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GB/T 5729-2003
(中英文版)
Fixed resistors for use in electronic equipment--Part 1:Generic specification
GB/T 4182-2003
(中英文版)
Molybdenum wire
GB/T 2423.52-2003
(中英文版)
Environmental testing for electric and electronic products--Part 2:Test methods--Test 77:Body strength and impact shock
GB/T 19405.2-2003
(中英文版)
Surface mounting technology--Part 2:Transportation and storage conditions of surface mounting devices(SMD)--Application guide
GB/T 19405.1-2003
(中英文版)
Surface mounting technology--Part 1:Standard method for the specification of surface mounting components(SMDs)
GB/T 19404-2003
(中英文版)
Microwave ferrite components--Measuringmethods for major properties
GB/T 19403.1-2003
(中英文版)
Semiconductor devices--Integrated circuits--Part 11:Section 1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits)
GB/T 19247.4-2003
(中英文版)
Printed board assemblies--Part 4:Sectional specification--Requirements for terminal soldered assemblies
GB/T 19247.3-2003
(中英文版)
Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies
GB/T 18910.2-2003
(中英文版)
Liquid crystal and solid-state display devices--Part 2:Liquid crystal display modules sectional specification
GB/T 18794.7-2003
(中英文版)
Information technology--Open Systems Interconnection--Security frameworks for open systems--Part 7:Security audit and alarms framework
GB/T 18794.6-2003
(中英文版)
Information technology--Open Systems Interconnection--Security frameworks for open systems--Part 6:Integrity framework
GB/T 18794.5-2003
(中英文版)
Information technology--Open Systems Interconnection--Security frameworks for open systems--Part 5:Confidentiality framework
GB/T 18794.4-2003
(中英文版)
Information technology--Open Systems Interconnection--Security frameworks for open systems--Part 4:Non-repudiation framework
GB/T 18794.3-2003
(中英文版)
Information technology--Open Systems Interconnection--Security frameworks for open systems--Part 3:Access control framework
GB/T 18714.3-2003
(中英文版)
Information technology--Open distributed processing--Reference model--Part 3:Architecture
GB/T 18311.5-2003
(中英文版)
Fibre optic interconnecting devices and passive components--Basic test and measurement procedures--Part 3-5:Examinations and measurements--Wavelength dependence of attenuation
GB/T 18311.4-2003
(中英文版)
Fibre optic interconnecting devices and passive components--Basic test and measurement procedures--Part 3-4:Examinations and measurements--Attenuation
GB/T 18311.40-2003
(中英文版)
Fibre optic interconnecting devices and passivecomponents--Basic test and measurement procedures--Part 3-40:Examinations and measurements--Extinction ratio of a polarization maintaining(pm)fibre pigtailed connector
GB/T 18311.34-2003
(中英文版)
Fibre optic interconnecting devices and passive components--Basic test and measurement procedures--Part 3-34:Examinations and measurements--Attenuation of random mated connectors
GB/T 18311.1-2003
(中英文版)
Fibre optic interconnecting devices and passive components--Basic test and measurement procedures--Part 3-1:Examinations and measurements--Visual examination
GB/T 18310.9-2003
(中英文版)
Fibre optic interconnecting devices and passive components--Basic test and measurement procedures--Part 2-9:Tests--Shock
GB/T 18310.45-2003
(中英文版)
Fibre optic interconnecting devices and passive components--Basic test and measurement procedures--Part 2-45:Tests--Durability test by water immersion
GB/T 18310.42-2003
(中英文版)
Fibre optic interconnecting devices and passive components--Basic test and measurement procedures--Part 2-42:Tests--Static side load for connectors
GB/T 18310.26-2003
(中英文版)
Fibre optic interconnecting devices and passive components--Basic test and measurement procedures--Part 2-26:Tests--Salt mist
GB/T 18310.22-2003
(中英文版)
Fibre optic interconnecting devices and passive components--Basic test andmeasurement procedures--Part 2-22:Tests--Change of temperature
GB/T 18310.17-2003
(中英文版)
Fibre optic interconnecting devices and passive components--Basic test and measurement procedures--Part 2-17:Tests--Cold
GB/T 18310.14-2003
(中英文版)
Fibre optic interconnecting devices and passive components--Basic test and measurement procedures--Part 2-14:Tests--Maximum input power
GB/T 17574.10-2003
(中英文版)
Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories
GB/T 16681-2003
(中英文版)
Information technology--Chinese interface specifications of open system

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