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GB/T 17574.11-2006
Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory
- 英文版
GB/T 4589.1-2006
Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
- 英文版
GB/T 20520-2006
Information security technology - Public key infrastructure - Time stamp specification
- 英文版
GB/T 20519-2006
Information security technology - Public key infrastructures - Privilege Management Center technical specification
- 英文版
GB/T 12750-2006
Semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- 英文版
GB 20262-2006
Safety specifications of regulators for welding, cutting and the similar processes
- 英文版
GB/T 8567-2006
Specification for computer software documentation
- 英文版
GB/T 9061-2006
General specifications for metal-cutting machine tools
- 英文版
GB/T 19771-2005
Information technology-Security technology-Public key infrastructure-Minimum interoperability specification for PKI components
- 英文版
GB/T 13151-2005
Semiconductor devices Discrete devices Part 6:Thyristors Section Three-Blank detail specification for reverse blocking triode thyristors,ambient and case-rated,for currents greater than 100A
- 英文版
GB/T 13150-2005
Semiconductor devices Discret devices Blank detail specification for bidirectional triode thyristors(triacs),ambient and case-rated,for currents greater than 100A
- 英文版
GB/T 19667.2-2005
Specification for the structure of electronic official document based on XML--Part 2:Document body
- 英文版
GB/T 19667.1-2005
Specification for the structure of electronic official document based on XML--Part 1:General principles
- 英文版
GB/T 19558-2004
General specifications for integrated circuit(IC)card payphone and system
- 英文版
GB/T 19526-2004
Technical specifications for prevention and cure of sheep parasitosis
- 英文版
GB/T 17574.10-2003
Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories
- 英文版
GB/T 18237.4-2003
Information technology--Open systems interconnection--Generic upper layers security--Part 4: Protecting transfer syntax specification
- 英文版
GB 12664-2003
General specification for portable X-ray security inspection equipment
- 英文版
GB/T 6160-2003
Micrographics--First generation silver-gelatin microforms of source documents--Density specifications and method of measurement
- 英文版
GB/T 7154.1-2003
Thermistors--Directly heated positive step-function temperature coefficient--Part 1-1:Blank detail Specification for Current limiting application--Assessment level EZ
- 英文版
GB/T 2820.7-2002
Reciprocating internal combustion engine driven alternating current generating sets--Part 7:Technical declarations for specification and design
- 英文版
GB/T 18500.2-2001
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC)
- 英文版
GB/T 18500.1-2001
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC)
- 英文版
GB/T 18501.2-2001
Connectors for use in d.c.,low-frequency analogue and digital high speed data spplications--Part 2:Circular connectors with assessed quality--Sectional specification
- 英文版
GB 5294-2001
Specifications of individual monitoring for occupational exposure--Individual monitoring for external exposure
- 英文版
GB/Z 18462-2001
Laser processing machines--Performance specifications and benchmarks for cutting of metals
- 英文版
GB/T 18459-2001
Methods for calculating the main staticperformance specifications of transducers
- 英文版
GB/T 6082-2001
The general technical specifications for spurshaper cutters
- 英文版
GB/T 18239-2000
Generic specification for integrated circuit card reader
- 英文版
GB/T 18237.3-2000
Information technology--Open Systems Interconnection--Generic upper layers security--Part 3:Security Exchange Service Element(SESE) protocol specification
- 英文版

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