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GB/T 16791.1-1997 Financial transaction cards--Messages between the integrated circuit card and the card accepting device--Part 1:Concepts and structures 金融交易卡 集成电路卡与卡接受设备之间的报文 第1部分:概念与结构 - 中英文版 |
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GB/T 16790.1-1997 Financial transaction cards--Security architecture of financial transaction systems using integrated circuit cards--Part 1:Card life cycle 金融交易卡 使用集成电路卡的金融交易系统的安全结构 第1部分:卡的生命周期 - 中英文版 |
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GB/T 8976-1996 Generic specification for film integrated circuits and hybrid film integrated circuits 膜集成电路和混合膜集成电路总规范 - 中英文版 |
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GB/T 6798-1996 Semiconductor integrated circuits--General principles of measuring methods of voltage comparators 半导体集成电路 电压比较器测试方法的基本原理 - 中英文版 |
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GB/T 4377-1996 Semiconductor integrated circuits--General principles of measuring methods of voltage regulator 半导体集成电路 电压调整器测试方法的基本原理 - 中英文版 |
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GB/T 3436-1996 Semiconductor integrated circuits--Series and products of operational amplifier 半导体集成电路 运算放大器系列和品种 - 中英文版 |
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GB/T 16466-1996 Blank detailspecification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures 膜集成电路和混合膜集成电路空白详细规范(采用能力批准程序) - 中英文版 |
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GB/T 16465-1996 Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures 膜集成电路和混合膜集成电路分规范(采用能力批准程序) - 中英文版 |
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GB/T 15879-1995 Mechanical standardization of semiconductor devices--Part 5:Recommendations applying to tape automated bonding (TAB) of integrated circuits 半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值 - 中英文版 |
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GB/T 4376-1994 Series and products of voltage regulators for semi-conductor integrated circuits 半导体集成电路 电压调整器系列和品种 - 中英文版 |
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GB/T 15138-1994 Case outlines for film integrated circuits and hybrid integrated circuits 膜集成电路和混合集成电路外形尺寸 - 中英文版 |
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GB/T 15136-1994 General principles of measuring methods for quartz clock and watch circuits of semiconductor integrated circuits 半导体集成电路石英钟表电路测试方法的基本原理 - 中英文版 |
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GB/T 14862-1993 Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits 半导体集成电路封装结到外壳热阻测试方法 - 中英文版 |
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GB/T 14129-1993 Series and productsfor TTL semiconductor integrated circuits--Products of series PAL 半导体集成电路TTL电路系列和品种 PAL系列的品种 - 中英文版 |
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GB/T 7092-1993 Outline dimensions of semiconductor integratedcircuits 半导体集成电路外形尺寸 - 中英文版 |
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GB/T 14115-1993 General principles of measuring methods of Sample/Hold amplifiers for semiconductor integrated circuits 半导体集成电路采样/保持放大器测试方法的基本原理 - 中英文版 |
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GB/T 14114-1993 General principles of measuring methods of V/F and F/V converters for semiconductor integrated circuits 半导体集成电路电压/频率和频率/电压转换器测试方法的基本原理 - 中英文版 |
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GB/T 14032-1992 General principles of measuring methods of digital phase-locked loop for semiconductor integrated circuits 半导体集成电路数字锁相环测试方法的基本原理 - 中英文版 |
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GB/T 14031-1992 General principles of measuring methods of analogue phase-loop for semiconductor integrated circuits 半导体集成电路模拟锁相环测试方法的基本原理 - 中英文版 |
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GB/T 14030-1992 General principles of measuring methods of timer circuits for semiconductor integrated circuits 半导体集成电路时基电路测试方法的基本原理 - 中英文版 |
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GB/T 14029-1992 General principles of measuring methods of analogue multiplier for semiconductor integrated circuits 半导体集成电路模拟乘法器测试方法的基本原理 - 中英文版 |
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GB/T 14028-1992 General principles of measuring methods of analogue switches for semiconductor integrated circuits 半导体集成电路模拟开关测试方法的基本原理 - 中英文版 |
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GB/T 13062-1991 Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure 膜集成电路和混合膜集成电路空白详细规范(可供认证用) - 中英文版 |
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GB/T 12842-1991 Terminology for film integrated circuits and hybrid film integrated circuits 膜集成电路和混合膜集成电路术语 - 中英文版 |
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GB/T 3430-1989 The rule of type designation for semiconductor integrated circuits 半导体集成电路型号命名方法 - 中英文版 |
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GB/T 11498-1989 Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure 膜集成电路和混合膜集成电路分规范(采用鉴定批准程序) (可供认证用) - 中英文版 |
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GB/T 9178-1988 Terminology for integrated circuits 集成电路术语 - 中英文版 |
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GB/T 7619-1987 Electrical characteristics for balanced double-current interchange circuits for general use with integrated circuit equipment in the field of datacommunications 在数据通信领域中通常同集成电路设备一起使用的平衡双流接口电路的电气特性 - 中英文版 |
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GB/T 7509-1987 Blank detail specification for microprocessor semiconductor integrated circuits 半导体集成电路微处理器空白详细规范 (可供认证用) - 中英文版 |
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GB/T 3431.2-1986 Letter symbols for semiconductor integrated circuits--Letter symbols for function of pins 半导体集成电路文字符号 引出端功能符号 - 中英文版 |
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