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GB/T 10067.34-2015 Basic specifications for electroheat installations—Part 34:Transistor type high frequency induction heating installation - 英文版 |
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GB/T 10067.3-2015 Basic specifications for electroheat installations—Part 3: Induction electroheat installation - 英文版 |
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GB/T 10067.21-2015 Basic specifications for electroheat installations—Part 21: Large capacity electric arc furnace using alternating current - 英文版 |
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GB/T 31996-2015 General specification for variable reluctance multipolar resolvers - 英文版 |
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GB/T 31993-2015 Management specification of electric energy service management platform - 英文版 |
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GB/T 31991.5-2015 Technical specification of electric energy service management platform—Part 5: Safety protection specification - 英文版 |
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GB/T 31991.4-2015 Technical specification of electric energy service management platform—Part 4: Design specification - 英文版 |
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GB/T 31991.3-2015 Technical specification of electric energy service management platform—Part 3: Interface specification - 英文版 |
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GB/T 31991.2-2015 Technical specification of electric energy service management platform— Part 2: Master station function specification - 英文版 |
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GB/T 31991.1-2015 Technical specification of electric energy service management platform— Part 1: General rules - 英文版 |
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GB/T 31990.3-2015 Technical specification for electric power information transmission system on plastic optical— Part 3: Opitical transceiver module - 英文版 |
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GB/T 31990.2-2015 Technical specification for electric power information transmission system on plastic optical fiber—Part 2: Transceiver communication unit - 英文版 |
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GB/T 31990.1-2015 Technical specification for electric power information transmission system on plastic optical fiber—Part 1: Technical requirements - 英文版 |
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GB/T 10067.413-2015 Basic specifications for electroheat installations—Part 413:Resistance furnaces using in the experiments - 英文版 |
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GB/T 10067.412-2015 Basic specifications for electroheat installations—Part 412:Box-type quenching furnaces - 英文版 |
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GB/T 18838.5-2015 Preparation of steel substrates before application of paints and related products—Specifications for metallic blast-cleaning abrasives—Part 5: Steel cut wire shot - 英文版 |
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GB/T 9546.8-2015 Fixed resistors for use in electronic equipment—Part 8: Sectional specification—Fixed surface mount resistors - 英文版 |
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GB/T 9546.801-2015 Fixed resistors for use in electronic equipment—Part 8-1: Blank detail specification—Fixed surface mount resistors categorized as level G—Assessment level EZ - 英文版 |
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GB/T 6346.3-2015 Fixed capacitors for use in electronic equipment—Part 3: Sectional specification—Surface mount fixed tantalum electrolytic capacitors with manganese dioxide solid electrolyte - 英文版 |
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GB/T 6346.301-2015 Fixed capacitors for use in electronic equipment—Part 3-1: Blank detail specification—Surface mount fixed tantalum electrolytic capacitors with manganese dioxide solid electrolyte—Assessment level EZ - 英文版 |
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GB/T 6346.14-2015 Fixed capacitors for use in electronic equipment—Part 14: Sectional specification—Fixed capacitors for electromagnetic interference suppression and connection to the supply mains - 英文版 |
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GB/T 6346.1401-2015 Fixed capacitors for use in electronic equipment—Part 14-1: Blank detail specification—Fixed capacitors for electromagnetic interference suppression and connection to the supply mains—Assessment level D - 英文版 |
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GB/T 6346.11-2015 Fixed capacitors for use in electronic equipment—Part 11: Sectional specification—―Fixed polyethylene-terephthalate film dielectric metal foil d.c. capacitors - 英文版 |
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GB/T 6346.1101-2015 Fixed capacitors for use in electronic equipment—Part 11-1: Blank detail specification—Fixed polyethylene-terephthalate film dielectric metal foil d.c.capacitors—Assessment level EZ - 英文版 |
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GB/T 31845-2015 Mechanical structures for electrotechnical and electronic equipment—Thermal design specification - 英文版 |
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GB/T 15156-2015 Generic specification for piezoelectric ceramic transducing elements - 英文版 |
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GB/T 16525-2015 Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package - 英文版 |
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GB/T 15878-2015 Semiconductor integrated circuits—Specification of leadframes for small outline package - 英文版 |
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GB/T 15876-2015 Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package - 英文版 |
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GB/T 14112-2015 Semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP - 英文版 |
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