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GB/T 17574.11-2006 Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory - 英文版 |
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GB/T 4589.1-2006 Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits - 英文版 |
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GB/T 20520-2006 Information security technology - Public key infrastructure - Time stamp specification - 英文版 |
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GB/T 20519-2006 Information security technology - Public key infrastructures - Privilege Management Center technical specification - 英文版 |
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GB/T 12750-2006 Semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits - 英文版 |
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GB 20262-2006 Safety specifications of regulators for welding, cutting and the similar processes - 英文版 |
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GB/T 8567-2006 Specification for computer software documentation - 英文版 |
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GB/T 9061-2006 General specifications for metal-cutting machine tools - 英文版 |
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GB/T 19771-2005 Information technology-Security technology-Public key infrastructure-Minimum interoperability specification for PKI components - 英文版 |
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GB/T 13151-2005 Semiconductor devices Discrete devices Part 6:Thyristors Section Three-Blank detail specification for reverse blocking triode thyristors,ambient and case-rated,for currents greater than 100A - 英文版 |
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GB/T 13150-2005 Semiconductor devices Discret devices Blank detail specification for bidirectional triode thyristors(triacs),ambient and case-rated,for currents greater than 100A - 英文版 |
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GB/T 19667.2-2005 Specification for the structure of electronic official document based on XML--Part 2:Document body - 英文版 |
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GB/T 19667.1-2005 Specification for the structure of electronic official document based on XML--Part 1:General principles - 英文版 |
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GB/T 19558-2004 General specifications for integrated circuit(IC)card payphone and system - 英文版 |
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GB/T 19526-2004 Technical specifications for prevention and cure of sheep parasitosis - 英文版 |
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GB/T 17574.10-2003 Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories - 英文版 |
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GB/T 18237.4-2003 Information technology--Open systems interconnection--Generic upper layers security--Part 4: Protecting transfer syntax specification - 英文版 |
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GB 12664-2003 General specification for portable X-ray security inspection equipment - 英文版 |
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GB/T 6160-2003 Micrographics--First generation silver-gelatin microforms of source documents--Density specifications and method of measurement - 英文版 |
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GB/T 7154.1-2003 Thermistors--Directly heated positive step-function temperature coefficient--Part 1-1:Blank detail Specification for Current limiting application--Assessment level EZ - 英文版 |
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GB/T 2820.7-2002 Reciprocating internal combustion engine driven alternating current generating sets--Part 7:Technical declarations for specification and design - 英文版 |
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GB/T 18500.2-2001 Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC) - 英文版 |
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GB/T 18500.1-2001 Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC) - 英文版 |
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GB/T 18501.2-2001 Connectors for use in d.c.,low-frequency analogue and digital high speed data spplications--Part 2:Circular connectors with assessed quality--Sectional specification - 英文版 |
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GB 5294-2001 Specifications of individual monitoring for occupational exposure--Individual monitoring for external exposure - 英文版 |
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GB/Z 18462-2001 Laser processing machines--Performance specifications and benchmarks for cutting of metals - 英文版 |
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GB/T 18459-2001 Methods for calculating the main staticperformance specifications of transducers - 英文版 |
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GB/T 6082-2001 The general technical specifications for spurshaper cutters - 英文版 |
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GB/T 18239-2000 Generic specification for integrated circuit card reader - 英文版 |
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GB/T 18237.3-2000 Information technology--Open Systems Interconnection--Generic upper layers security--Part 3:Security Exchange Service Element(SESE) protocol specification - 英文版 |
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