“The procedure specif” 中國GB標準檢索結果 |
1. 已翻譯的GB標準英文版(有 SALE
標誌的),以及GB標準中文版,可以直接在網站上購買,在收到您付款後,會在1~3天內發您郵箱。 2. 其他未翻譯的GB標準英文版,在接到您翻譯訂單後,才進行翻譯,時間一般需要多3~5天。 |
GB/T 11498-2018 半導體器件 積體電路 第21部分:膜積體電路和混合膜積體電路分規範(採用鑒定批准程式)半導體器件 積體電路 第21部分:膜積體電路和混合膜積體電路分規範(採用鑒定批准程式)(中英文版) Semiconductor devices—Integrated circuits—Part 21:Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures |
|||
GB/T 13062-2018 半導體器件 積體電路 第21-1部分:膜積體電路和混合膜積體電路空白詳細規範(採用鑒定批准程式)(中英文版) Semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures |
|||
HG/T 20692-2014 化工企業熱工設計施工圖內容和深度統一規定(中英文版) Specification on content and procedure of detail design of thermal engineering for chemical plant |
|||
HG/T 20560-1997 化工機械化運輸工藝設計施工圖內容和深度規定(中英文版) The process design specification of the detail design content and procedure for chemical bulk materialhanding |
|||
DL/T 1117-2009 核電廠常規島焊接工藝評定規程(中英文版) The specification of welding procedure qualification for Conventional Island of nuclear power station |
|||
GB/T 20111.2-2016 電氣絕緣系統 熱評定規程 第2部分:通用模型的特殊要求 散繞繞組應用(中英文版) Electrical insulation systems—Procedures for thermal evaluation—Part2 : Specific requiremente for general-purpose madels—Wire-wound applications |
|||
GB/T 20111.3-2016 電氣絕緣系統 熱評定規程 第3部分:包封線圈模型的特殊要求 散繞繞組電氣絕緣系統(EIS)(中英文版) Electrical insulation systems—Procedures for thermal evaluation—Part 3: Specific requirements for encapsulated–coil model—Wire–wound electrical insulation system (EIS) |
|||
YD/T 1644.1-2007 手持和身體佩戴使用的無線通訊設備對人體的電磁照射--人體模型、儀器和規程 第1部分:靠近耳邊使用的掌上型無線通訊設備的sar評估規程(頻率範圍300mhz-3ghz)(中英文版) Human exposure to radio frequency fields from hand-held and body-mounted wireless communication devices-Human models, instrumentation, and procedures - Part 1: Procedure to determine the specific absorption rate (SAR) for hand-held devices used in close p |
|||
YD/T 1644.2-2011 手持和身體佩戴使用的無線通訊設備對人體的電磁照射 人體模型、儀器和規程 第2部分:靠近身體使用的無線通訊設備的比吸收率(sar)評估規程(頻率範圍30mhz~6ghz)(中英文版) Human exposure to radio frequency fields from hand-held and body-mounted wireless communication devices-human models, instrumentation, and procedures. Part 2: Procedure to determine the specific absorption rate(SAR) for wireless communication devices used |
|||
YD/T 2855.5-2015 2ghz td-scdma數位蜂窩移動通信網 多載波高速分組接入 uu介面實體層技術要求 第5部分:實體層過程(中英文版) (2GHz TD-SCDMA digital cellular mobile communication network multi-carrier high-speed packet access Uu interface to the physical layer specification - Part 5: Physical layer procedures) |
|||
SJ/Z 9006-1987 電子器件(或部件)規範中逐批檢查與週期檢查程式指南(中英文版) Guide for the inclusion of lot-by-lot and periodic inspection procedures in specifications for electronic components (or parts) |
|||
GB/T 32316-2015 金融租賃服務流程規範(中英文版) The procedure specification of financial leasing services |
|||
GB/T 28446.1-2012 手持和身體佩戴使用的無線通訊設備對人體的電磁照射 人體模型、儀器和規程 第1部分:靠近耳邊使用的掌上型無線通訊設備的SAR評估規程(頻率範圍300MHz~3GHz)(中英文版) Human exposure to radio frequency fields from hand-held and body-mounted wireless communication devices - Human models, instrumentation, and procedures - Part 1: Procedure to determine the specific absorption rate (SAR) for hand-held devices used in close |
|||
GB/T 20111.3-2008 電氣絕緣系統 熱評定規程 第3部分:包封線圈模型的特殊要求 散繞繞組電氣絕緣系統(EIS)(中英文版) Electrical insulation systems - Procedures for thermal evaluation - Part 22: Specific requirements for encapsulated-coil model - Wire-wound electrical insulation system(EIS) |
|||
GB/T 20111.2-2008 電氣絕緣系統 熱評定規程 第2部分:通用模型的特殊要求 散繞繞組應用(中英文版) Electrical insulation systems - Procedures for thermal evaluation - Part 2: Specific requirements for general-purpose models - Wire-wound applications |
|||
GB/T 16466-1996 膜積體電路和混合膜積體電路空白詳細規範(採用能力批准程式)(中英文版) Blank detailspecification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
|||
GB/T 16465-1996 膜積體電路和混合膜積體電路分規範(採用能力批准程式)(中英文版) Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
|||
GB/T 15883-1995 電子設備用膜固定電阻網路 第2部分:按能力批准程式評定品質的膜電阻網路空白詳細規範 評定水準E(中英文版) Fixed film resistor networks for use in electronic equipment--Part 2:Blank detail specification for film resistor networks of assessedquality on the basis of the capability approval procedure--Assessment level E |
|||
GB/T 15882-1995 電子設備用膜固定電阻網路 第2部分:按能力批准程式評定品質的膜電阻網路分規範(中英文版) Fixed film resistor networks for use in electronic equipment--Part 2:Sectional specification for film resistor networks of assessed quality on the basis of the capability approval procedure |
|||
GB/T 14860.4-2012 電子和通信設備用變壓器和電感器 第4部分:按能力批准程式評定品質的開關電源變壓器分規範(中英文版) Transformers and inductors for use in electronic and telecommunication equipment - Part 4: Sectional specification for power transformers for switched mode power supplies (SMPS) on the basis of the capability approval procedure |
|||
GB/T 14860.3-2012 電子和通信設備用變壓器和電感器 第3部分:按能力批准程式評定品質的電源變壓器分規範(中英文版) Transformers and inductors for use in electronic and telecommunication equipment - Part 3:Sectional specification for power transformers on the basis of the capability approval procedure |
|||
GB/T 13062-1991 膜積體電路和混合膜積體電路空白詳細規範(可供認證用)(中英文版) Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure |
|||
GB/T 11498-1989 膜積體電路和混合膜積體電路分規範(採用鑒定批准程式) (可供認證用)(中英文版) Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure |
|||
GB/T 10610-2009 產品幾何技術規範(GPS) 表面結構 輪廓法 評定表面結構的規則和方法(中英文版) Geometrical product specifications(GPS) - Surface texture:Profile method - Rules and procedures for the assessment of surface texture |
|||
GB 14371-2013 危險貨物運輸 爆炸品的認可和分項程式及配裝要求(中英文版) Transport of dangerous goods - Specification on the acceptance and classification procedure and the requirement of compatibility for explosives |
找到:25條目 | [首頁]-[上一頁]-[下一頁]-[尾頁] | 去到: 1 |