China Specification for ed GB Standards Search Result |
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1. Ready translated GB standards ![]() 2. Other English version GB Standards are not ready translated, only after get your order, then we translate them, time usually need 3-5 days . |
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GB/T 13667.2-2003 Technical specification for stacked steel book shelves - 英文版 |
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GB/T 7214-2003 Fixed capacitors for use in electronic equipment--Part 15-3:Blank detail specification--Fixed tantalum capacitors with solid electrolyte and porous anode--Assessment level E - 英文版 |
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GB/T 7213-2003 Fixed capacitors for use in electronic equipment--Part 15:Sectional specification--Fixed tantalum capacitors with non-solid or solid electrolyte - 英文版 |
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GB/T 5994-2003 Fixed capacitors for use in electronic equipment--Part 4-1:Blank detail specification--Auminium electrolytic capacitors with non-solid electrolyte--Assessment level E - 英文版 |
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GB/T 5993-2003 Fixed capacitors for use in electronic equipment--Part 4:Sectional specification--Aluminium electrolytic capacitors with solid and non-solid electrolyte - 英文版 |
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GB/T 5729-2003 Fixed resistors for use in electronic equipment--Part 1:Generic specification - 英文版 |
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GB/T 19247.4-2003 Printed board assemblies--Part 4:Sectional specification--Requirements for terminal soldered assemblies - 英文版 |
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GB/T 19247.3-2003 Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies - 英文版 |
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GB/T 17574.10-2003 Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories - 英文版 |
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GB/T 16829-2003 Information technology--Automatic identification and data capture techniques--Bar code symbology specifications--Interleaved 2 of 5 - 英文版 |
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GB/T 19247.2-2003 Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies - 英文版 |
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GB/T 19247.1-2003 Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies - 英文版 |
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GB/T 15329.1-2003 Rubber hosesand hose assemblies--Textile-reinforced hydraulic types--Specification--Part 1: Oil-based fluid applications - 英文版 |
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GB 19157-2003 General specification for remote-controlled fire monitor systems - 英文版 |
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GB 15629.11-2003 Information technology--Telecommunications and information exchange between systems--Local and metropolitan area networks--Specific requirements--Part 11: Wireless LAN Medium Access Control (MAC) andPhysical Layer(PHY) Specifications - 英文版 |
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GB 15629.1102-2003 Information technology--Telecommunications and information exchange between systems--Local and metropolitan area networks--Specific requirements--Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer(PHY) Specifications: Higher-Speed Physi - 英文版 |
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GB/T 16857.4-2003 Geometrical Product Specifications(GPS)--Acceptance andreverification tests for coordinate measuring machines(CMM)--Part 4: CMMs used in scanning measuring mode - 英文版 |
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GB/T 7154.1-2003 Thermistors--Directly heated positive step-function temperature coefficient--Part 1-1:Blank detail specification for current limiting application--Assessment level EZ - 英文版 |
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GB/T 6589-2002 Semiconductordevices--Discrete devices--Part 3-2:Signal (including switching) and regulator diodes--Blank detail specification for voltage-regulator diodes and voltage-reference diodes (excluding temperature-compensated precision reference diodes) - 英文版 |
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GB/T 18909-2002 Sectional specification for high-frequency inductors and intermediate frequency transformers for use in electronic equipment for capability approval - 英文版 |
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GB/T 18904.1-2002 Semiconductor devices--Part 12-1:Optoelectronic devices--Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fiber optic systems or sub-systems - 英文版 |
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GB/T 15157.7-2002 Connectors for frequencies below 3MHz for use with printed boards--Part 7:Detail specification for connectors,8-way,including fixed and free connectors with common mating features,with assessed quality - 英文版 |
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GB/T 12668.1-2002 Adjustable speed electrical power drive systems--Part 1:General requirements--Rating specifications for low voltage adjustable speed d.c. power drive systems - 英文版 |
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GB/T 18838.1-2002 Preparation of steel substrates before application of paints and related products--Specifications for metallic blast-cleaning abrasives--General introduction and classification - 英文版 |
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GB/T 17850.1-2002 Preparation of steel substrates before application of paints and related products--Specifications for non-metallic blast-cleaning abrasives--General introductionand classification - 英文版 |
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GB/T 12668.2-2002 Adjustable speed electrical power drive systems--Part 2:General requirements--Rating specifications for low voltage adjustable frequency a.c. power drive systems - 英文版 |
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GB/T 1303.2-2002 Specification for industrial rigid laminated sheetsbased on thermosetting resins for electrical purposes--Part 3:Specifications for individual materials--Sheet 3:Requirements for rigid laminated sheets based onmelamine resins - 英文版 |
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GB/T 18569.1-2001 Safety of machinery--Reduction of risks to health from hazardous substances emitted by machinery--Part 1:Principles and specifications for machinery manufacturers - 英文版 |
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GB/T 18500.2-2001 Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC) - 英文版 |
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GB/T 18500.1-2001 Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC) - 英文版 |
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