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“Specification for La ” 中國GB標準檢索結果

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GB/T 19675.2-2005
(中英文版)
Specifications of flexible graphite gaskets reinforced with tanged metal sheet for pipe flanges
GB/T 18496.2-2005
(中英文版)
Electromechanical switches for use in electronic equipment Part 4-1:Sectional specification for lever(toggle)switches Blank detail specification
GB/T 7214-2003
(中英文版)
Fixed capacitors for use in electronic equipment--Part 15-3:Blank detail specification--Fixed tantalum capacitors with solid electrolyte and porous anode--Assessment level E
GB/T 5994-2003
(中英文版)
Fixed capacitors for use in electronic equipment--Part 4-1:Blank detail specification--Auminium electrolytic capacitors with non-solid electrolyte--Assessment level E
GB/T 17574.10-2003
(中英文版)
Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories
GB/T 6850-2003
(中英文版)
Cinematography--Labelling of containers for raw-stock motion-picture films and magnetic films--Minimum information specifications
GB/T 19290.2-2003
(中英文版)
Modular order for the development of mechanical structures for electronic equipment practices--Part 2: Sectional specification--Interface co-ordination dimensions for the 25mm equipment practice
GB/T 10072-2003
(中英文版)
Specifications of electronic flash equipments for photograph
GB/T 19247.1-2003
(中英文版)
Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
GB/T 18237.4-2003
(中英文版)
Information technology--Open systems interconnection--Generic upper layers security--Part 4: Protecting transfer syntax specification
GB/T 6160-2003
(中英文版)
Micrographics--First generation silver-gelatin microforms of source documents--Density specifications and method of measurement
GB 15629.11-2003
(中英文版)
Information technology--Telecommunications and information exchange between systems--Local and metropolitan area networks--Specific requirements--Part 11: Wireless LAN Medium Access Control (MAC) andPhysical Layer(PHY) Specifications
GB 15629.1102-2003
(中英文版)
Information technology--Telecommunications and information exchange between systems--Local and metropolitan area networks--Specific requirements--Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer(PHY) Specifications: Higher-Speed Physi
GB/T 9129-2003
(中英文版)
Specifications of non-metallic flat gaskets for pipe flanges
GB/T 18971-2003
(中英文版)
General specification for tourism planning
GB/T 18904.5-2003
(中英文版)
Semiconductor devices--Part 12-5: Optoelectronic devices--Blank detail specification for pin-photodiodes with/without pigtail,for fibre optic systems or subsystems
GB/T 7154.1-2003
(中英文版)
Thermistors--Directly heated positive step-function temperature coefficient--Part 1-1:Blank detail specification for current limiting application--Assessment level EZ
GB/T 13477.1-2002
(中英文版)
Test method for building sealants--Part 1:Specifications for test substrates
GB/T 6589-2002
(中英文版)
Semiconductordevices--Discrete devices--Part 3-2:Signal (including switching) and regulator diodes--Blank detail specification for voltage-regulator diodes and voltage-reference diodes (excluding temperature-compensated precision reference diodes)
GB/T 18917-2002
(中英文版)
Blank detail specification for the colour projection picture tubes
GB/T 18904.4-2002
(中英文版)
Semiconductor devices--Part 12-4:Optoelectronicdevices--Blank detail specification for pin-FET modules with/without pigtailfor fiber optic systems or sub-systems
GB/T 18904.3-2002
(中英文版)
Semiconductor devices--Part 12-3:Optoelectronic devices--Blank detail specification for light-emitting diodes--Display application
GB/T 18904.2-2002
(中英文版)
Semiconductor devices--Part 12-2:Optoelectronic devices--Blank detail specification for laser diodes modules with pigtail for fiber optic systems or sub-systems
GB/T 18904.1-2002
(中英文版)
Semiconductor devices--Part 12-1:Optoelectronic devices--Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fiber optic systems or sub-systems
GB/T 17562.8-2002
(中英文版)
Rectangular connectors for frequencies below 3MHz--Part 8:Detail specification for connectors,four-signal contacts and earthing contacts for cable screen
GB/T 18838.1-2002
(中英文版)
Preparation of steel substrates before application of paints and related products--Specifications for metallic blast-cleaning abrasives--General introduction and classification
GB/T 17850.1-2002
(中英文版)
Preparation of steel substrates before application of paints and related products--Specifications for non-metallic blast-cleaning abrasives--General introductionand classification
GB/T 16857.1-2002
(中英文版)
Geometrical product specification(GPS)--Acceptance and reverification tests for coordinate measuring machines--Part 1:Vocabulary
GB/T 1303.2-2002
(中英文版)
Specification for industrial rigid laminated sheetsbased on thermosetting resins for electrical purposes--Part 3:Specifications for individual materials--Sheet 3:Requirements for rigid laminated sheets based onmelamine resins
GB/T 2820.7-2002
(中英文版)
Reciprocating internal combustion engine driven alternating current generating sets--Part 7:Technical declarations for specification and design

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