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	GB/T 43931-2024 General specifications for microwave integrated circuit chips for aerospace use 宇航用微波集成电路芯片通用规范 - 中英文版
	GB/T 43972-2024 Remote operation and maintenance of integrated circuit packaging equipment - state monitoring 集成电路封装设备远程运维-状态监测 - 中英文版
	GB/T 43748-2024 Microbeam analysis-Transmission electron microscopy-Method for determination of thickness of functional thin film layers in integrated circuit chips 微束分析-透射电子显微术-集成电路芯片中功能薄膜层厚度的测定方法 - 中英文版
	GB/T 43796-2024 Remote operation and maintenance of integrated circuit packaging equipment-Data collection 集成电路封装设备远程运维-数据采集 - 中英文版
	GB/T 43538-2023 Quality technical requirements for integrated circuit metal packaging casing 集成电路金属封装外壳质量技术要求 - 中英文版
	GB/T 43536.2-2023 Three-dimensional integrated circuits Part 2: Calibration requirements for fine-pitch stacked chips 三维集成电路第2部分：微间距叠层芯片的校准要求 - 中英文版
	GB/T 43536.1-2023 Three-dimensional integrated circuits Part 1: Terms and definitions 三维集成电路第1部分：术语和定义 - 中英文版
	GB/T 28511.2-2023 Planar optical waveguide integrated optical circuit devices Part 2: Dense wavelength division multiplexing (DWDM) filters based on arrayed waveguide grating (AWG) technology 平面光波导集成光路器件第2部分：基于阵列波导光栅（AWG）技术的密集波分复用（DWDM）滤波器 - 中英文版
	GB/Z 43510-2023 Guide to Reliability Test Methods for Integrated Circuit TSV Three-Dimensional Packages 集成电路TSV三维封装可靠性试验方法指南 - 中英文版
	GB/T 43228-2023 Design requirements for radiation-hardened integrated circuit unit libraries for aerospace use 宇航用抗辐射加固集成电路单元库设计要求 - 中英文版
	GB/T 43227-2023 Test method for vapor-deposited protective films for inner leads of integrated circuits for aerospace use 宇航用集成电路内引线气相沉积保护膜试验方法 - 中英文版
	GB/T 43226-2023 Single-event soft error time domain testing method for semiconductor integrated circuits used in aerospace applications 宇航用半导体集成电路单粒子软错误时域测试方法 - 中英文版
	GB/T 43035-2023 Semiconductor Devices Integrated Circuits Part 20: General Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits Part 1: Internal Visual Inspection Requirements 半导体器件集成电路第20部分：膜集成电路和混合膜集成电路总规范第一篇：内部目检要求 - 中英文版
	GB/T 43034.3-2023 Integrated circuits - Measurement of pulse immunity - Part 3: Non-synchronous transient injection method 集成电路脉冲抗扰度测量第3部分：非同步瞬态注入法 - 中英文版
	GB/T 42974-2023 Semiconductor Integrated circuit flash memory (FLASH) 半导体集成电路快闪存储器（FLASH） - 中英文版
	GB/T 42968.1-2023 Integrated circuits - Electromagnetic immunity measurements - Part 1: General conditions and definitions 集成电路电磁抗扰度测量第1部分：通用条件和定义 - 中英文版
	GB/T 42848-2023 Semiconductor integrated circuits - Test methods for direct digital frequency synthesizers 半导体集成电路直接数字频率合成器测试方法 - 中英文版
	GB/T 42837-2023 Microwave semiconductor integrated circuit amplifier 微波半导体集成电路放大器 - 中英文版
	GB/T 41325-2022 Low-density crystal primary pit silicon single crystal polishing wafer for integrated circuits 集成电路用低密度晶体原生凹坑硅单晶抛光片 - 中英文版
	GB/T 7092-2021 Outline dimensions of semiconductor integrated circuits 半导体集成电路外形尺寸 - 中英文版
	GB/T 41213-2021 Integrated circuit full automatic die bonder 集成电路用全自动装片机 - 中英文版
	GB/T 40577-2021 Terminology for integrated circuit(IC) manufacturing equipment 集成电路制造设备术语 - 中英文版
	GB/T 39679-2020 Integrated circuit card device for lifts 电梯IC卡装置 - 中英文版
	GB/T 39159-2020 High purity copper alloy target for integrated circuit 集成电路用高纯铜合金靶材 - 中英文版
	GB/T 29271.4-2019 Identification cards—Integrated circuit card programming interfaces—Part 4: Application programming interface (API) administration 识别卡集成电路卡编程接口第4部分：应用编程接口（API）管理 - 中英文版
	GB/T 16649.11-2019 Identification cards—Integrated circuit cards—Part 11: Personal verification through biometric methods 识别卡集成电路卡第11部分：通过生物特征识别方法的身份验证 - 中英文版
	GB/T 29271.6-2019 Identification cards—Integrated circuit card programming interfaces—Part 6: Registration authority procedures for the authentication protocols for interoperability 识别卡集成电路卡编程接口第6部分：实现互操作的鉴别协议的注册管理规程 - 中英文版
	GB/T 37312.1-2019 Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability integrated circuits and discrete semiconductors 航空电子过程管理航空航天、国防及其他高性能应用领域（ADHP）电子元器件第1部分：高可靠集成电路与分立半导体器件通用要求 - 中英文版
	GB/T 11498-2018 Semiconductor devices—Integrated circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序) - 中英文版
	GB/T 13062-2018 Semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21-1部分：膜集成电路和混合膜集成电路空白详细规范(采用鉴定批准程序) - 中英文版
	GB/T 37600.11-2018 National central product classification—Product category core metadata—Part 11：Magnetic stripe card and integrated circuit card 全国主要产品分类-产品类别核心元数据-第11部分：磁卡与集成电路卡 - 中英文版
	GB/T 36474-2018 Semiconductor integrated circuit—Measuring methods for double data rate 3 synchronous dynamic random access memory(DDR3 SDRAM) 半导体集成电路第三代双倍数据速率同步动态随机存储器 (DDR3 SDRAM)测试方法 - 中英文版
	GB/T 36479-2018 Integrated circuits—Test methods for column grid array 集成电路焊柱阵列试验方法 - 中英文版
	GB/T 36477-2018 Semiconductor integrated circuit—Measuring methods for flash memory 半导体集成电路快闪存储器测试方法 - 中英文版
	GB/T 15879.5-2018 Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits 半导体器件的机械标准化第5部分：用于集成电路载带自动焊(TAB)的推荐值 - 中英文版
	GB/T 36614-2018 Integrated circuits—Memory devices pin configuration 集成电路存储器引出端排列 - 中英文版
	GB/T 36600.11-2018 National central product classification—Product category core metadata—Part 11：Magnetic stripe card and integrated circuit card 全国主要产品分类产品类别核心元数据第11部分：磁卡与集成电路卡 - 中英文版
	GB/T 36636-2018 Identification cards—Specification for dual-interface integrated circuit card module 识别卡双界面集成电路卡模块规范 - 中英文版
	GB/T 35007-2018 Semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry 半导体集成电路低电压差分信号电路测试方法 - 中英文版
	GB/T 35006-2018 Semiconductor integrated circuits—Measuring method of level converter 半导体集成电路电平转换器测试方法 - 中英文版
	GB/T 35004-2018 Logic digital integrated circuits—Specification for I/O interface model for integrated circuit 数字集成电路输入/输出电气接口模型规范 - 中英文版
	GB/T 35005-2018 Test methods for flip chip integrated circuits 集成电路倒装焊试验方法 - 中英文版
	GB/T 14028-2018 Semiconductor integrated circuits—Measuring method of analogue switch 半导体集成电路模拟开关测试方法 - 中英文版
	GB/T 4377-2018 Semiconductor integrated circuits—Measuring method of voltage regulators 半导体集成电路电压调整器测试方法 - 中英文版
	GB/T 33140-2016 Phosphorized copper anode used for integrated circuit 集成电路用磷铜阳极 - 中英文版
	GB/T 4023-2015 Semiconductor devices—Discrete devices and integrated circuits— Part 2: Rectifier diodes 半导体器件分立器件和集成电路第2部分：整流二极管 - 中英文版
	GB 51122-2015 Code for design of integrated circuit assembly and test factory 集成电路封装测试厂设计规范 - 中英文版
	GB/T 16525-2015 Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package 半导体集成电路塑料有引线片式载体封装引线框架规范 - 中英文版
	GB/T 15878-2015 Semiconductor integrated circuits—Specification of leadframes for small outline package 半导体集成电路小外形封装引线框架规范 - 中英文版
	GB/T 15876-2015 Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package 半导体集成电路塑料四面引线扁平封装引线框架规范 - 中英文版

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