China Heat sink of semicon GB Standards Search Result |
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GB/T 8446.2-2022 Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop - 英文版 |
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GB/T 8446.2-2004 Heat sink for power semiconductor device--Part 2:Measuring method of thermal resistance and inputfluid-output fluid pressure difference - 英文版 |
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GB/T 7423.3-1987 Heat sink of semiconductor devices--Heat sink， staggered fingers shapes - 英文版 |
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GB/T 7423.2-1987 Heat sink of semiconductor devices--Heat sink，extruded shapes - 英文版 |
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GB/T 7423.1-1987 Heat sink of semiconductor devices--Generic specification - 英文版 |
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