“Determination for Co ” 中國GB標準檢索結果 |
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SJ 2806-1987 電子級氫中痕量氧和氮測定方法 變溫濃縮色譜法(中英文版) Method for determination of trace Oxygen and Argon in electronic grade Hydrogen--Concentration gas chromatographic method |
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SJ 2805-1987 電子級氫中痕量氧+氬、氮測定方法 變溫濃縮色譜法(中英文版) Method for determination of Oxygen with Argon and Nitrogen in electronic grade Hydrogen--Concentration gas chromatographic method |
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SJ 2804.2-1987 電子級氬中痕量氮測定方法 變溫濃縮色譜法(二)(中英文版) Method for determination of trace Nitrogen in electronic grade Argon--Concentration gas chromatographic method (Part two) |
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SJ 2804.1-1987 電子級氬中痕量氮測定方法 變溫濃縮色譜法(一)(中英文版) Method for determination of Nitrogen in electronic grade Argon--Concentration gas chromatographic method (Part one) |
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SJ 3198-1989 真空矽鋁合金中矽、鐵、鎂、銅的發射光譜分析方法(中英文版) Method for determination of Silicon, Iron, Magnesium and Copper in vacuum Silicon-Aluminium alloy by emission spectrum |
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SJ/T 10227-1991 電子工業用矽酸鉀溶液粘度的測定方法(中英文版) Potassium silicate solution for use in electronic industry. the methods of determination for viscosity |
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SJ/T 10171.11-1991 鹼性蓄電池隔膜性能測試方法 隔膜銅、鐵含量的測定 原子吸收分光光度法(中英文版) Measurement methods for performances of separator of alkaline batteries--Determination of copper and iron content in separator by atomic absorption sepectrophotomtry |
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SJ 20147.2-1992 銀和銀合金鍍覆層測試方法 殘留鹽分的測定(中英文版) Determination methods for electrodeposited silver and silver alloy coatings Determination of the presence of residual salts |
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SJ/T 10557.4-1994 電解電容器用鋁箔化學分析方法 原子吸收分光光度法測定 銅、鐵、鋅、錳和鎂量(中英文版) Chemical anlytical methods for aluminium foil for the electrolytic capacitor. Determination of copper, iron, zinc, manganese and magnesium with atomic absorption spectrophotometry |
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SJ/Z 9168-1995 錄影機用半導體分立器件認定通用規範(中英文版) Generic specifications for determination of discrete semiconductor devices used for VCR |
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SJ/T 10625-1995 鍺單晶體中間隙氧含量的紅外吸收測定方法(中英文版) Determination method for interstitial atomic oxygen content of germanium by infrared abaorption |
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SJ/T 11111-1996 金屬覆蓋層 銀和銀合金電鍍層試驗方法 第1部分:鍍層厚度的測定(中英文版) Methods coatings. Test methods for electrodeposited silver and silver alloy coatings. Part 1: Determination of coating thickness |
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SJ/T 11108-1996 金屬覆蓋層 金和金合金電鍍層的試驗方法 第4部分:金含量的測定(中英文版) Metallic coatings. Test methods for electrodeposited gold and gold alloy coatings. Part 4: Determination of gold content |
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SJ/T 11105-1996 金屬覆蓋層 金和金合金電鍍層的試驗方法 第1部分:鍍層厚度測定(中英文版) Metallic coatings. Test methods for electrodeposited gold and gold alloy coatings. Part 1: Determination of coating thickness |
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SJ/T 11032-1996 電子器件用金銅及金鎳釺焊料的分析方法 原子吸收分光光度法測定鋅(中英文版) Analytical methods for gold copper and gold nickel brazing for electron device Determination of zinc by atomic absorption spectrophotometry |
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SJ/T 11031-1996 電子器件用金銅及金鎳釺焊料的分析方法 磷鉬藍分光光度法測定磷(中英文版) Analytical methods for gold copper and gold nickel brazing for electron device Determination of phosphorus by phosphorimetry |
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SJ/T 11030-1996 電子器件用金銅及金鎳釺焊料的分析方法 雙硫腙分光光度法測定鉛(中英文版) Analytical methods for gold copper and gold nickel brazing for electron device Determination of lead by dithizone spectrophotometry |
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SJ/T 11029-1996 電子器件用金鎳釺焊料的分析方法 edta容量法測定鎳(中英文版) Analytical methods for gold nickel brazing for electron device Determination of copper by EDTA volumetry |
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SJ/T 11028-1996 電子器件用金銅釺焊料的分析方法 edta容量法測定銅(中英文版) Analytical methods for gold copper brazing for electron device Determination of copper by EDTA volumetry |
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SJ/T 11027-1996 電子器件用銀銅釺焊料的分析方法 原子吸收分光光度法測定鎂(中英文版) Analytical methods for silver copper brazing for electron device Determination of magnesium by atomic absorption spectrophotometry |
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SJ/T 11026-1996 電子器件用銀銅釺焊料的分析方法 原子吸收分光光度法測定鐵、鎘、鋅(中英文版) Analytical methods for silver copper brazing for electron device Determination of iron, cadmium and zinc by atomic absorption spectrophotometry |
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SJ/T 11025-1996 電子器件用銀銅釺焊料的分析方法 原子吸收分光光度法測定鉛(中英文版) Analytical methods for silver copper brazing for electron device Determination of lead by atomic absorption spectrophotometry |
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SJ/T 11024-1996 電子器件用銀銅釺焊料的分析方法 原子吸收分光光度法測定銻(中英文版) Analytical methods for silver copper brazing for electron device Determination of antimony by atomic absorption spectrophotometry |
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SJ/T 11023-1996 電子器件用銀銅釺焊料的分析方法 原子吸收分光光度法測定鉍(中英文版) Analytical methods for silver copper brazing for electron device Determination of bismuth by atomic absorption spectrophotometry |
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SJ/T 11022-1996 電子器件用銀銅釺焊料的分析方法 鄰基二酚紫-溴化十六烷基吡啶分光光度法測定錫(中英文版) Analytical methods for silver copper brazing for electron device Determination of tin by C21H38BrN-absorption spectrophotometry |
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SJ/T 11021-1996 電子器件用銀銅釺焊料的分析方法 鉛、鉍、鋅、鎘、鐵、鎂、鋁、錫和銻的化學光譜測定(中英文版) Analytical methods for silver copper brazing for electron device Determination of Pb, Bi, Zn, Cd, Fe, Mg, Al, Sn and Sb by spectrochemical analysis |
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SJ/T 11020-1996 電子器件用銀銅釺焊料的分析方法 碘量法測定銅(中英文版) Analytical methods for silver copper brazing for electron device Determination of copper by iodimetry |
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SJ/T 11018-1996 電子器件用純銀釺焊料的分析方法 燃燒碘量法測定硫(中英文版) Analytical methods for pure silver brazing for electron device Determination of sulfur by combustion-iodimetry |
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SJ/T 10927-1996 電子工業用矽酸鉀溶液中銅的測定方法(中英文版) Potassium silicate solution for use in electronic industry. The methods of determination for copper |
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SJ/T 10924-1996 電子工業用矽酸鉀溶液中二氧化矽含量的測定方法(中英文版) Potassium silicate solution for use in electronic industry. The methods of determination for silica content |
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