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GB/T 15879.604-2023 Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages 半导体器件的机械标准化 第6-4部分:表面安装半导体器件封装外形图绘制的一般规则 焊球阵列(BGA)封装的尺寸测量方法 - 英文版 |
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GB/T 5273-2016 Dimensional standardisation of terminals for high-voltage apparatus 高压电器端子尺寸标准化 - 英文版 |
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GB/T 26498-2011 Industrial automation systems and integration - Physical device control - Dimensional Measuring Interface Standard (DMIS) 工业自动化系统与集成 物理设备控制 尺寸测量接口标准(DMIS) - 英文版 |
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