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GB/T 42907-2023 Testing of non-equilibrium carrier recombination lifetime in silicon ingots, silicon blocks and silicon wafers Non-contact eddy current induction method - 英文版 |
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GB/T 6616-2023 Testing of semiconductor wafer resistivity and semiconductor film sheet resistance non-contact eddy current method - 英文版 |
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GB/T 39789-2021 Non-destructive testing of welds—Eddy current-video integrated testing method of metal composites weld - 英文版 |
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GB/T 32791-2016 Electromagnetic (Eddy-Current) examination method for electrical conductivity of copper and copper alloys - 英文版 |
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GB/T 31554-2015 Non-magnetic metallic coatings on metallic and non-metallic basismaterials—Measurement of coating thickness—Phase-sensitive eddy-current method - 英文版 |
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GB/T 29997-2013 Eddy current testing method of copper and copper-alloys rods, bars and wires - 英文版 |
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GB/T 5126-2013 Eddy current inspection method for cold drawn thin wall tubes of aluminum and aluminum alloy - 英文版 |
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GB/T 6616-2009 Test methods for measuring resistivity of semiconductor wafers or sheet resistance of semiconductor films with a noncontact eddy-current gauge - 英文版 |
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GB/T 23601-2009 Method of eddy current testing for titanium and titanium alloy bars and wires - 英文版 |
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GB/T 12969.2-2007 Method of eddy current inspection for titanium and titanium alloy tubes - 英文版 |
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GB/T 12968-1991 Eddy current decay method formeasurement of resistivity and residual resistance ratio of pure metals - 英文版 |
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