China Specification for mi GB Standards Search Result |
 |
1. Ready translated GB standards  and Chinese version GB Standards, you can purchase directly in the web page; After receive your payment, we will send the GB Standards PDF file to your Email within
1~3 days.
2. Other English version GB Standards are not ready translated, only after get your order, then we translate them, time usually need 3-5 days . |
|
GB/T 5994-2003 Fixed capacitors for use in electronic equipment--Part 4-1:Blank detail specification--Auminium electrolytic capacitors with non-solid electrolyte--Assessment level E - 英文版 |
 |
|
|
|
GB/T 5993-2003 Fixed capacitors for use in electronic equipment--Part 4:Sectional specification--Aluminium electrolytic capacitors with solid and non-solid electrolyte - 英文版 |
|
|
|
|
GB/T 19247.4-2003 Printed board assemblies--Part 4:Sectional specification--Requirements for terminal soldered assemblies - 英文版 |
|
|
|
|
GB/T 17574.10-2003 Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories - 英文版 |
|
|
|
|
GB/T 6850-2003 Cinematography--Labelling of containers for raw-stock motion-picture films and magnetic films--Minimum information specifications - 英文版 |
|
|
|
|
GB/T 6160-2003 Micrographics--First generation silver-gelatin microforms of source documents--Density specifications and method of measurement - 英文版 |
|
|
|
|
GB/T 18904.5-2003 Semiconductor devices--Part 12-5: Optoelectronic devices--Blank detail specification for pin-photodiodes with/without pigtail，for fibre optic systems or subsystems - 英文版 |
|
|
|
|
GB/T 7154.1-2003 Thermistors--Directly heated positive step-function temperature coefficient--Part 1-1:Blank detail specification for current limiting application--Assessment level EZ - 英文版 |
|
|
|
|
GB/T 6589-2002 Semiconductordevices--Discrete devices--Part 3-2:Signal (including switching) and regulator diodes--Blank detail specification for voltage-regulator diodes and voltage-reference diodes (excluding temperature-compensated precision reference diodes) - 英文版 |
|
|
|
|
GB/T 18904.4-2002 Semiconductor devices--Part 12-4:Optoelectronicdevices--Blank detail specification for pin-FET modules with/without pigtailfor fiber optic systems or sub-systems - 英文版 |
|
|
|
|
GB/T 18904.3-2002 Semiconductor devices--Part 12-3:Optoelectronic devices--Blank detail specification for light-emitting diodes--Display application - 英文版 |
|
|
|
|
GB/T 18904.2-2002 Semiconductor devices--Part 12-2:Optoelectronic devices--Blank detail specification for laser diodes modules with pigtail for fiber optic systems or sub-systems - 英文版 |
|
|
|
|
GB/T 18904.1-2002 Semiconductor devices--Part 12-1:Optoelectronic devices--Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fiber optic systems or sub-systems - 英文版 |
|
|
|
|
GB/T 1303.2-2002 Specification for industrial rigid laminated sheetsbased on thermosetting resins for electrical purposes--Part 3:Specifications for individual materials--Sheet 3:Requirements for rigid laminated sheets based onmelamine resins - 英文版 |
|
|
|
|
GB/T 18569.1-2001 Safety of machinery--Reduction of risks to health from hazardous substances emitted by machinery--Part 1:Principles and specifications for machinery manufacturers - 英文版 |
|
|
|
|
GB/T 18500.2-2001 Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC) - 英文版 |
|
|
|
|
GB/T 18500.1-2001 Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC) - 英文版 |
|
|
|
|
GB/T 18341-2001 Specifications of survey for geological and mineral resources exploration - 英文版 |
|
|
|
|
GB/T 18338.1-2001 Business machines duplicators--Minimum information to be included in specification sheets - 英文版 |
|
|
|
|
GB/T 18289-2000 General specification of nickel-cadmium battery for cellular phone - 英文版 |
|
|
|
|
GB/T 18275.2-2000 Specifications for automobile braking transmission device being overhauled--Hydraulic braking - 英文版 |
|
|
|
|
GB/T 18275.1-2000 Specifications for automobile braking transmission device being overhauled--Air braking - 英文版 |
|
|
|
|
GB/T 4588.12-2000 Specification for mass laminationpanels (semi-manufactured multilayer printed boards) - 英文版 |
|
|
|
|
GB/T 17737.2-2000 Radio-frequency cables--Part 2:Sectional specification for semi-rigid radio-frequency and coaxial cables with polytetrafluoroethylene(PTFE) insulation - 英文版 |
|
|
|
|
GB/T 6588-2000 Semiconductor devices--Discrete devices--Part 3:Signal(including switching) and regulator diodes--Section One--Blank detail specification for signal diodes，switching diodes and controlled-avalanche diodes - 英文版 |
|
|
|
|
GB/T 9813-2000 Generic Specification for microcomputers - 英文版 |
|
|
|
|
GB 18196-2000 Specifications of the medical examinations for the overexposed individuals - 英文版 |
|
|
|
|
GB/T 18049-2000 Moderate thermal environments--Determination of the PMV and PPD indices and specification of the conditions for thermal comfort - 英文版 |
|
|
|
|
GB/T 18034-2000 Specification for the platinum rhodium thermocouple thin wires used in mini-thermocouples - 英文版 |
|
|
|
|
GB/T 5965-2000 Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays) - 英文版 |
|
| Find out:609Items | To Page of: First -Previous-Next -Last | [12] [13] [14] [15] [16] [17] [18] |
+86-755-2583-1330
