China Aerospace electronic GB Standards Search Result |
 |
1. Ready translated GB standards
and Chinese version GB Standards, you can purchase directly
in the web page; After receive your payment, we will send
the GB Standards PDF file to your Email within 1~3 days.
2. Other English version GB Standards are not ready translated, only after get your order, then we translate them, time usually need 3-5 days . |
|
GB/Z 41275.23-2023 Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 23: Rework/Repair Guidelines for Lead-Free and Mixed Electronics 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第23部分：无铅及混装电子产品返工/修复指南 - 中英文版 |
 |
|
|
|
GB/Z 41275.22-2023 Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solders Part 22: Technical Guide 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第22部分：技术指南 - 中英文版 |
|
|
|
|
GB/Z 41275.4-2023 Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 4: Ball Grid Array Ball Installation 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第4部分：球栅阵列植球 - 中英文版 |
|
|
|
|
GB/T 41275.3-2022 Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 3: System Performance Test Methods Containing Lead-Free Solder and Lead-Free Pins 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第3部分：含无铅焊料和无铅管脚的系统性能试验方法 - 中英文版 |
|
|
|
|
GB/T 41275.21-2022 Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solders Part 21: Guidelines for Transitioning to Lead-Free Electronics 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第21部分：向无铅电子过渡指南 - 中英文版 |
|
|
|
|
GB/T 41275.2-2022 Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solders Part 2: Reducing the Harmful Effects of Tin 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第2部分：减少锡有害影响 - 中英文版 |
|
|
|
|
GB/T 39342-2020 Aerospace electronic products—General specification for printed circuit board 宇航电子产品 印制电路板总规范 - 中英文版 |
|
|
|
|
GB/T 39340-2020 Aerospace electronic time deterministic network protocol 宇航电子时间确定性网络协议 - 中英文版 |
|
|
|
|
GB/T 38342-2019 Aerospace electronic product—Assembling requirements of printed circuit board assembly 宇航电子产品 印制板组装件组装要求 - 中英文版 |
|
|
|
|
GB/T 37312.1-2019 Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability integrated circuits and discrete semiconductors 航空电子过程管理 航空航天、国防及其他高性能应用领域（ADHP）电子元器件 第1部分：高可靠集成电路与分立半导体器件通用要求 - 中英文版 |
|
|
|
|
GB/T 32304-2015 Electrostatic discharge protection requirements for Aerospace electronic products 航天电子产品静电防护要求 - 中英文版 |
|
| Find out:11Items | To Page of: First -Previous-Next -Last | 1 |
+86-755-2583-1330
