“Integrated circuit c ” 中國GB標準檢索結果 |
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1. 已翻譯的GB標準英文版（有 SALE
標誌的），以及GB標準中文版，可以直接在網站上購買，在收到您付款後，會在1～3天內發您郵箱。 2. 其他未翻譯的GB標準英文版，在接到您翻譯訂單後，才進行翻譯，時間一般需要多3～5天。 |
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GB/T 42839-2023 （中英文版） Semiconductor integrated circuit Analog-to-digital (AD) converter |
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GB/T 42838-2023 （中英文版） Semiconductor integrated circuit Hall circuit test method |
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GB/T 42837-2023 （中英文版） Microwave semiconductor integrated circuit amplifier |
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GB/T 42836-2023 （中英文版） Microwave semiconductor integrated circuit mixer |
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GB/T 42835-2023 （中英文版） Semiconductor integrated circuit system on chip (SoC) |
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GB/T 41325-2022 （中英文版） Low-density crystal primary pit silicon single crystal polishing wafer for integrated circuits |
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GB/T 7092-2021 （中英文版） Outline dimensions of semiconductor integrated circuits |
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GB/T 41213-2021 （中英文版） Integrated circuit full automatic die bonder |
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GB/T 40577-2021 （中英文版） Terminology for integrated circuit(IC) manufacturing equipment |
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GB/T 39679-2020 （中英文版） Integrated circuit card device for lifts |
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GB/T 39159-2020 （中英文版） High purity copper alloy target for integrated circuit |
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GB/T 29271.4-2019 （中英文版） Identification cards—Integrated circuit card programming interfaces—Part 4: Application programming interface (API) administration |
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GB/T 16649.11-2019 （中英文版） Identification cards—Integrated circuit cards—Part 11: Personal verification through biometric methods |
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GB/T 29271.6-2019 （中英文版） Identification cards—Integrated circuit card programming interfaces—Part 6: Registration authority procedures for the authentication protocols for interoperability |
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GB/T 37312.1-2019 （中英文版） Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
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GB/T 11498-2018 （中英文版） Semiconductor devices—Integrated circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures |
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GB/T 13062-2018 （中英文版） Semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures |
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GB/T 37600.11-2018 （中英文版） National central product classification—Product category core metadata—Part 11：Magnetic stripe card and integrated circuit card |
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GB/T 36474-2018 （中英文版） Semiconductor integrated circuit—Measuring methods for double data rate 3 synchronous dynamic random access memory(DDR3 SDRAM) |
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GB/T 36479-2018 （中英文版） Integrated circuits—Test methods for column grid array |
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GB/T 36477-2018 （中英文版） Semiconductor integrated circuit—Measuring methods for flash memory |
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GB/T 15879.5-2018 （中英文版） Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits |
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GB/T 36614-2018 （中英文版） Integrated circuits—Memory devices pin configuration |
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GB/T 36600.11-2018 （中英文版） National central product classification—Product category core metadata—Part 11：Magnetic stripe card and integrated circuit card |
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GB/T 36636-2018 （中英文版） Identification cards—Specification for dual-interface integrated circuit card module |
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GB/T 35007-2018 （中英文版） Semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry |
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GB/T 35006-2018 （中英文版） Semiconductor integrated circuits—Measuring method of level converter |
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GB/T 35004-2018 （中英文版） Logic digital integrated circuits—Specification for I/O interface model for integrated circuit |
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GB/T 35005-2018 （中英文版） Test methods for flip chip integrated circuits |
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GB/T 14028-2018 （中英文版） Semiconductor integrated circuits—Measuring method of analogue switch |
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