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GB/T 15879.604-2023 Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages 半导体器件的机械标准化 第6-4部分：表面安装半导体器件封装外形图绘制的一般规则 焊球阵列（BGA）封装的尺寸测量方法 - 中英文版 |
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GB/T 40204-2021 General rules of two dimensional barcodes for traceability 追溯二维码技术通则 - 中英文版 |
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GB/T 15006-2009 General rules of dimensions，shape,surface quality, test method and inspection for elastic alloys 弹性合金的尺寸、外形、表面质量、试验方法和检验规则的一般规定 - 中英文版 |
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GB/T 14985-2007 General rules of dimensions, shape, surface, quality, testing method and inspection for expansion alloys 膨胀合金尺寸、外形、表面质量、试验方法和检验规则的一般规定 - 中英文版 |
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GB/T 12985-1991 General rules of using percentiles of the body dimensions for products design 在产品设计中应用人体尺寸百分位数的通则 - 中英文版 |
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