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GB/T 19247.2-2003 Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies 印制板组装 第2部分: 分规范 表面安装焊接组装的要求 - 英文版 |
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GB/T 19247.1-2003 Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies 印制板组装 第1部分:通用规范 采用表面安装和相关组装技术的电子和电气焊接组装的要求 - 英文版 |
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GB/T 15329.1-2003 Rubber hosesand hose assemblies--Textile-reinforced hydraulic types--Specification--Part 1: Oil-based fluid applications 橡胶软管及软管组合件 织物增强液压型 第1部分:油基流体用 - 英文版 |
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GB 19157-2003 General specification for remote-controlled fire monitor systems 远控消防炮系统通用技术条件 - 英文版 |
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GB 15629.11-2003 Information technology--Telecommunications and information exchange between systems--Local and metropolitan area networks--Specific requirements--Part 11: Wireless LAN Medium Access Control (MAC) andPhysical Layer(PHY) Specifications 信息技术 系统间远程通信和信息交换 局域网和城域网 特定要求 第11部分:无线局域网媒体访问控制和物理层规范 - 英文版 |
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GB 15629.1102-2003 Information technology--Telecommunications and information exchange between systems--Local and metropolitan area networks--Specific requirements--Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer(PHY) Specifications: Higher-Speed Physi 信息技术 系统间远程通信和信息交换局域网和城域网 特定要求 第11部分:无线局域网媒体访问控制和物理层规范:2.4 GHz频段较高速物理层扩展规范 - 英文版 |
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GB/T 16857.4-2003 Geometrical Product Specifications(GPS)--Acceptance andreverification tests for coordinate measuring machines(CMM)--Part 4: CMMs used in scanning measuring mode 产品几何量技术规范(GPS) 坐标测量机的验收检测和复检检测 第4部分: 在扫描模式下使用的坐标测量机 - 英文版 |
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GB/T 7154.1-2003 Thermistors--Directly heated positive step-function temperature coefficient--Part 1-1:Blank detail specification for current limiting application--Assessment level EZ 直热式阶跃型正温度系数热敏电阻器 第1-1部分:限流用空白详细规范 评定水平EZ - 英文版 |
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GB/T 6589-2002 Semiconductordevices--Discrete devices--Part 3-2:Signal (including switching) and regulator diodes--Blank detail specification for voltage-regulator diodes and voltage-reference diodes (excluding temperature-compensated precision reference diodes) 半导体器件 分立器件 第3-2部分:信号(包括开关)和调整二极管 电压调整二极管和电压基准二极管(不包括温度补偿精密基准二极管) 空白详细规范 - 英文版 |
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GB/T 18909-2002 Sectional specification for high-frequency inductors and intermediate frequency transformers for use in electronic equipment for capability approval 按能力批准评定质量的电子设备用高频电感器和中频变压器分规范 - 英文版 |
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GB/T 18904.1-2002 Semiconductor devices--Part 12-1:Optoelectronic devices--Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fiber optic systems or sub-systems 半导体器件 第12-1部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的光发射或红外发射二极管空白详细规范 - 英文版 |
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GB/T 15157.7-2002 Connectors for frequencies below 3MHz for use with printed boards--Part 7:Detail specification for connectors，8-way，including fixed and free connectors with common mating features，with assessed quality 频率低于3 MHz的印制板连接器 第7部分:有质量评定的具有通用插合特性的8位固定和自由连接器详细规范 - 英文版 |
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GB/T 12668.1-2002 Adjustable speed electrical power drive systems--Part 1:General requirements--Rating specifications for low voltage adjustable speed d.c. power drive systems 调速电气传动系统 第1部分:一般要求 低压直流调速电气传动系统 额定值的规定 - 英文版 |
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GB/T 18838.1-2002 Preparation of steel substrates before application of paints and related products--Specifications for metallic blast-cleaning abrasives--General introduction and classification 涂覆涂料前钢材表面处理 喷射清理用金属磨料的技术要求 导则和分类 - 英文版 |
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GB/T 17850.1-2002 Preparation of steel substrates before application of paints and related products--Specifications for non-metallic blast-cleaning abrasives--General introductionand classification 涂覆涂料前钢材表面处理 喷射清理用非金属磨料的技术要求 导则和分类 - 英文版 |
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GB/T 12668.2-2002 Adjustable speed electrical power drive systems--Part 2:General requirements--Rating specifications for low voltage adjustable frequency a.c. power drive systems 调速电气传动系统 第2部分:一般要求 低压交流变频电气传动系统额定值的规定 - 英文版 |
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GB/T 1303.2-2002 Specification for industrial rigid laminated sheetsbased on thermosetting resins for electrical purposes--Part 3:Specifications for individual materials--Sheet 3:Requirements for rigid laminated sheets based onmelamine resins 电气用热固性树脂工业硬质层压板规范 第3部分:单项材料规范 第3篇:对三聚氰胺树脂硬质层压板的要求 - 英文版 |
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GB/T 18569.1-2001 Safety of machinery--Reduction of risks to health from hazardous substances emitted by machinery--Part 1:Principles and specifications for machinery manufacturers 机械安全 减小由机械排放的危害性物质对健康的风险 第1部分:用于机械制造商的原则和规范 - 英文版 |
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GB/T 18500.2-2001 Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC) 半导体器件 集成电路 第4部分:接口集成电路 第二篇:线性模拟/数字转换器(ADC)空白详细规范 - 英文版 |
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GB/T 18500.1-2001 Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC) 半导体器件 集成电路 第4部分:接口集成电路 第一篇:线性数字/模拟转换器(DAC)空白详细规范 - 英文版 |
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GB/T 18501.2-2001 Connectors for use in d.c.，low-frequency analogue and digital high speed data spplications--Part 2:Circular connectors with assessed quality--Sectional specification 直流和低频模拟及数字式高速数据处理设备用连接器 第2部分:有质量评定的圆形连接器分规范 - 英文版 |
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GB/T 18501.1-2001 Connectors with assessed quality，for use in d.c.，low frequency analogue and in digital high speed data applications--Part 1:Generic specification 有质量评定的直流和低频模拟及数字式高速数据处理设备用连接器 第1部分:总规范 - 英文版 |
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GB/T 6255-2001 General specification for space-charge controlled tubes 空间电荷控制电子管总规范 - 英文版 |
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GB/T 18343-2001 Specification for automobile disk brakes being overhauled 汽车盘式制动器修理技术条件 - 英文版 |
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GB/T 18338.1-2001 Business machines duplicators--Minimum information to be included in specification sheets 办公机械 速印机规格表中应包含的基本内容 - 英文版 |
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GB/T 18335-2001 Specification for flex-rigid multilayer printed boards with through connections 有贯穿连接的刚挠多层印制板规范 - 英文版 |
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GB/T 18334-2001 Specification for flexible multilayer printed boards with through conections 有贯穿连接的挠性多层印制板规范 - 英文版 |
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GB/T 18275.2-2000 Specifications for automobile braking transmission device being overhauled--Hydraulic braking 汽车制动传动装置修理技术条件 液压制动 - 英文版 |
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GB/T 18275.1-2000 Specifications for automobile braking transmission device being overhauled--Air braking 汽车制动传动装置修理技术条件 气压制动 - 英文版 |
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GB/T 18274-2000 Technical specifications for motor vehicle drum brake being overhauled 汽车鼓式制动器修理技术条件 - 英文版 |
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GB/T 4588.12-2000 Specification for mass laminationpanels (semi-manufactured multilayer printed boards) 预制内层层压板规范(半制成多层印制板) - 英文版 |
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GB/T 18262-2000 General specifications for wood-based panel mach-inery 人造板机械通用技术条件 - 英文版 |
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GB/T 6588-2000 Semiconductor devices--Discrete devices--Part 3:Signal(including switching) and regulator diodes--Section One--Blank detail specification for signal diodes，switching diodes and controlled-avalanche diodes 半导体器件 分立器件 第3部分:信号(包括开关)和调整二极管 第1篇 信号二极管、开关二极管和可控雪崩二极管空白详细规范 - 英文版 |
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GB/T 18239-2000 Generic specification for integrated circuit card reader 集成电路(IC)卡读写机通用规范 - 英文版 |
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GB/T 18236.1-2000 Information technology--Telecommunications and information exchange between systems--Local and metropolitan area networks--Common specifications--Part 1:Medium Access Control(MAC)service definition 信息技术 系统间远程通信和信息交换 局域网和城域网 公共规范 第1部分:媒体访问控制(MAC)服务定义 - 英文版 |
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GB 18196-2000 Specifications of the medical examinations for the overexposed individuals 过量受照人员的医学检查规范 - 英文版 |
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GB/T 18034-2000 Specification for the platinum rhodium thermocouple thin wires used in mini-thermocouples 微型热电偶用铂铑细偶丝规范 - 英文版 |
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GB/T 17986.2-2000 Specifications for estate surveying--Unit 2:Specifications for symbols of estated map 房产测量规范 第2单元:房产图图式 - 英文版 |
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GB/T 5965-2000 Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays) 半导体器件 集成电路 第2部分:数字集成电路 第一篇 双极型单片数字集成电路门电路(不包括自由逻辑阵列) 空白详细规范 - 英文版 |
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GB/T 17906-1999 General specification for hydraulically operated rescue tools 液压破拆工具通用技术条件 - 英文版 |
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GB/T 17880.6-1999 Specifications for riveted nuts 铆螺母技术条件 - 英文版 |
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GB/T 17850.3-1999 Preparation of steel substrates before application of paints and related products--Specifications for non-metallic blast-cleaning abrasives--Copper refinery slag 涂覆涂料前钢材表面处理 喷射清理用非金属磨料的技术要求 铜精炼渣 - 英文版 |
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GB/T 9404-1999 Technical specifications of feeder systems for microwave-relay communication 微波接力通信馈线系统技术条件 - 英文版 |
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GB 17621-1998 Specification of reservoir operation for large and medium-scale hydropower stations 大中型水电站水库调度规范 - 英文版 |
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GB/T 17562.1-1998 Rectangular connectors for frequencies below 3 MHz--Part 1: Generic specification--General requirements and guide for the preparation of detail specifications for connectors with assessed quality 频率低于3 MHz的矩形连接器 第1部分 总规范 一般要求和编制有质量评定要求的连接器详细规范的导则 - 英文版 |
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GB/T 9424-1998 Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Five:Blank detail specification for complementary MOS digital inte-grated circuits，series 4000B and 4000UB 半导体器件 集成电路 第2部分:数字集成电路 第五篇 CMOS数字集成电路4000B和4000UB系列空白详细规范 - 英文版 |
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GB/T 7576-1998 Semiconductor devices--Discrete devices--Part 7:Bipolar transistors--Section Four:Blank detail specification for case-rated bipolartransistors for high-frequency amplification 半导体器件 分立器件 第7部分:双极型晶体管 第四篇 高频放大管壳额定双极型晶体管空白详细规范 - 英文版 |
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GB/T 6590-1998 Semiconductor devices--Discrete devices--Part6:Thyristors--Section Two:Blank detail specification for bidirectional triode thyristors(triacs)，ambient or case-rated，up to 100A 半导体器件 分立器件 第6部分:闸流晶体管 第二篇 100A以下环境或管壳额定的双向三极闸流晶体管空白详细规范 - 英文版 |
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GB/T 6352-1998 Semiconductor devices--Discrete devices--Part 6:Thyristors--Section One:Blank detail specification for reverse blocking triode thyristors，ambient or case-rated，up to 100A 半导体器件 分立器件 第6部分:闸流晶体管 第一篇 100A以下环境或管壳额定反向阻断三极闸流晶体管空白详细规范 - 英文版 |
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GB/T 6351-1998 Semiconductor devices--Discrete devices--Part 2:Rectifier diodes--Section One:Blank detail specification for rectifier diodes(including avalanche recti fier diodes)，ambient and case-rated，up to 100A 半导体器件 分立器件 第2部分:整流二极管 第一篇 100A以下环境或管壳额定整流二极管(包括雪崩整流二极管)空白详细规范 - 英文版 |
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