China Integrated circuit i GB Standards Search Result |
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2. Other English version GB Standards are not ready translated, only after get your order, then we translate them, time usually need 3-5 days . |
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GB/T 42839-2023 Semiconductor integrated circuit Analog-to-digital (AD) converter - 英文版 |
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GB/T 42838-2023 Semiconductor integrated circuit Hall circuit test method - 英文版 |
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GB/T 42837-2023 Microwave semiconductor integrated circuit amplifier - 英文版 |
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GB/T 42836-2023 Microwave semiconductor integrated circuit mixer - 英文版 |
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GB/T 42835-2023 Semiconductor integrated circuit system on chip (SoC) - 英文版 |
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GB/T 41325-2022 Low-density crystal primary pit silicon single crystal polishing wafer for integrated circuits - 英文版 |
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GB/T 7092-2021 Outline dimensions of semiconductor integrated circuits - 英文版 |
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GB/T 41213-2021 Integrated circuit full automatic die bonder - 英文版 |
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GB/T 40577-2021 Terminology for integrated circuit(IC) manufacturing equipment - 英文版 |
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GB/T 39679-2020 Integrated circuit card device for lifts - 英文版 |
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GB/T 39159-2020 High purity copper alloy target for integrated circuit - 英文版 |
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GB/T 29271.4-2019 Identification cards—Integrated circuit card programming interfaces—Part 4: Application programming interface (API) administration - 英文版 |
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GB/T 16649.11-2019 Identification cards—Integrated circuit cards—Part 11: Personal verification through biometric methods - 英文版 |
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GB/T 29271.6-2019 Identification cards—Integrated circuit card programming interfaces—Part 6: Registration authority procedures for the authentication protocols for interoperability - 英文版 |
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GB/T 37312.1-2019 Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability integrated circuits and discrete semiconductors - 英文版 |
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GB/T 11498-2018 Semiconductor devices—Integrated circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures - 英文版 |
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GB/T 13062-2018 Semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures - 英文版 |
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GB/T 37600.11-2018 National central product classification—Product category core metadata—Part 11：Magnetic stripe card and integrated circuit card - 英文版 |
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GB/T 36474-2018 Semiconductor integrated circuit—Measuring methods for double data rate 3 synchronous dynamic random access memory(DDR3 SDRAM) - 英文版 |
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GB/T 36479-2018 Integrated circuits—Test methods for column grid array - 英文版 |
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GB/T 36477-2018 Semiconductor integrated circuit—Measuring methods for flash memory - 英文版 |
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GB/T 15879.5-2018 Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits - 英文版 |
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GB/T 36614-2018 Integrated circuits—Memory devices pin configuration - 英文版 |
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GB/T 36600.11-2018 National central product classification—Product category core metadata—Part 11：Magnetic stripe card and integrated circuit card - 英文版 |
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GB/T 36636-2018 Identification cards—Specification for dual-interface integrated circuit card module - 英文版 |
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GB/T 35007-2018 Semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry - 英文版 |
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GB/T 35006-2018 Semiconductor integrated circuits—Measuring method of level converter - 英文版 |
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GB/T 35004-2018 Logic digital integrated circuits—Specification for I/O interface model for integrated circuit - 英文版 |
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GB/T 35005-2018 Test methods for flip chip integrated circuits - 英文版 |
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GB/T 14028-2018 Semiconductor integrated circuits—Measuring method of analogue switch - 英文版 |
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