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GB/T 20457-2006 Machinery for forestry―Wheeled skidders―Terms,definitions and commercial specifications - 英文版 |
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GB/T 20455-2006 Machinery for forestry―Forwarders―Terms,definitions and commercial specifications - 英文版 |
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GB/T 20447-2006 Machinery for forestry―Feller-bunchers―Terms,definitions and commercial specifications - 英文版 |
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GB/T 13923-2006 Specifications for feature classification and codes of fundamental geographic information - 英文版 |
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GB/T 12897-2006 Specifications for the first and second order leveling - 英文版 |
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GB/T 20235-2006 Technical specification for silver-tin oxide electric contact materials - 英文版 |
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GB/T 20164-2006 Prevention and control specifications for mail and mail handling systems in the area of when epidemics breakout - 英文版 |
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GB/T 16263.1-2006 Information technology - ASN.1 encoding rules Part 1: Specification of Basic Encoding Rules (BER), Canonical Encoding Rules (CER) and Distinguished Encoding Rules (DER) - 英文版 |
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GB/T 6113.402-2006 Specification for radio disturbance and immunity measuring apparatus and methods - Part 4-2: Uncertainties, statistics and limit modelling - Measurement instrumentation uncertainty - 英文版 |
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GB/T 2546.1-2006 Plastics―Polypropylene(PP) moulding and extrusion materials―Part 1: Designation system and basis for specifications - 英文版 |
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GB/T 16514.2-2005 Electromechanical switches for use in electronic equipment Part 5:Sectional specification for pushbutton switches Section 1-Blank detail specification - 英文版 |
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GB/T 14912-2005 Specifications for computer-aided mapping of large-scale topographic maps - 英文版 |
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GB/T 13151-2005 Semiconductor devices Discrete devices Part 6:Thyristors Section Three-Blank detail specification for reverse blocking triode thyristors,ambient and case-rated,for currents greater than 100A - 英文版 |
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GB/T 13150-2005 Semiconductor devices Discret devices Blank detail specification for bidirectional triode thyristors(triacs),ambient and case-rated,for currents greater than 100A - 英文版 |
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GB/T 18496.2-2005 Electromechanical switches for use in electronic equipment Part 4-1:Sectional specification for lever(toggle)switches Blank detail specification - 英文版 |
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GB/T 7235-2004 Geometrical Product Specifications(GPS)--Methods for the assessment of departure from roundness--Measurement of variations in radius - 英文版 |
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GB/T 10476-2004 Specifications for urea high pressure condenser - 英文版 |
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GB/T 12357.4-2004 Multimode optical fibres fortelecommunication--Part 4:Sectional specification for category A4 multimode fibres - 英文版 |
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GB/T 12357.3-2004 Multimode optical fibres fortelecommunication--Part 3:Sectional specification for category A3 multimode fibres - 英文版 |
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GB/T 12357.2-2004 Multimode optical fibres fortelecommunication--Part 2:Sectional specification for category A2 multimode fibres - 英文版 |
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GB/T 19488.1-2004 Data elements for e-government--Part 1:Specification for design and management - 英文版 |
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GB/T 19487-2004 Business process design method general specification for electronic government - 英文版 |
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GB/T 210.2-2004 Specification and determination methods of sodium carbonate for industrial use--Part 2:Specification and determination methods - 英文版 |
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GB 210.1-2004 Specification and determination methods of sodium carbonate for industrial use--Part 1:sodium carbonate for industrial use - 英文版 |
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GB 19458-2004 Safety code for inspection of hazardous properties for dangerous goods--General specifications - 英文版 |
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GB/T 7214-2003 Fixed capacitors for use in electronic equipment--Part 15-3:Blank detail specification--Fixed tantalum capacitors with solid electrolyte and porous anode--Assessment level E - 英文版 |
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GB/T 5994-2003 Fixed capacitors for use in electronic equipment--Part 4-1:Blank detail specification--Auminium electrolytic capacitors with non-solid electrolyte--Assessment level E - 英文版 |
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GB/T 19247.4-2003 Printed board assemblies--Part 4:Sectional specification--Requirements for terminal soldered assemblies - 英文版 |
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GB/T 19247.3-2003 Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies - 英文版 |
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GB/T 17574.10-2003 Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories - 英文版 |
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