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	GB/T 12273.501-2012 Quartz crystal units A specification in the quality assessment system for electronic components Part 5.1: Blank detail specification- qualification approval - 英文版
	GB/T 5967-2011 Fixed capacitors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed capacitor of ceramic dielectric,Class 1 - Assessment level EZ - 英文版
	GB/T 10191-2011 Fixed capacitors for use in electronic equipment - Part 16-1: Blank detail specification：Fixed metallized polypropylene film dielectric d.c.capacitors - Assessment levels E and EZ - 英文版
	GB/T 18910.22-2008 Liquid crystal display devices Part 2-2: Matrix colour LCD modules-Blank detail specification - 英文版
	GB/T 21040-2007 Fixed capacitors for in electronic equipment - Part 22-1: Blank detail specification: Fixed surface mount multiplayer capacitors of ceramic dielectric,class2 - Assessment level EZ - 英文版
	GB/T 21039.1-2007 Semiconductor devices - Discrete devices - Part 4-1: Microwave diodes and transistors - Microwave field effect transistors - Blank detail specification - 英文版
	GB/T 21038-2007 Fixed capacitors for use in electronic equipment - Part 21-1: Blank detail specification: Fixed surface mount multilayer capacitors of ceramic dielectric,class 1 - Assessment level EZ - 英文版
	GB/T 18910.21-2007 Liquid crystal and solid-state display devices - part 2-1: Passive matrix monochrome LCD modules - Blank detail specification - 英文版
	GB/T 18015.41-2007 Multicore and symmetrical pair/quad cables for digital communications - Part 41: Riser cables - Blank detail specification - 英文版
	GB/T 18015.31-2007 Multicore and symmetrical pair/quad cables for digital communications - Part 31: Work area wiring - Blank detail specification - 英文版
	GB/T 18015.21-2007 Multicore and symmetrical pair/quad cables for digital communications - Part 21: Horizontal floor wiring - Blank detail specification - 英文版
	GB/T 17574.9-2006 Semiconductor devices - Integrated circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories - 英文版
	GB/T 17574.11-2006 Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory - 英文版
	GB/T 16514.2-2005 Electromechanical switches for use in electronic equipment Part 5:Sectional specification for pushbutton switches Section 1-Blank detail specification - 英文版
	GB/T 13151-2005 Semiconductor devices Discrete devices Part 6:Thyristors Section Three-Blank detail specification for reverse blocking triode thyristors,ambient and case-rated,for currents greater than 100A - 英文版
	GB/T 13150-2005 Semiconductor devices Discret devices Blank detail specification for bidirectional triode thyristors(triacs),ambient and case-rated,for currents greater than 100A - 英文版
	GB/T 18496.2-2005 Electromechanical switches for use in electronic equipment Part 4-1:Sectional specification for lever(toggle)switches Blank detail specification - 英文版
	GB/T 7214-2003 Fixed capacitors for use in electronic equipment--Part 15-3:Blank detail specification--Fixed tantalum capacitors with solid electrolyte and porous anode--Assessment level E - 英文版
	GB/T 5994-2003 Fixed capacitors for use in electronic equipment--Part 4-1:Blank detail specification--Auminium electrolytic capacitors with non-solid electrolyte--Assessment level E - 英文版
	GB/T 17574.10-2003 Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories - 英文版
	GB/T 7154.4-2003 Thermistors--Directly heated positive step-function temperature coefficient--Part 1-4: Blank detail specification--Sensing application--Assessment level EZ - 英文版
	GB/T 7154.3-2003 Thermistors--Directly heated positive step-function temperature coefficient--Part 1-3: Blank detail specification--Inrush current application--Assessment level EZ - 英文版
	GB/T 7154.2-2003 Thermistors--Directly heated positive step-function temperature coefficient--Part 1-2: Blank detail specification--Heating element application--Assessment level EZ - 英文版
	GB/T 18904.5-2003 Semiconductor devices--Part 12-5: Optoelectronic devices--Blank detail specification for pin-photodiodes with/without pigtail，for fibre optic systems or subsystems - 英文版
	GB/T 7154.1-2003 Thermistors--Directly heated positive step-function temperature coefficient--Part 1-1:Blank detail specification for current limiting application--Assessment level EZ - 英文版
	GB/T 6589-2002 Semiconductordevices--Discrete devices--Part 3-2:Signal (including switching) and regulator diodes--Blank detail specification for voltage-regulator diodes and voltage-reference diodes (excluding temperature-compensated precision reference diodes) - 英文版
	GB/T 18917-2002 Blank detail specification for the colour projection picture tubes - 英文版
	GB/T 18904.4-2002 Semiconductor devices--Part 12-4:Optoelectronicdevices--Blank detail specification for pin-FET modules with/without pigtailfor fiber optic systems or sub-systems - 英文版
	GB/T 18904.3-2002 Semiconductor devices--Part 12-3:Optoelectronic devices--Blank detail specification for light-emitting diodes--Display application - 英文版
	GB/T 18904.2-2002 Semiconductor devices--Part 12-2:Optoelectronic devices--Blank detail specification for laser diodes modules with pigtail for fiber optic systems or sub-systems - 英文版

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