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GB/T 4937.35-2024 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy of plastic encapsulated electronic components 半导体器件-机械和气候试验方法-第35部分：塑封电子元器件的声学显微镜检查 - 英文版 |
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GB/T 4937.32-2023 Semiconductor devices - Methods of mechanical and climatic tests - Part 32: Flammability of plastic encapsulated devices (externally induced) 半导体器件 机械和气候试验方法 第32部分：塑封器件的易燃性（外部引起的） - 英文版 |
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GB/T 4937.31-2023 Semiconductor devices - Methods of mechanical and climatic tests - Part 31: Flammability of plastic encapsulated devices (internal origin) 半导体器件 机械和气候试验方法 第31部分：塑封器件的易燃性（内部引起的） - 英文版 |
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GB/T 41852-2022 Semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures 半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法 - 英文版 |
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GB/T 1550-2018 Test methods for conductivity type of extrinsic semiconducting materials 非本征半导体材料导电类型测试方法 - 英文版 |
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GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity） 半导体器件 机械和气候试验方法 第14部分：引出端强度（引线牢固性） - 英文版 |
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GB/T 4937.201-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat 半导体器件 机械和气候试验方法 第20-1部分：对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输 - 英文版 |
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GB/T 4937.20-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat 半导体器件 机械和气候试验方法 第20部分：塑封表面安装器件耐潮湿和焊接热综合影响 - 英文版 |
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GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing 半导体器件 机械和气候试验方法 第30部分：非密封表面安装器件在可靠性试验前的预处理 - 英文版 |
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GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method 半导体器件 机械和气候试验方法 第11部分：快速温度变化 双液槽法 - 英文版 |
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GB/T 31359-2015 Test methods of semiconductor lasers 半导体激光器测试方法 - 英文版 |
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GB/T 6616-2009 Test methods for measuring resistivity of semiconductor wafers or sheet resistance of semiconductor films with a noncontact eddy-current gauge 半导体硅片电阻率及硅薄膜薄层电阻测试方法 非接触涡流法 - 英文版 |
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GB/T 1555-2009 Testing methods for determining the orientation of a semiconductor single crystal 半导体单晶晶向测定方法 - 英文版 |
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GB/T 3048.3-2007 Test methods for electrical properties of electric cables and wires - Part 3：Test of volume resistivity of semi-conducting rubbers and plastics 电线电缆电性能试验方法 第3部分：半导电橡塑材料体积电阻率试验 - 英文版 |
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GB/T 14862-1993 Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits 半导体集成电路封装结到外壳热阻测试方法 - 英文版 |
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