“Integrated circuit c ” 中國GB標準檢索結果 |
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1. 已翻譯的GB標準英文版（有 SALE
標誌的），以及GB標準中文版，可以直接在網站上購買，在收到您付款後，會在1～3天內發您郵箱。 2. 其他未翻譯的GB標準英文版，在接到您翻譯訂單後，才進行翻譯，時間一般需要多3～5天。 |
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GB/T 4377-2018 （中英文版） Semiconductor integrated circuits—Measuring method of voltage regulators |
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GB/T 33140-2016 （中英文版） Phosphorized copper anode used for integrated circuit |
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GB/T 4023-2015 （中英文版） Semiconductor devices—Discrete devices and integrated circuits— Part 2: Rectifier diodes |
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GB 51122-2015 （中英文版） Code for design of integrated circuit assembly and test factory |
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GB/T 16525-2015 （中英文版） Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package |
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GB/T 15878-2015 （中英文版） Semiconductor integrated circuits—Specification of leadframes for small outline package |
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GB/T 15876-2015 （中英文版） Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package |
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GB/T 14112-2015 （中英文版） Semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP |
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GB/T 29271.3-2014 （中英文版） Identification cards—Integrated circuit card programming interfaces—Part 3: Application interface |
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GB/T 30962-2014 （中英文版） Identification cards―Integrated circuit cards―High capacity cards |
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GB/T 15877-2013 （中英文版） Semiconductor integrated circuits—Specification of DIP leadframes produced by etching |
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GB/T 16649.13-2013 （中英文版） Identification cards - Integrated circuit cards - Part 13: Commands for application management in a multi-application environment |
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GB/T 14620-2013 （中英文版） Alumina ceramic substrates for thin film integrated circuits |
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GB/T 14619-2013 （中英文版） Alumina ceramic substrates for thick film integrated circuits |
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GB/T 29271.2-2012 （中英文版） Identification card - Integrated circuit card programming interfaces - Part 2: Generic card interface |
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GB/T 29271.1-2012 （中英文版） Identification cards - Integrated circuit card programming interfaces - Part 1: Architecture |
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GB 50809-2012 （中英文版） Code for design of silicon integrated circuits wafer fab |
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GB/T 28511.2-2012 （中英文版） Integrated optical path devices based on planar lightwave circuit - Part 2 ：DWDM filter based on AWG technology |
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GB/T 28511.1-2012 （中英文版） Integrated optical path devices based on planar lightwave circuit - Part 1：Optical power splitter based on PLC technology |
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GB/T 15157.12-2011 （中英文版） Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits |
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GB/T 22351.2-2010 （中英文版） Identification cards - Contactless integrated circuit(s) cards - Vicinity cards - Part2: Air interface and initialization |
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GB/T 16649.9-2010 （中英文版） Identification cards - Integrated circuit cards - Part 9: Commands for card management |
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GB/T 16649.4-2010 （中英文版） Identification Cards - Integrated circuit cards - Part 4: Organization, security and commands for interchange |
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GB/T 16649.15-2010 （中英文版） Identification cards - Integrated circuit cards - Part 15: Cryptographic information application |
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GB/T 16649.12-2010 （中英文版） Identification cards - Integrated circuit cards - Part 12: Cards with contacts - USB electrical interface and operating procedures |
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GB/T 22351.3-2008 （中英文版） Identification cards - Contactless integrated circuit(s) IC cards - Vicinity cards - Part 3: Anticollision and transmission protocol |
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GB/T 22351.1-2008 （中英文版） Identification cards - Contactless integrated circuit(s) cards - Vicinity cards - Part 1: Physical characteristics |
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GB/T 20870.1-2007 （中英文版） Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers |
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GB/T 17574.9-2006 （中英文版） Semiconductor devices - Integrated circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories |
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GB/T 17574.20-2006 （中英文版） Semiconductor devices - Integrated circuits - Part 2-20：Digital integrated circuits - Family specification - Low voltage integrated circuits |
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