“Specification for La ” 中國GB標準檢索結果 |
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1. 已翻譯的GB標準英文版（有 SALE
標誌的），以及GB標準中文版，可以直接在網站上購買，在收到您付款後，會在1～3天內發您郵箱。 2. 其他未翻譯的GB標準英文版，在接到您翻譯訂單後，才進行翻譯，時間一般需要多3～5天。 |
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GB 12663-2001 （中英文版） General specifications for burglar-alarm control units |
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GB/T 18500.2-2001 （中英文版） Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC) |
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GB/T 18500.1-2001 （中英文版） Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC) |
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GB/T 18501.2-2001 （中英文版） Connectors for use in d.c.，low-frequency analogue and digital high speed data spplications--Part 2:Circular connectors with assessed quality--Sectional specification |
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GB/T 12853-2001 （中英文版） Blank detail specification for continuous wave magnetrons |
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GB/Z 18462-2001 （中英文版） Laser processing machines--Performance specifications and benchmarks for cutting of metals |
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GB/T 18459-2001 （中英文版） Methods for calculating the main staticperformance specifications of transducers |
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GB/T 18335-2001 （中英文版） Specification for flex-rigid multilayer printed boards with through connections |
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GB/T 18334-2001 （中英文版） Specification for flexible multilayer printed boards with through conections |
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GB/T 18289-2000 （中英文版） General specification of nickel-cadmium battery for cellular phone |
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GB/T 18288-2000 （中英文版） General specification of nickel-metal hydride battery for cellular phone |
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GB/T 4588.12-2000 （中英文版） Specification for mass laminationpanels (semi-manufactured multilayer printed boards) |
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GB/T 17737.2-2000 （中英文版） Radio-frequency cables--Part 2:Sectional specification for semi-rigid radio-frequency and coaxial cables with polytetrafluoroethylene(PTFE) insulation |
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GB/T 6588-2000 （中英文版） Semiconductor devices--Discrete devices--Part 3:Signal(including switching) and regulator diodes--Section One--Blank detail specification for signal diodes，switching diodes and controlled-avalanche diodes |
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GB/T 18237.3-2000 （中英文版） Information technology--Open Systems Interconnection--Generic upper layers security--Part 3:Security Exchange Service Element(SESE) protocol specification |
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GB/T 18034-2000 （中英文版） Specification for the platinum rhodium thermocouple thin wires used in mini-thermocouples |
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GB/T 17970-2000 （中英文版） Information technology--Processing languages--Document Style Semantics and Specification Language(DSSSL) |
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GB/T 17942-2000 （中英文版） Specifications for national triangulation |
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GB/T 5965-2000 （中英文版） Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays) |
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GB/T 17904.2-1999 （中英文版） ISDN user-network interface data link layer specification and conformance testing method--Part 2:Data link layer protocol conformance testing method |
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GB/T 17904.1-1999 （中英文版） ISDN user-network interface data link layer specification and conformance testing method--Part 1:User-network interface data linklayer specification |
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GB/T 13621-1999 （中英文版） Capacity series and radio-frequency channel arrangement and equipment main technical specifications for 100～1000 MHz radio relay communication systems |
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GB/T 17850.3-1999 （中英文版） Preparation of steel substrates before application of paints and related products--Specifications for non-metallic blast-cleaning abrasives--Copper refinery slag |
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GB/T 9404-1999 （中英文版） Technical specifications of feeder systems for microwave-relay communication |
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GB/T 17772-1999 （中英文版） Earth-moving machinery--Laboratory evaluations of protective structures--Specifications for deflection-limiting volume |
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GB 17621-1998 （中英文版） Specification of reservoir operation for large and medium-scale hydropower stations |
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GB/T 17580.1-1998 （中英文版） Information technology--Open systems interconnection--Virtual terminal basic class protocol--Part 1:Specification |
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GB/T 17562.1-1998 （中英文版） Rectangular connectors for frequencies below 3 MHz--Part 1: Generic specification--General requirements and guide for the preparation of detail specifications for connectors with assessed quality |
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GB/T 9424-1998 （中英文版） Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Five:Blank detail specification for complementary MOS digital inte-grated circuits，series 4000B and 4000UB |
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GB/T 7576-1998 （中英文版） Semiconductor devices--Discrete devices--Part 7:Bipolar transistors--Section Four:Blank detail specification for case-rated bipolartransistors for high-frequency amplification |
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