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GB/T 20870.1-2007
Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
- 英文版
GB/T 17574.9-2006
Semiconductor devices - Integrated circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
- 英文版
GB/T 17574.20-2006
Semiconductor devices - Integrated circuits - Part 2-20:Digital integrated circuits - Family specification - Low voltage integrated circuits
- 英文版
GB/T 17574.11-2006
Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory
- 英文版
GB/T 4589.1-2006
Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
- 英文版
GB/T 20516-2006
Semiconductor devices - Discrete devices - Part 4: Microwave devices
- 英文版
GB/T 20515-2006
Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
- 英文版
GB/T 4937.2-2006
Semiconductor devices―Mechanical and climatic test methods―Part 2: Low air pressure
- 英文版
GB/T 4937.1-2006
Semiconductor devices―Mechanical and climatic test methods―Part 1: General
- 英文版
GB/T 20522-2006
Semiconductor devices Part 14-3: Semiconductor sensors - Pressure sensors
- 英文版
GB/T 20521-2006
Semconductor devices Part 14-1: Semiconductor sensors - General and classification
- 英文版
GB/T 12750-2006
Semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- 英文版
GB/T 13151-2005
Semiconductor devices Discrete devices Part 6:Thyristors Section Three-Blank detail specification for reverse blocking triode thyristors,ambient and case-rated,for currents greater than 100A
- 英文版
GB/T 13150-2005
Semiconductor devices Discret devices Blank detail specification for bidirectional triode thyristors(triacs),ambient and case-rated,for currents greater than 100A
- 英文版
GB/T 2900.66-2004
Electrotechnical terminology--Semiconductor devices and integrated circuits
- 英文版
GB/T 8446.3-2004
Heat sink for power Semiconductor device--Part 3:Insulators and fasteners
- 英文版
GB/T 8446.2-2004
Heat sink for power Semiconductor device--Part 2:Measuring method of thermal resistance and inputfluid-output fluid pressure difference
- 英文版
GB/T 8446.1-2004
Heat sink for power Semiconductor device--Part 1:Casting kind series
- 英文版
GB/T 19403.1-2003
Semiconductor devices--Integrated circuits--Part 11:Section 1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits)
- 英文版
GB/T 17574.10-2003
Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories
- 英文版
GB/T 15651.3-2003
Discrete Semiconductor devices and integrated circuits--Part 5-3:Optoelectronic devices--Measuring methods
- 英文版
GB/T 15651.2-2003
Discrete Semiconductor devices and integrated circuits--Part 5-2:Optoelectronic devices--Essential ratings and characteristics
- 英文版
GB/T 18904.5-2003
Semiconductor devices--Part 12-5: Optoelectronic devices--Blank detail specification for pin-photodiodes with/without pigtail,for fibre optic systems or subsystems
- 英文版
GB/T 6589-2002
Semiconductordevices--Discrete devices--Part 3-2:Signal (including switching) and regulator diodes--Blank detail specification for voltage-regulator diodes and voltage-reference diodes (excluding temperature-compensated precision reference diodes)
- 英文版
GB/T 18904.4-2002
Semiconductor devices--Part 12-4:Optoelectronicdevices--Blank detail specification for pin-FET modules with/without pigtailfor fiber optic systems or sub-systems
- 英文版
GB/T 18904.3-2002
Semiconductor devices--Part 12-3:Optoelectronic devices--Blank detail specification for light-emitting diodes--Display application
- 英文版
GB/T 18904.2-2002
Semiconductor devices--Part 12-2:Optoelectronic devices--Blank detail specification for laser diodes modules with pigtail for fiber optic systems or sub-systems
- 英文版
GB/T 18904.1-2002
Semiconductor devices--Part 12-1:Optoelectronic devices--Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fiber optic systems or sub-systems
- 英文版
GB/T 18500.2-2001
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC)
- 英文版
GB/T 18500.1-2001
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC)
- 英文版

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