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	GB/T 14112-2015 Semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP 半导体集成电路塑料双列封装冲制型引线框架规范 - 中英文版
	GB/T 29271.3-2014 Identification cards—Integrated circuit card programming interfaces—Part 3: Application interface 识别卡集成电路卡编程接口第3部分：应用接口 - 中英文版
	GB/T 30962-2014 Identification cards―Integrated circuit cards―High capacity cards 识别卡集成电路卡大容量卡 - 中英文版
	GB/T 15877-2013 Semiconductor integrated circuits—Specification of DIP leadframes produced by etching 半导体集成电路蚀刻型双列封装引线框架规范 - 中英文版
	GB/T 16649.13-2013 Identification cards - Integrated circuit cards - Part 13: Commands for application management in a multi-application environment 识别卡集成电路卡第13部分：在多应用环境中的应用管理命令 - 中英文版
	GB/T 14620-2013 Alumina ceramic substrates for thin film integrated circuits 薄膜集成电路用氧化铝陶瓷基片 - 中英文版
	GB/T 14619-2013 Alumina ceramic substrates for thick film integrated circuits 厚膜集成电路用氧化铝陶瓷基片 - 中英文版
	GB/T 29271.2-2012 Identification card - Integrated circuit card programming interfaces - Part 2: Generic card interface 识别卡集成电路卡编程接口第2部分：通用卡接口 - 中英文版
	GB/T 29271.1-2012 Identification cards - Integrated circuit card programming interfaces - Part 1: Architecture 识别卡集成电路卡编程接口第1部分：体系结构 - 中英文版
	GB 50809-2012 Code for design of silicon integrated circuits wafer fab 硅集成电路芯片工厂设计规范 - 中英文版
	GB/T 28511.2-2012 Integrated optical path devices based on planar lightwave circuit - Part 2 ：DWDM filter based on AWG technology 平面光波导集成光路器件第2部分：基于阵列波导光栅（AWG）技术的密集波分复用（DWDM）滤波器 - 中英文版
	GB/T 15157.12-2011 Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits 频率低于3MHz的印制板连接器第12部分：集成电路插座的尺寸、一般要求和试验方法详细规范 - 中英文版
	GB/T 22351.2-2010 Identification cards - Contactless integrated circuit(s) cards - Vicinity cards - Part2: Air interface and initialization 识别卡无触点的集成电路卡邻近式卡第2部分：空中接口和初始化 - 中英文版
	GB/T 16649.9-2010 Identification cards - Integrated circuit cards - Part 9: Commands for card management 识别卡集成电路卡第9部分：用于卡管理的命令 - 中英文版
	GB/T 16649.4-2010 Identification Cards - Integrated circuit cards - Part 4: Organization, security and commands for interchange 识别卡集成电路卡第4部分：用于交换的结构、安全和命令 - 中英文版
	GB/T 16649.15-2010 Identification cards - Integrated circuit cards - Part 15: Cryptographic information application 识别卡集成电路卡第15部分：密码信息应用 - 中英文版
	GB/T 16649.12-2010 Identification cards - Integrated circuit cards - Part 12: Cards with contacts - USB electrical interface and operating procedures 识别卡集成电路卡第12部分：带触点的卡-USB电气接口和操作规程 - 中英文版
	GB/T 22351.3-2008 Identification cards - Contactless integrated circuit(s) IC cards - Vicinity cards - Part 3: Anticollision and transmission protocol 识别卡无触点的集成电路卡邻近式卡第3部分：防冲突和传输协议 - 中英文版
	GB/T 22351.1-2008 Identification cards - Contactless integrated circuit(s) cards - Vicinity cards - Part 1: Physical characteristics 识别卡无触点的集成电路卡邻近式卡第1部分：物理特性 - 中英文版
	GB/T 20870.1-2007 Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers 半导体器件第16-1部分：微波集成电路放大器 - 中英文版
	GB/T 17574.9-2006 Semiconductor devices - Integrated circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories 半导体器件集成电路第2-9部分：数字集成电路紫外光擦除电可编程MOS只读存储器空白详细规范 - 中英文版
	GB/T 17574.20-2006 Semiconductor devices - Integrated circuits - Part 2-20：Digital integrated circuits - Family specification - Low voltage integrated circuits 半导体器件集成电路第2-20部分：数字集成电路低压集成电路族规范 - 中英文版
	GB/T 17574.11-2006 Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory 半导体器件集成电路第2-11部分：数字集成电路单电源集成电路电可擦可编程只读存储器空白详细规范 - 中英文版
	GB/T 4589.1-2006 Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits 半导体器件第10部分：分立器件和集成电路总规范 - 中英文版
	GB/T 16790.7-2006 Financial transaction cards - Security architecture of financial transaction systems using integrated circuit cards - Part 7: Key management 金融交易卡使用集成电路卡的金融交易系统的安全体系第7部分：密钥管理 - 中英文版
	GB/T 16790.6-2006 Financial transaction cards - Security architecture of financial transaction systems using integrated circuit cards - Part 6: Cardholder verification 金融交易卡使用集成电路卡的金融交易系统的安全体系第6部分：持卡人身份验证 - 中英文版
	GB/T 16790.5-2006 Financial transaction cards - Security architecture of financial transaction systems using integrated circuit cards - Part 5: Use of algorithms 金融交易卡使用集成电路卡的金融交易系统的安全体系第5部分：算法应用 - 中英文版
	GB/T 12750-2006 Semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits 半导体器件集成电路第11部分：半导体集成电路分规范(不包括混合电路) - 中英文版
	GB/T 17554.3-2006 Identification cards - Test methods Part 3: Integrated circuit(s) cards with contacts and related interface devices 识别卡测试方法第3部分:带触点的集成电路卡及其相关接口设备 - 中英文版
	GB/T 16649.3-2006 Identification cards - Integrated circuit(s) cards with contacts - Part 3: Electronic signals and transmission protocols 识别卡带触点的集成电路卡第3部分:电信号和传输协议 - 中英文版
	GB/T 16649.2-2006 Identification cards - Integrated circuit(s) cards with contacts - Part 2: Dimensions and location of the contacts 识别卡带触点的集成电路卡第2部分:触点的尺寸和位置 - 中英文版
	GB/T 16649.1-2006 Identification cards - Integrated circuit(s) cards with contacts - Part 1: Physical characteristics 识别卡带触点的集成电路卡第1部分:物理特性 - 中英文版
	GB/T 19558-2004 General specifications for integrated circuit(IC)card payphone and system 集成电路(IC)卡公用付费电话系统总技术要求 - 中英文版
	GB/T 19403.1-2003 Semiconductor devices--Integrated circuits--Part 11:Section 1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits) 半导体器件集成电路第11部分:第1篇:半导体集成电路内部目检 (不包括混合电路) - 中英文版
	GB/T 17574.10-2003 Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories 半导体器件集成电路第2-10部分:数字集成电路集成电路动态读/写存储器空白详细规范 - 中英文版
	GB/T 16649.5-2002 Identification cards--Integrated circuit(s) cards with contacts--Part 5:National numbering system and registration procedure for application identifiers 识别卡带触点的集成电路卡第5部分:应用标识符的国家编号体系和注册规程 - 中英文版
	GB/T 18500.2-2001 Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC) 半导体器件集成电路第4部分:接口集成电路第二篇:线性模拟/数字转换器(ADC)空白详细规范 - 中英文版
	GB/T 18500.1-2001 Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC) 半导体器件集成电路第4部分:接口集成电路第一篇:线性数字/模拟转换器(DAC)空白详细规范 - 中英文版
	GB/T 18392-2001 Norm of integrated circuit(IC) card of certificate of identity code for organizations institutions and enterprises of the People’s Republic of China 中华人民共和国组织机构代码证集成电路(IC)卡技术规范 - 中英文版
	GB/T 16649.6-2001 Identification cards--Integrated circuit(s) cards with contacts--Part 6:Interindustrv data elements 识别卡带触点的集成电路卡第6部分:行业间数据元 - 中英文版
	GB/T 16649.7-2000 Identification cards--Integrated circuit(s) cards with contacts--Part 7:Interindustry commands for Structured Card Query Language(SCQL) 识别卡带触点的集成电路卡第7部分:用于结构化卡查询语言(SCQL)的行业间命令 - 中英文版
	GB/T 18239-2000 Generic specification for integrated circuit card reader 集成电路(IC)卡读写机通用规范 - 中英文版
	GB/T 5965-2000 Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays) 半导体器件集成电路第2部分:数字集成电路第一篇双极型单片数字集成电路门电路(不包括自由逻辑阵列) 空白详细规范 - 中英文版
	GB/T 17801-1999 Interface betweendata terminal equipment(DTE) and data circuit-terminating equipment (DCE) for terminals operating in the packet mode and accessing a packet switched public data network through a public switched telephone network or an integrated service 经公用交换电话网或综合业务数字网或电路交换公用数据网接入分组交换公用数据网的分组式数据终端设备(DTE)和数据电路终接设备(DCE)之间的接口 - 中英文版
	GB/T 9424-1998 Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Five:Blank detail specification for complementary MOS digital inte-grated circuits，series 4000B and 4000UB 半导体器件集成电路第2部分:数字集成电路第五篇 CMOS数字集成电路4000B和4000UB系列空白详细规范 - 中英文版
	GB/T 17572-1998 Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Four:Family specification for complementary MOS digital integrated circuits，series 4000B and 4000UB 半导体器件集成电路第2部分:数字集成电路第四篇 CMOS数字集成电路 4000B和4000UB系列族规范 - 中英文版
	GB/T 4023-1997 Semiconductor devices--Discrete devices and integrated circuits--Part 2:Rectifier diodes 半导体器件分立器件和集成电路第2部分:整流二极管 - 中英文版
	GB/T 17024-1997 Semiconductor devices--integratedcircuits--Part 2:Digital integrated circuits--Section three--Blank detail specification for HCMOS digital integrated circuits series 54/74HC，54/74HCT，54/74HCU 半导体器件集成电路第2部分:数字集成电路第三篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列空白详细规范 - 中英文版
	GB/T 17023-1997 Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section two--Family specification for HCMOS digital integrated circuits series 54/74HC，54/74HCT，54/74HCU 半导体器件集成电路第2部分:数字集成电路第二篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列族规范 - 中英文版
	GB/T 16878-1997 Specification for metrology pattern cells for integrated circuit manufacture 用于集成电路制造技术的检测图形单元规范 - 中英文版

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