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GB/T 8446.2-2022 Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop 电力半导体器件用散热器 第2部分:热阻和流阻测量方法 - 英文版 |
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GB/T 8446.2-2004 Heat sink for power semiconductor device--Part 2:Measuring method of thermal resistance and inputfluid-output fluid pressure difference 电力半导体器件用散热器 第2部分:热阻和流阻测试方法 - 英文版 |
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GB/T 7423.3-1987 Heat sink of semiconductor devices--Heat sink, staggered fingers shapes 半导体器件散热器 叉指形散热器 - 英文版 |
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GB/T 7423.2-1987 Heat sink of semiconductor devices--Heat sink,extruded shapes 半导体器件散热器 型材散热器 - 英文版 |
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GB/T 7423.1-1987 Heat sink of semiconductor devices--Generic specification 半导体器件散热器 通用技术条件 - 英文版 |
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