“Integrated circuit s ” 中國GB標準檢索結果 |
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1. 已翻譯的GB標準英文版(有 SALE
標誌的),以及GB標準中文版,可以直接在網站上購買,在收到您付款後,會在1~3天內發您郵箱。 2. 其他未翻譯的GB標準英文版,在接到您翻譯訂單後,才進行翻譯,時間一般需要多3~5天。 |
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GB/T 35007-2018 半导体集成电路 低电压差分信号电路测试方法(中英文版) Semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry |
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GB/T 35006-2018 半导体集成电路 电平转换器测试方法(中英文版) Semiconductor integrated circuits—Measuring method of level converter |
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GB/T 35004-2018 数字集成电路 输入/输出电气接口模型规范(中英文版) Logic digital integrated circuits—Specification for I/O interface model for integrated circuit |
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GB/T 35005-2018 集成电路倒装焊试验方法(中英文版) Test methods for flip chip integrated circuits |
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GB/T 14028-2018 半导体集成电路 模拟开关测试方法(中英文版) Semiconductor integrated circuits—Measuring method of analogue switch |
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GB/T 4377-2018 半导体集成电路 电压调整器测试方法(中英文版) Semiconductor integrated circuits—Measuring method of voltage regulators |
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GB/T 33140-2016 集成电路用磷铜阳极(中英文版) Phosphorized copper anode used for integrated circuit |
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GB/T 4023-2015 半导体器件 分立器件和集成电路 第2部分:整流二极管(中英文版) Semiconductor devices—Discrete devices and integrated circuits— Part 2: Rectifier diodes |
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GB 51122-2015 集成电路封装测试厂设计规范(中英文版) Code for design of integrated circuit assembly and test factory |
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GB/T 16525-2015 半导体集成电路 塑料有引线片式载体封装引线框架规范(中英文版) Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package |
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GB/T 15878-2015 半导体集成电路 小外形封装引线框架规范(中英文版) Semiconductor integrated circuits—Specification of leadframes for small outline package |
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GB/T 15876-2015 半导体集成电路 塑料四面引线扁平封装引线框架规范(中英文版) Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package |
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GB/T 14112-2015 半导体集成电路 塑料双列封装冲制型引线框架规范(中英文版) Semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP |
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GB/T 29271.3-2014 识别卡 集成电路卡编程接口 第3部分:应用接口(中英文版) Identification cards—Integrated circuit card programming interfaces—Part 3: Application interface |
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GB/T 30962-2014 识别卡 集成电路卡 大容量卡(中英文版) Identification cards―Integrated circuit cards―High capacity cards |
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GB/T 15877-2013 半导体集成电路 蚀刻型双列封装引线框架规范(中英文版) Semiconductor integrated circuits—Specification of DIP leadframes produced by etching |
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GB/T 16649.13-2013 识别卡 集成电路卡 第13部分:在多应用环境中的应用管理命令(中英文版) Identification cards - Integrated circuit cards - Part 13: Commands for application management in a multi-application environment |
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GB/T 14620-2013 薄膜集成电路用氧化铝陶瓷基片(中英文版) Alumina ceramic substrates for thin film integrated circuits |
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GB/T 14619-2013 厚膜集成电路用氧化铝陶瓷基片(中英文版) Alumina ceramic substrates for thick film integrated circuits |
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GB/T 29271.2-2012 识别卡 集成电路卡编程接口 第2部分:通用卡接口(中英文版) Identification card - Integrated circuit card programming interfaces - Part 2: Generic card interface |
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GB/T 29271.1-2012 识别卡 集成电路卡编程接口 第1部分:体系结构(中英文版) Identification cards - Integrated circuit card programming interfaces - Part 1: Architecture |
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GB 50809-2012 硅集成电路芯片工厂设计规范(中英文版) Code for design of silicon integrated circuits wafer fab |
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GB/T 28511.2-2012 平面光波导集成光路器件 第2部分:基于阵列波导光栅(AWG)技术的密集波分复用(DWDM)滤波器(中英文版) Integrated optical path devices based on planar lightwave circuit - Part 2 :DWDM filter based on AWG technology |
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GB/T 28511.1-2012 平面光波导集成光路器件 第1部分:基于平面光波导(PLC)的光功率分路器(中英文版) Integrated optical path devices based on planar lightwave circuit - Part 1:Optical power splitter based on PLC technology |
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GB/T 15157.12-2011 频率低于3MHz的印制板连接器 第12部分:集成电路插座的尺寸、一般要求和试验方法详细规范(中英文版) Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits |
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GB/T 22351.2-2010 识别卡 无触点的集成电路卡 邻近式卡 第2部分:空中接口和初始化(中英文版) Identification cards - Contactless integrated circuit(s) cards - Vicinity cards - Part2: Air interface and initialization |
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GB/T 16649.9-2010 识别卡 集成电路卡 第9部分:用于卡管理的命令(中英文版) Identification cards - Integrated circuit cards - Part 9: Commands for card management |
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GB/T 16649.4-2010 识别卡 集成电路卡 第4部分:用于交换的结构、安全和命令(中英文版) Identification Cards - Integrated circuit cards - Part 4: Organization, security and commands for interchange |
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GB/T 16649.15-2010 识别卡 集成电路卡 第15部分:密码信息应用(中英文版) Identification cards - Integrated circuit cards - Part 15: Cryptographic information application |
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GB/T 16649.12-2010 识别卡 集成电路卡 第12部分:带触点的卡-USB电气接口和操作规程(中英文版) Identification cards - Integrated circuit cards - Part 12: Cards with contacts - USB electrical interface and operating procedures |
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GB/T 22351.3-2008 识别卡 无触点的集成电路卡 邻近式卡 第3部分:防冲突和传输协议(中英文版) Identification cards - Contactless integrated circuit(s) IC cards - Vicinity cards - Part 3: Anticollision and transmission protocol |
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GB/T 22351.1-2008 识别卡 无触点的集成电路卡 邻近式卡 第1部分:物理特性(中英文版) Identification cards - Contactless integrated circuit(s) cards - Vicinity cards - Part 1: Physical characteristics |
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GB/T 20870.1-2007 半导体器件 第16-1部分:微波集成电路 放大器(中英文版) Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers |
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GB/T 17574.9-2006 半导体器件 集成电路 第2-9部分:数字集成电路 紫外光擦除电可编程MOS只读存储器空白详细规范(中英文版) Semiconductor devices - Integrated circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories |
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GB/T 17574.20-2006 半导体器件 集成电路 第2-20部分:数字集成电路 低压集成电路族规范(中英文版) Semiconductor devices - Integrated circuits - Part 2-20:Digital integrated circuits - Family specification - Low voltage integrated circuits |
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GB/T 17574.11-2006 半导体器件 集成电路 第2-11部分:数字集成电路 单电源集成电路电可擦可编程只读存储器 空白详细规范(中英文版) Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory |
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GB/T 4589.1-2006 半导体器件 第10部分:分立器件和集成电路总规范(中英文版) Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits |
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GB/T 20515-2006 半导体器件 集成电路 第5部分:半定制集成电路(中英文版) Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits |
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GB/T 16790.7-2006 金融交易卡 使用集成电路卡的金融交易系统的安全体系 第7部分:密钥管理(中英文版) Financial transaction cards - Security architecture of financial transaction systems using integrated circuit cards - Part 7: Key management |
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GB/T 16790.6-2006 金融交易卡 使用集成电路卡的金融交易系统的安全体系 第6部分:持卡人身份验证(中英文版) Financial transaction cards - Security architecture of financial transaction systems using integrated circuit cards - Part 6: Cardholder verification |
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GB/T 16790.5-2006 金融交易卡 使用集成电路卡的金融交易系统的安全体系 第5部分:算法应用(中英文版) Financial transaction cards - Security architecture of financial transaction systems using integrated circuit cards - Part 5: Use of algorithms |
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GB/T 12750-2006 半导体器件 集成电路 第11部分:半导体集成电路分规范(不包括混合电路)(中英文版) Semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits |
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GB/T 17554.3-2006 识别卡 测试方法 第3部分:带触点的集成电路卡及其相关接口设备(中英文版) Identification cards - Test methods Part 3: Integrated circuit(s) cards with contacts and related interface devices |
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GB/T 16649.3-2006 识别卡 带触点的集成电路卡 第3部分:电信号和传输协议(中英文版) Identification cards - Integrated circuit(s) cards with contacts - Part 3: Electronic signals and transmission protocols |
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GB/T 16649.2-2006 识别卡 带触点的集成电路卡 第2部分:触点的尺寸和位置(中英文版) Identification cards - Integrated circuit(s) cards with contacts - Part 2: Dimensions and location of the contacts |
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GB/T 16649.1-2006 识别卡 带触点的集成电路卡 第1部分:物理特性(中英文版) Identification cards - Integrated circuit(s) cards with contacts - Part 1: Physical characteristics |
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GB/T 19558-2004 集成电路(IC)卡公用付费电话系统总技术要求(中英文版) General specifications for integrated circuit(IC)card payphone and system |
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GB/T 2900.66-2004 电工术语 半导体器件和集成电路(中英文版) Electrotechnical terminology--Semiconductor devices and integrated circuits |
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GB/T 19403.1-2003 半导体器件 集成电路 第11部分:第1篇:半导体集成电路 内部目检 (不包括混合电路)(中英文版) Semiconductor devices--Integrated circuits--Part 11:Section 1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits) |
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GB/T 17574.10-2003 半导体器件 集成电路 第2-10部分:数字集成电路 集成电路动态读/写存储器空白详细规范(中英文版) Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories |
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