Specification of cir ” 中國GB標準檢索結果 |
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1. 已翻譯的GB標準英文版（有 SALE
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GB/T 24861-2024 水产品流通管理技术规范（中英文版） Technical specifications for circulation management of aquatic products |
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GB/T 43279.3-2023 分子体外诊断检验 静脉全血检验前过程的规范 第3部分：分离血浆循环游离DNA（中英文版） Molecular in vitro diagnostic tests. Specification of pre-test procedures for venous whole blood. Part 3: Isolation of plasma circulating cell-free DNA. |
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GB/T 40065-2021 果蔬类周转箱循环共用管理规范（中英文版） Specification for circular sharing management of fruit and vegetable cycling container |
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GB/T 38328-2019 柔性直流系统用高压直流断路器的共用技术要求（中英文版） Common specifications of high-voltage direct current circuit-breakers for high-voltage direct current transmission using voltage sourced converters（VSC-HVDC） |
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GB/T 38328-2019 柔性直流系统用高压直流断路器的共用技术要求（中英文版） Common specifications of high-voltage direct current circuit-breakers for high-voltage direct current transmission using voltage sourced converters（VSC-HVDC） |
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GB/T 38328-2019 柔性直流系统用高压直流断路器的共用技术要求（中英文版） Common specifications of high-voltage direct current circuit-breakers for high-voltage direct current transmission using voltage sourced converters（VSC-HVDC） |
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GB/T 11498-2018 半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)（中英文版） Semiconductor devices—Integrated circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures |
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GB/T 13062-2018 半导体器件-集成电路-第21-1部分：膜集成电路和混合膜集成电路空白详细规范(采用鉴定批准程序)（中英文版） Semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures |
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GB/T 36578-2018 产业园区循环经济信息化公共平台数据接口规范（中英文版） Data interface specification for circular economy informatization platform of industrial park |
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GB/T 33567-2017 工业园区循环经济评价规范（中英文版） Specification for circular economy evaluating of industrial parks |
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GB/T 16525-2015 半导体集成电路 塑料有引线片式载体封装引线框架规范（中英文版） Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package |
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GB/T 15878-2015 半导体集成电路 小外形封装引线框架规范（中英文版） Semiconductor integrated circuits—Specification of leadframes for small outline package |
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GB/T 15876-2015 半导体集成电路 塑料四面引线扁平封装引线框架规范（中英文版） Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package |
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GB/T 14112-2015 半导体集成电路 塑料双列封装冲制型引线框架规范（中英文版） Semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP |
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GB/T 31404-2015 核电站海水循环系统防腐蚀作业技术规范（中英文版） Technical specification for anticorrosion operation of seawater circulation system in nuclear power plant |
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GB/T 31329-2014 循环冷却水节水技术规范（中英文版） Technical specification for saving water of circulating cooling water |
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GB/T 15877-2013 半导体集成电路 蚀刻型双列封装引线框架规范（中英文版） Semiconductor integrated circuits—Specification of DIP leadframes produced by etching |
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GB/T 15157.12-2011 频率低于3MHz的印制板连接器 第12部分：集成电路插座的尺寸、一般要求和试验方法详细规范（中英文版） Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits |
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GB/T 26679-2011 机床电气、电子和可编程电子控制系统 保护联结电路连续性试验规范（中英文版） Electrical ,electronic and programmable electronic control systems of machine tools - Specification of the continuity of the protective bonding circuit test |
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GB/T 24342-2009 工业机械电气设备 保护接地电路连续性试验规范（中英文版） Electrical equipment of industrial machines - Continuity of the protective bonding circuit test specifications |
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GB/T 16466-1996 膜集成电路和混合膜集成电路空白详细规范(采用能力批准程序)（中英文版） Blank detailspecification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
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GB/T 16465-1996 膜集成电路和混合膜集成电路分规范(采用能力批准程序)（中英文版） Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
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GB/T 13062-1991 膜集成电路和混合膜集成电路空白详细规范(可供认证用)（中英文版） Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure |
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GB/T 11498-1989 膜集成电路和混合膜集成电路分规范(采用鉴定批准程序) (可供认证用)（中英文版） Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure |
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GB/T 7436-1987 在模拟电话电路上开放电报及低速数据的时分复用设备技术要求（中英文版） Specifications of TDM equipment operating on an analog telephone-type circuit for telegraph and lower-speed data |
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