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GB/T 43493.3-2023 Semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 3: Photoluminescence detection method of defects - 英文版 |
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GB/T 43493.2-2023 Semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 2: Optical detection methods for defects - 英文版 |
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GB/T 43493.1-2023 Semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 1: Defect classification - 英文版 |
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GB/T 43366-2023 General specification for semiconductor discrete devices for aerospace applications - 英文版 |
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GB/T 4937.26-2023 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) susceptibility testing Human Body Model (HBM) - 英文版 |
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GB/T 4587-2023 Semiconductor devices Discrete Devices Part 7: Bipolar Transistors - 英文版 |
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GB/T 43035-2023 Semiconductor devices Integrated Circuits Part 20: General Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits Part 1: Internal Visual Inspection Requirements - 英文版 |
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GB/T 20870.5-2023 Semiconductor devices Part 16-5: Microwave integrated circuits Oscillators - 英文版 |
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GB/T 20870.2-2023 Semiconductor devices Part 16-2: Microwave integrated circuits Prescalers - 英文版 |
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GB/T 20870.10-2023 Semiconductor devices Part 16-10: Monolithic Microwave Integrated Circuit Technology Acceptable Procedures - 英文版 |
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GB/T 15651.6-2023 Semiconductor devices Part 5-6: Optoelectronic devices Light emitting diodes - 英文版 |
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GB/T 42709.19-2023 Semiconductor devices Microelectronic mechanical devices Part 19: Electronic compass - 英文版 |
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GB/T 4937.23-2023 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life - 英文版 |
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GB/T 4937.27-2023 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) susceptibility test - Machine model (MM) - 英文版 |
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GB/T 4937.32-2023 Semiconductor devices - Methods of mechanical and climatic tests - Part 32: Flammability of plastic encapsulated devices (externally induced) - 英文版 |
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GB/T 4937.31-2023 Semiconductor devices - Methods of mechanical and climatic tests - Part 31: Flammability of plastic encapsulated devices (internal origin) - 英文版 |
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GB/T 42706.5-2023 Electronic components - Long term storage of Semiconductor devices - Part 5: Chips and wafers - 英文版 |
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GB/T 42706.2-2023 Electronic components - Long-term storage of Semiconductor devices - Part 2: Degradation mechanisms - 英文版 |
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GB/T 42706.1-2023 Electronic components - Long term storage of Semiconductor devices - Part 1: General - 英文版 |
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GB/T 15879.604-2023 Mechanical standardization of Semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages - 英文版 |
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GB/T 4937.42-2023 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage - 英文版 |
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GB/T 42709.7-2023 Semiconductor devices Microelectromechanical devices Part 7: MEMS bulk acoustic wave filters and duplexers for radio frequency control and selection - 英文版 |
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GB/T 42709.5-2023 Semiconductor devices Microelectromechanical devices Part 5: RF MEMS switches - 英文版 |
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GB/T 8446.3-2022 Heat sinks for power Semiconductor devices—Part 3: Insulators and fasteners - 英文版 |
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GB/T 8446.2-2022 Heat sinks for power Semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop - 英文版 |
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GB/T 8446.1-2022 Heat sinks for power Semiconductor devices—Part 1: Radiators - 英文版 |
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GB/T 41852-2022 Semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures - 英文版 |
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GB/T 41853-2022 Semiconductor devices MEMS devices Wafer-to-wafer bond strength measurement - 英文版 |
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GB/T 15879.4-2019 Mechanical standardization of Semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages - 英文版 |
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GB/T 11498-2018 Semiconductor devices—Integrated circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures - 英文版 |
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