“Specification for pe ” 中國GB標準檢索結果 |
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1. 已翻譯的GB標準英文版(有 SALE
標誌的),以及GB標準中文版,可以直接在網站上購買,在收到您付款後,會在1~3天內發您郵箱。 2. 其他未翻譯的GB標準英文版,在接到您翻譯訂單後,才進行翻譯,時間一般需要多3~5天。 |
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SJ 2864-1988 電子器件詳細規範 功率型固定電阻器 rxg7型線繞固定電阻器 評定水準e(中英文版) Detail specification for electronic components--Fixed power resistors--Fixed wirewound resistors for Type RXG7 Assessment level E |
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SJ 2862-1988 電子器件詳細規範 功率型固定電阻器 rxg5型線繞固定電阻器 評定水準e(中英文版) Detail specification for electronic components--Fixed power resistors--Fixed wirewound resistors for Type RXG5 Assessment level E |
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SJ 2861-1988 電子器件詳細規範 功率型固定電阻器 rxg4型線繞固定電阻器 評定水準e(中英文版) Detail specification for electronic components--Fixed power resistors--Fixed wirewound resistors for Type RXG4 Assessment level E |
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SJ 2860-1988 電子器件詳細規範 功率型固定電阻器 rxg3型線繞固定電阻器(中英文版) Detail specification for electronic components--Fixed power resistors--Fixed wirewound resistors for Type RXG3 |
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SJ 2859-1988 電子器件詳細規範 功率型固定電阻器 rxg2型線繞固定電阻器 評定水準e(中英文版) Detail specification for electronic components--Fixed power resistors--Fixed wirewound resistors for Type RXG2 Assessment level E |
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SJ 20394-1993 電容器包裝規範(中英文版) Specification for capacitors packaging |
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SJ 20393-1993 電阻器包裝規範(中英文版) Specification for resistors packaging |
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SJ 20391-1993 金屬封接用玻璃規範(中英文版) Specification for glass for metal sealing |
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SJ 20390-1993 電子器件用玻璃-金屬接頭規範(中英文版) Specification for floss to mental headers use in electron deices |
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SJ 20388-1993 紅外探測器用藍寶石視窗規範(中英文版) Specification for sapphire window for use ion infrared detector |
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SJ 2854-1988 半導體分立器件 塑封引線框架詳細規範(中英文版) Discrete semiconductor devices--Detail specification for lead frame of plastic package |
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SJ 2853-1988 半導體分立器件 螺栓形管座管帽詳細規範(中英文版) Discrete semiconductor devices--Detail specification for thread-hexagonal base and cap |
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SJ 2851-1988 半導體分立器件 小功率管管座管帽詳細規範(中英文版) Discrete semiconductor devices--Detail specification for base and cap of low power transistors |
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SJ 2850-1988 半導體分立器件 管座管帽引線框架總規範(中英文版) General specification for base, cap and lead frame of discrete semiconductor devices |
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SJ 3264-1989 電子琴總技術條件(中英文版) General specification for electronic organ |
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SJ 3262-1989 電子件包封材料通用技術條件(中英文版) General specification for packaging materials for use in electronic components |
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SJ 3259-1989 音叉、音片諧振器總技術條件(中英文版) General specification for resonator with tuning fork and tablet |
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SJ 3258-1989 普及級小型答錄機總技術條件(中英文版) General specification for popularized small recorders |
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SJ 3251-1989 地面炮瞄雷達天線通用技術條件(中英文版) General specification for antiairoraft gun radar antenna |
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SJ 3228.1-1989 電子工業用高純石英砂技術條件(中英文版) Specification for high purty arenaceous quartz for use in electronic industry |
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SJ 3224-1989 機載雷達熱設計規範(中英文版) Specification for thermal design of air-borne radar |
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SJ 3223-1989 地面雷達發射系統通用技術條件(中英文版) General specification for transmitting system of ground radar |
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SJ 3219-1989 艦船雷達天線座通用技術條件(中英文版) General specification for antennas pedestal of shipborne radar |
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SJ 3218-1989 地面雷達接收系統通用技術條件(中英文版) General specification for receiving system of ground radar |
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SJ 3212-1989 電子產品運輸包裝總技術條件(中英文版) General specification for transport packages of electronic products |
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SJ 3210-1989 電平表通用技術條件(中英文版) General specification for level meter |
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SJ 3209-1989 可焊性測試儀通用技術條件(中英文版) General specification for weldable testing instrument |
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SJ 3190-1989 球閥技術條件(中英文版) Specification for ball valve |
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SJ 3188-1989 止回閥技術條件(中英文版) Specification for one-way valve |
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SJ 3186-1989 節流閥技術條件(中英文版) Specification for butterfly valve |
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