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GB/T 36477-2018 Semiconductor integrated circuit—Measuring methods for flash memory 半导体集成电路 快闪存储器测试方法 - 中英文版 |
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GB/T 15879.5-2018 Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits 半导体器件的机械标准化 第5部分：用于集成电路载带自动焊(TAB)的推荐值 - 中英文版 |
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GB/T 36614-2018 Integrated circuits—Memory devices pin configuration 集成电路 存储器引出端排列 - 中英文版 |
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GB/T 36600.11-2018 National central product classification—Product category core metadata—Part 11：Magnetic stripe card and Integrated circuit Card 全国主要产品分类 产品类别核心元数据 第11部分：磁卡与集成电路卡 - 中英文版 |
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GB/T 36636-2018 Identification cards—Specification for dual-interface Integrated circuit Card module 识别卡 双界面集成电路卡模块规范 - 中英文版 |
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GB/T 35007-2018 Semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry 半导体集成电路 低电压差分信号电路测试方法 - 中英文版 |
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GB/T 35006-2018 Semiconductor integrated circuits—Measuring method of level converter 半导体集成电路 电平转换器测试方法 - 中英文版 |
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GB/T 35004-2018 Logic digital integrated circuits—Specification for I/O interface model for integrated circuit 数字集成电路 输入/输出电气接口模型规范 - 中英文版 |
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GB/T 35005-2018 Test methods for flip chip integrated circuits 集成电路倒装焊试验方法 - 中英文版 |
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GB/T 14028-2018 Semiconductor integrated circuits—Measuring method of analogue switch 半导体集成电路 模拟开关测试方法 - 中英文版 |
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GB/T 4377-2018 Semiconductor integrated circuits—Measuring method of voltage regulators 半导体集成电路 电压调整器测试方法 - 中英文版 |
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GB/T 33140-2016 Phosphorized copper anode used for integrated circuit 集成电路用磷铜阳极 - 中英文版 |
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GB/T 4023-2015 Semiconductor devices—Discrete devices and integrated circuits— Part 2: Rectifier diodes 半导体器件 分立器件和集成电路 第2部分：整流二极管 - 中英文版 |
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GB 51122-2015 Code for design of integrated circuit assembly and test factory 集成电路封装测试厂设计规范 - 中英文版 |
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GB/T 16525-2015 Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package 半导体集成电路 塑料有引线片式载体封装引线框架规范 - 中英文版 |
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GB/T 15878-2015 Semiconductor integrated circuits—Specification of leadframes for small outline package 半导体集成电路 小外形封装引线框架规范 - 中英文版 |
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GB/T 15876-2015 Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package 半导体集成电路 塑料四面引线扁平封装引线框架规范 - 中英文版 |
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GB/T 14112-2015 Semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP 半导体集成电路 塑料双列封装冲制型引线框架规范 - 中英文版 |
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GB/T 29271.3-2014 Identification cards—Integrated circuit Card programming interfaces—Part 3: Application interface 识别卡 集成电路卡编程接口 第3部分：应用接口 - 中英文版 |
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GB/T 30962-2014 Identification cards―Integrated circuit Cards―High capacity cards 识别卡 集成电路卡 大容量卡 - 中英文版 |
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GB/T 15877-2013 Semiconductor integrated circuits—Specification of DIP leadframes produced by etching 半导体集成电路 蚀刻型双列封装引线框架规范 - 中英文版 |
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GB/T 16649.13-2013 Identification cards - Integrated circuit Cards - Part 13: Commands for application management in a multi-application environment 识别卡 集成电路卡 第13部分：在多应用环境中的应用管理命令 - 中英文版 |
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GB/T 14620-2013 Alumina ceramic substrates for thin film integrated circuits 薄膜集成电路用氧化铝陶瓷基片 - 中英文版 |
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GB/T 14619-2013 Alumina ceramic substrates for thick film integrated circuits 厚膜集成电路用氧化铝陶瓷基片 - 中英文版 |
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GB/T 29271.2-2012 Identification card - Integrated circuit Card programming interfaces - Part 2: Generic card interface 识别卡 集成电路卡编程接口 第2部分：通用卡接口 - 中英文版 |
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GB/T 29271.1-2012 Identification cards - Integrated circuit Card programming interfaces - Part 1: Architecture 识别卡 集成电路卡编程接口 第1部分：体系结构 - 中英文版 |
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GB 50809-2012 Code for design of silicon integrated circuits wafer fab 硅集成电路芯片工厂设计规范 - 中英文版 |
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GB/T 28511.2-2012 Integrated optical path devices based on planar lightwave circuit - Part 2 ：DWDM filter based on AWG technology 平面光波导集成光路器件 第2部分：基于阵列波导光栅（AWG）技术的密集波分复用（DWDM）滤波器 - 中英文版 |
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GB/T 28511.1-2012 Integrated optical path devices based on planar lightwave circuit - Part 1：Optical power splitter based on PLC technology 平面光波导集成光路器件 第1部分：基于平面光波导（PLC）的光功率分路器 - 中英文版 |
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GB/T 15157.12-2011 Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits 频率低于3MHz的印制板连接器 第12部分：集成电路插座的尺寸、一般要求和试验方法详细规范 - 中英文版 |
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GB/T 22351.2-2010 Identification cards - Contactless integrated circuit(s) cards - Vicinity cards - Part2: Air interface and initialization 识别卡 无触点的集成电路卡 邻近式卡 第2部分：空中接口和初始化 - 中英文版 |
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GB/T 16649.9-2010 Identification cards - Integrated circuit Cards - Part 9: Commands for card management 识别卡 集成电路卡 第9部分：用于卡管理的命令 - 中英文版 |
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GB/T 16649.4-2010 Identification Cards - Integrated circuit Cards - Part 4: Organization, security and commands for interchange 识别卡 集成电路卡 第4部分：用于交换的结构、安全和命令 - 中英文版 |
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GB/T 16649.15-2010 Identification cards - Integrated circuit Cards - Part 15: Cryptographic information application 识别卡 集成电路卡 第15部分：密码信息应用 - 中英文版 |
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GB/T 16649.12-2010 Identification cards - Integrated circuit Cards - Part 12: Cards with contacts - USB electrical interface and operating procedures 识别卡 集成电路卡 第12部分：带触点的卡-USB电气接口和操作规程 - 中英文版 |
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GB/T 22351.3-2008 Identification cards - Contactless integrated circuit(s) IC cards - Vicinity cards - Part 3: Anticollision and transmission protocol 识别卡 无触点的集成电路卡 邻近式卡 第3部分：防冲突和传输协议 - 中英文版 |
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GB/T 22351.1-2008 Identification cards - Contactless integrated circuit(s) cards - Vicinity cards - Part 1: Physical characteristics 识别卡 无触点的集成电路卡 邻近式卡 第1部分：物理特性 - 中英文版 |
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GB/T 20870.1-2007 Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers 半导体器件 第16-1部分：微波集成电路 放大器 - 中英文版 |
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GB/T 17574.9-2006 Semiconductor devices - Integrated circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories 半导体器件 集成电路 第2-9部分：数字集成电路 紫外光擦除电可编程MOS只读存储器空白详细规范 - 中英文版 |
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GB/T 17574.20-2006 Semiconductor devices - Integrated circuits - Part 2-20：Digital integrated circuits - Family specification - Low voltage integrated circuits 半导体器件 集成电路 第2-20部分：数字集成电路 低压集成电路族规范 - 中英文版 |
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GB/T 17574.11-2006 Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory 半导体器件 集成电路 第2-11部分：数字集成电路 单电源集成电路电可擦可编程只读存储器 空白详细规范 - 中英文版 |
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GB/T 4589.1-2006 Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits 半导体器件 第10部分：分立器件和集成电路总规范 - 中英文版 |
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GB/T 20515-2006 Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits 半导体器件 集成电路 第5部分：半定制集成电路 - 中英文版 |
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GB/T 16790.7-2006 Financial transaction cards - Security architecture of financial transaction systems using Integrated circuit Cards - Part 7: Key management 金融交易卡 使用集成电路卡的金融交易系统的安全体系 第7部分：密钥管理 - 中英文版 |
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GB/T 16790.6-2006 Financial transaction cards - Security architecture of financial transaction systems using Integrated circuit Cards - Part 6: Cardholder verification 金融交易卡 使用集成电路卡的金融交易系统的安全体系 第6部分：持卡人身份验证 - 中英文版 |
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GB/T 16790.5-2006 Financial transaction cards - Security architecture of financial transaction systems using Integrated circuit Cards - Part 5: Use of algorithms 金融交易卡 使用集成电路卡的金融交易系统的安全体系 第5部分：算法应用 - 中英文版 |
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GB/T 12750-2006 Semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits 半导体器件 集成电路 第11部分：半导体集成电路分规范(不包括混合电路) - 中英文版 |
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GB/T 17554.3-2006 Identification cards - Test methods Part 3: Integrated circuit(s) cards with contacts and related interface devices 识别卡 测试方法 第3部分:带触点的集成电路卡及其相关接口设备 - 中英文版 |
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GB/T 16649.3-2006 Identification cards - Integrated circuit(s) cards with contacts - Part 3: Electronic signals and transmission protocols 识别卡 带触点的集成电路卡 第3部分:电信号和传输协议 - 中英文版 |
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GB/T 16649.2-2006 Identification cards - Integrated circuit(s) cards with contacts - Part 2: Dimensions and location of the contacts 识别卡 带触点的集成电路卡 第2部分:触点的尺寸和位置 - 中英文版 |
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