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	SJ 2806-1987 電子級氫中痕量氧和氮測定方法變溫濃縮色譜法（中英文版） Method for determination of trace Oxygen and Argon in electronic grade Hydrogen--Concentration gas chromatographic method
	SJ 2805-1987 電子級氫中痕量氧＋氬、氮測定方法變溫濃縮色譜法（中英文版） Method for determination of Oxygen with Argon and Nitrogen in electronic grade Hydrogen--Concentration gas chromatographic method
	SJ 2804.2-1987 電子級氬中痕量氮測定方法變溫濃縮色譜法（二）（中英文版） Method for determination of trace Nitrogen in electronic grade Argon--Concentration gas chromatographic method (Part two)
	SJ 2804.1-1987 電子級氬中痕量氮測定方法變溫濃縮色譜法（一）（中英文版） Method for determination of Nitrogen in electronic grade Argon--Concentration gas chromatographic method (Part one)
	SJ 3198-1989 真空矽鋁合金中矽、鐵、鎂、銅的發射光譜分析方法（中英文版） Method for determination of Silicon, Iron, Magnesium and Copper in vacuum Silicon-Aluminium alloy by emission spectrum
	SJ/T 10227-1991 電子工業用矽酸鉀溶液粘度的測定方法（中英文版） Potassium silicate solution for use in electronic industry. the methods of determination for viscosity
	SJ/T 10171.11-1991 鹼性蓄電池隔膜性能測試方法隔膜銅、鐵含量的測定原子吸收分光光度法（中英文版） Measurement methods for performances of separator of alkaline batteries--Determination of copper and iron content in separator by atomic absorption sepectrophotomtry
	SJ 20147.2-1992 銀和銀合金鍍覆層測試方法殘留鹽分的測定（中英文版） Determination methods for electrodeposited silver and silver alloy coatings Determination of the presence of residual salts
	SJ/T 10557.4-1994 電解電容器用鋁箔化學分析方法原子吸收分光光度法測定銅、鐵、鋅、錳和鎂量（中英文版） Chemical anlytical methods for aluminium foil for the electrolytic capacitor. Determination of copper, iron, zinc, manganese and magnesium with atomic absorption spectrophotometry
	SJ/Z 9168-1995 錄影機用半導體分立器件認定通用規範（中英文版） Generic specifications for determination of discrete semiconductor devices used for VCR
	SJ/T 10625-1995 鍺單晶體中間隙氧含量的紅外吸收測定方法（中英文版） Determination method for interstitial atomic oxygen content of germanium by infrared abaorption
	SJ/T 11111-1996 金屬覆蓋層銀和銀合金電鍍層試驗方法第１部分：鍍層厚度的測定（中英文版） Methods coatings. Test methods for electrodeposited silver and silver alloy coatings. Part 1: Determination of coating thickness
	SJ/T 11108-1996 金屬覆蓋層金和金合金電鍍層的試驗方法第４部分：金含量的測定（中英文版） Metallic coatings. Test methods for electrodeposited gold and gold alloy coatings. Part 4: Determination of gold content
	SJ/T 11105-1996 金屬覆蓋層金和金合金電鍍層的試驗方法第１部分：鍍層厚度測定（中英文版） Metallic coatings. Test methods for electrodeposited gold and gold alloy coatings. Part 1: Determination of coating thickness
	SJ/T 11032-1996 電子器件用金銅及金鎳釺焊料的分析方法原子吸收分光光度法測定鋅（中英文版） Analytical methods for gold copper and gold nickel brazing for electron device Determination of zinc by atomic absorption spectrophotometry
	SJ/T 11031-1996 電子器件用金銅及金鎳釺焊料的分析方法磷鉬藍分光光度法測定磷（中英文版） Analytical methods for gold copper and gold nickel brazing for electron device Determination of phosphorus by phosphorimetry
	SJ/T 11030-1996 電子器件用金銅及金鎳釺焊料的分析方法雙硫腙分光光度法測定鉛（中英文版） Analytical methods for gold copper and gold nickel brazing for electron device Determination of lead by dithizone spectrophotometry
	SJ/T 11029-1996 電子器件用金鎳釺焊料的分析方法ｅｄｔａ容量法測定鎳（中英文版） Analytical methods for gold nickel brazing for electron device Determination of copper by EDTA volumetry
	SJ/T 11028-1996 電子器件用金銅釺焊料的分析方法ｅｄｔａ容量法測定銅（中英文版） Analytical methods for gold copper brazing for electron device Determination of copper by EDTA volumetry
	SJ/T 11027-1996 電子器件用銀銅釺焊料的分析方法原子吸收分光光度法測定鎂（中英文版） Analytical methods for silver copper brazing for electron device Determination of magnesium by atomic absorption spectrophotometry
	SJ/T 11026-1996 電子器件用銀銅釺焊料的分析方法原子吸收分光光度法測定鐵、鎘、鋅（中英文版） Analytical methods for silver copper brazing for electron device Determination of iron, cadmium and zinc by atomic absorption spectrophotometry
	SJ/T 11025-1996 電子器件用銀銅釺焊料的分析方法原子吸收分光光度法測定鉛（中英文版） Analytical methods for silver copper brazing for electron device Determination of lead by atomic absorption spectrophotometry
	SJ/T 11024-1996 電子器件用銀銅釺焊料的分析方法原子吸收分光光度法測定銻（中英文版） Analytical methods for silver copper brazing for electron device Determination of antimony by atomic absorption spectrophotometry
	SJ/T 11023-1996 電子器件用銀銅釺焊料的分析方法原子吸收分光光度法測定鉍（中英文版） Analytical methods for silver copper brazing for electron device Determination of bismuth by atomic absorption spectrophotometry
	SJ/T 11022-1996 電子器件用銀銅釺焊料的分析方法鄰基二酚紫－溴化十六烷基吡啶分光光度法測定錫（中英文版） Analytical methods for silver copper brazing for electron device Determination of tin by C21H38BrN-absorption spectrophotometry
	SJ/T 11021-1996 電子器件用銀銅釺焊料的分析方法鉛、鉍、鋅、鎘、鐵、鎂、鋁、錫和銻的化學光譜測定（中英文版） Analytical methods for silver copper brazing for electron device Determination of Pb, Bi, Zn, Cd, Fe, Mg, Al, Sn and Sb by spectrochemical analysis
	SJ/T 11020-1996 電子器件用銀銅釺焊料的分析方法碘量法測定銅（中英文版） Analytical methods for silver copper brazing for electron device Determination of copper by iodimetry
	SJ/T 11018-1996 電子器件用純銀釺焊料的分析方法燃燒碘量法測定硫（中英文版） Analytical methods for pure silver brazing for electron device Determination of sulfur by combustion-iodimetry
	SJ/T 10927-1996 電子工業用矽酸鉀溶液中銅的測定方法（中英文版） Potassium silicate solution for use in electronic industry. The methods of determination for copper
	SJ/T 10924-1996 電子工業用矽酸鉀溶液中二氧化矽含量的測定方法（中英文版） Potassium silicate solution for use in electronic industry. The methods of determination for silica content

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