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2. Other English version GB Standards are not ready translated, only after get your order, then we translate them, time usually need 3-5 days . |
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GB/T 4377-2018 Semiconductor integrated circuits—Measuring method of voltage regulators - 英文版 |
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GB/T 33140-2016 Phosphorized copper anode used for integrated circuit - 英文版 |
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GB/T 4023-2015 Semiconductor devices—Discrete devices and integrated circuits— Part 2: Rectifier diodes - 英文版 |
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GB 51122-2015 Code for design of integrated circuit assembly and test factory - 英文版 |
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GB/T 16525-2015 Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package - 英文版 |
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GB/T 15878-2015 Semiconductor integrated circuits—Specification of leadframes for small outline package - 英文版 |
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GB/T 15876-2015 Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package - 英文版 |
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GB/T 14112-2015 Semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP - 英文版 |
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GB/T 29271.3-2014 Identification cards—Integrated circuit card programming interfaces—Part 3: Application interface - 英文版 |
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GB/T 30962-2014 Identification cards―Integrated circuit cards―High capacity cards - 英文版 |
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GB/T 15877-2013 Semiconductor integrated circuits—Specification of DIP leadframes produced by etching - 英文版 |
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GB/T 16649.13-2013 Identification cards - Integrated circuit cards - Part 13: Commands for application management in a multi-application environment - 英文版 |
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GB/T 14620-2013 Alumina ceramic substrates for thin film integrated circuits - 英文版 |
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GB/T 14619-2013 Alumina ceramic substrates for thick film integrated circuits - 英文版 |
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GB/T 29271.2-2012 Identification card - Integrated circuit card programming interfaces - Part 2: Generic card interface - 英文版 |
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GB/T 29271.1-2012 Identification cards - Integrated circuit card programming interfaces - Part 1: Architecture - 英文版 |
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GB 50809-2012 Code for design of silicon integrated circuits wafer fab - 英文版 |
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GB/T 28511.2-2012 Integrated optical path devices based on planar lightwave circuit - Part 2 ：DWDM filter based on AWG technology - 英文版 |
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GB/T 28511.1-2012 Integrated optical path devices based on planar lightwave circuit - Part 1：Optical power splitter based on PLC technology - 英文版 |
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GB/T 15157.12-2011 Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits - 英文版 |
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GB/T 22351.2-2010 Identification cards - Contactless integrated circuit(s) cards - Vicinity cards - Part2: Air interface and initialization - 英文版 |
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GB/T 16649.9-2010 Identification cards - Integrated circuit cards - Part 9: Commands for card management - 英文版 |
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GB/T 16649.4-2010 Identification Cards - Integrated circuit cards - Part 4: Organization, security and commands for interchange - 英文版 |
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GB/T 16649.15-2010 Identification cards - Integrated circuit cards - Part 15: Cryptographic information application - 英文版 |
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GB/T 16649.12-2010 Identification cards - Integrated circuit cards - Part 12: Cards with contacts - USB electrical interface and operating procedures - 英文版 |
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GB/T 22351.3-2008 Identification cards - Contactless integrated circuit(s) IC cards - Vicinity cards - Part 3: Anticollision and transmission protocol - 英文版 |
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GB/T 22351.1-2008 Identification cards - Contactless integrated circuit(s) cards - Vicinity cards - Part 1: Physical characteristics - 英文版 |
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GB/T 20870.1-2007 Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers - 英文版 |
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GB/T 17574.9-2006 Semiconductor devices - Integrated circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories - 英文版 |
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GB/T 17574.20-2006 Semiconductor devices - Integrated circuits - Part 2-20：Digital integrated circuits - Family specification - Low voltage integrated circuits - 英文版 |
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