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GB/T 42897-2023 Microelectromechanical systems (MEMS) technology Silicon-based MEMS nano-thickness film tensile strength test method 微机电系统（MEMS）技术 硅基MEMS纳米厚度膜抗拉强度试验方法 - 中英文版 |
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GB/T 32815-2016 Silicon-based MEMS fabrication technology—Specification for criterion of the bulk silicon piezoresistance process 硅基MEMS制造技术 体硅压阻加工工艺规范 - 中英文版 |
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GB/T 32814-2016 Silicon-based MEMS fabrication technology—Specification for criterion of the SOI wafer based MEMS process 硅基MEMS制造技术 基于SOI硅片的MEMS工艺规范 - 中英文版 |
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GB/T 32816-2016 Silicon-based MEMS fabrication technology—Specification for criterion of the combination of the deep etching and bonding process 硅基MEMS制造技术 以深刻蚀与键合为核心的工艺集成规范 - 中英文版 |
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GB/T 28277-2012 Silicon-based MEMS fabrication technology - Measurement method of cutting and pull-press strength of micro bonding area 硅基MEMS制造技术 微键合区剪切和拉压强度检测方法 - 中英文版 |
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GB/T 28276-2012 Silicon-based MEMS fabrication technology - Specification for the dissolved wafer process 硅基MEMS制造技术 体硅溶片工艺规范 - 中英文版 |
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GB/T 28275-2012 Silicon-based MEMS fabrication technology - Specification for KOH etch process 硅基MEMS制造技术 氢氧化钾腐蚀工艺规范 - 中英文版 |
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GB/T 28274-2012 Silicon-based MEMS fabrication technology - The basic regulation of layout design 硅基MEMS制造技术 版图设计基本规则 - 中英文版 |
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