China Semiconductor Device GB Standards Search Result |
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1. Ready translated GB standards ![]() 2. Other English version GB Standards are not ready translated, only after get your order, then we translate them, time usually need 3-5 days . |
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GB/T 13973-2012 General specification test methods for Semiconductor Device curve tracers - 英文版 |
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GB/T 4937.4-2012 Semiconductor Devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) - 英文版 |
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GB/T 4937.3-2012 Semiconductor Devices - Mechanical and climatic tests methods - Part 3: External visual examination - 英文版 |
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GB/T 13539.4-2009 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of Semiconductor Devices - 英文版 |
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GB/T 21039.1-2007 Semiconductor Devices - Discrete devices - Part 4-1: Microwave diodes and transistors - Microwave field effect transistors - Blank detail specification - 英文版 |
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GB/T 20870.1-2007 Semiconductor Devices - Part 16-1: Microwave integrated circuits - Amplifiers - 英文版 |
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GB/T 17574.9-2006 Semiconductor Devices - Integrated circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories - 英文版 |
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GB/T 17574.20-2006 Semiconductor Devices - Integrated circuits - Part 2-20:Digital integrated circuits - Family specification - Low voltage integrated circuits - 英文版 |
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GB/T 17574.11-2006 Semiconductor Devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory - 英文版 |
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GB/T 4589.1-2006 Semiconductor Devices - Part 10: Generic specification for discrete devices and integrated circuits - 英文版 |
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GB/T 20516-2006 Semiconductor Devices - Discrete devices - Part 4: Microwave devices - 英文版 |
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GB/T 20515-2006 Semiconductor Devices - Integrated circuits - Part 5: Semicustom integrated circuits - 英文版 |
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GB/T 4937.2-2006 Semiconductor Devices―Mechanical and climatic test methods―Part 2: Low air pressure - 英文版 |
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GB/T 4937.1-2006 Semiconductor Devices―Mechanical and climatic test methods―Part 1: General - 英文版 |
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GB/T 20522-2006 Semiconductor Devices Part 14-3: Semiconductor sensors - Pressure sensors - 英文版 |
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GB/T 20521-2006 Semconductor devices Part 14-1: Semiconductor sensors - General and classification - 英文版 |
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GB/T 12750-2006 Semiconductor Devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits - 英文版 |
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GB/T 13151-2005 Semiconductor Devices Discrete devices Part 6:Thyristors Section Three-Blank detail specification for reverse blocking triode thyristors,ambient and case-rated,for currents greater than 100A - 英文版 |
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GB/T 13150-2005 Semiconductor Devices Discret devices Blank detail specification for bidirectional triode thyristors(triacs),ambient and case-rated,for currents greater than 100A - 英文版 |
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GB/T 2900.66-2004 Electrotechnical terminology--Semiconductor Devices and integrated circuits - 英文版 |
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GB/T 8446.3-2004 Heat sink for power Semiconductor Device--Part 3:Insulators and fasteners - 英文版 |
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GB/T 8446.2-2004 Heat sink for power Semiconductor Device--Part 2:Measuring method of thermal resistance and inputfluid-output fluid pressure difference - 英文版 |
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GB/T 8446.1-2004 Heat sink for power Semiconductor Device--Part 1:Casting kind series - 英文版 |
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GB/T 19403.1-2003 Semiconductor Devices--Integrated circuits--Part 11:Section 1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits) - 英文版 |
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GB/T 17574.10-2003 Semiconductor Devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories - 英文版 |
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GB/T 15651.3-2003 Discrete Semiconductor Devices and integrated circuits--Part 5-3:Optoelectronic devices--Measuring methods - 英文版 |
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GB/T 15651.2-2003 Discrete Semiconductor Devices and integrated circuits--Part 5-2:Optoelectronic devices--Essential ratings and characteristics - 英文版 |
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GB/T 18904.5-2003 Semiconductor Devices--Part 12-5: Optoelectronic devices--Blank detail specification for pin-photodiodes with/without pigtail,for fibre optic systems or subsystems - 英文版 |
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GB/T 6589-2002 Semiconductordevices--Discrete devices--Part 3-2:Signal (including switching) and regulator diodes--Blank detail specification for voltage-regulator diodes and voltage-reference diodes (excluding temperature-compensated precision reference diodes) - 英文版 |
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GB/T 18904.4-2002 Semiconductor Devices--Part 12-4:Optoelectronicdevices--Blank detail specification for pin-FET modules with/without pigtailfor fiber optic systems or sub-systems - 英文版 |
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