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GB/T 7214-2003 Fixed capacitors for use in electronic equipment--Part 15-3:Blank detail specification--Fixed tantalum capacitors with solid electrolyte and porous anode--Assessment level E - 英文版 |
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GB/T 7213-2003 Fixed capacitors for use in electronic equipment--Part 15:Sectional specification--Fixed tantalum capacitors with non-solid or solid electrolyte - 英文版 |
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GB/T 5994-2003 Fixed capacitors for use in electronic equipment--Part 4-1:Blank detail specification--Auminium electrolytic capacitors with non-solid electrolyte--Assessment level E - 英文版 |
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GB/T 5993-2003 Fixed capacitors for use in electronic equipment--Part 4:Sectional specification--Aluminium electrolytic capacitors with solid and non-solid electrolyte - 英文版 |
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GB/T 5729-2003 Fixed resistors for use in electronic equipment--Part 1:Generic specification - 英文版 |
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GB/T 19405.1-2003 Surface mounting technology--Part 1:Standard method for the specification of surface mounting components(SMDs) - 英文版 |
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GB/T 19247.4-2003 Printed board assemblies--Part 4:Sectional specification--Requirements for terminal soldered assemblies - 英文版 |
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GB/T 19247.3-2003 Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies - 英文版 |
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GB/T 17574.10-2003 Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories - 英文版 |
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GB 19304-2003 Hygienic specifications of factory for packing drinking water - 英文版 |
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GB/T 19290.2-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 2: Sectional specification--Interface co-ordination dimensions for the 25mm equipment practice - 英文版 |
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GB/T 19247.2-2003 Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies - 英文版 |
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GB/T 19247.1-2003 Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies - 英文版 |
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GB/T 18237.4-2003 Information technology--Open systems interconnection--Generic upper layers security--Part 4: Protecting transfer syntax specification - 英文版 |
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GB 18240.2-2003 Fiscal cash register--Part 2: Specification for fiscal IC card - 英文版 |
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GB/T 15329.1-2003 Rubber hosesand hose assemblies--Textile-reinforced hydraulic types--Specification--Part 1: Oil-based fluid applications - 英文版 |
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GB 15629.11-2003 Information technology--Telecommunications and information exchange between systems--Local and metropolitan area networks--Specific requirements--Part 11: Wireless LAN Medium Access Control (MAC) andPhysical Layer(PHY) Specifications - 英文版 |
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GB 15629.1102-2003 Information technology--Telecommunications and information exchange between systems--Local and metropolitan area networks--Specific requirements--Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer(PHY) Specifications: Higher-Speed Physi - 英文版 |
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GB/T 16857.4-2003 Geometrical Product Specifications(GPS)--Acceptance andreverification tests for coordinate measuring machines(CMM)--Part 4: CMMs used in scanning measuring mode - 英文版 |
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GB/T 12472-2003 Geometrical Product Specifications(GPS)--Surface texture:Profile method--Surface roughness parameters and their values for wooden pieces - 英文版 |
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GB/T 18522.1-2003 General specification for hydrometric instruments--Part 1: General rules - 英文版 |
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GB/T 18904.5-2003 Semiconductor devices--Part 12-5: Optoelectronic devices--Blank detail specification for pin-photodiodes with/without pigtail，for fibre optic systems or subsystems - 英文版 |
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GB/T 7154.1-2003 Thermistors--Directly heated positive step-function temperature coefficient--Part 1-1:Blank detail specification for current limiting application--Assessment level EZ - 英文版 |
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GB/T 13477.1-2002 Test method for building sealants--Part 1:Specifications for test substrates - 英文版 |
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GB/T 6589-2002 Semiconductordevices--Discrete devices--Part 3-2:Signal (including switching) and regulator diodes--Blank detail specification for voltage-regulator diodes and voltage-reference diodes (excluding temperature-compensated precision reference diodes) - 英文版 |
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GB/T 18909-2002 Sectional specification for high-frequency inductors and intermediate frequency transformers for use in electronic equipment for capability approval - 英文版 |
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GB/T 18904.4-2002 Semiconductor devices--Part 12-4:Optoelectronicdevices--Blank detail specification for pin-FET modules with/without pigtailfor fiber optic systems or sub-systems - 英文版 |
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GB/T 18904.3-2002 Semiconductor devices--Part 12-3:Optoelectronic devices--Blank detail specification for light-emitting diodes--Display application - 英文版 |
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GB/T 18904.2-2002 Semiconductor devices--Part 12-2:Optoelectronic devices--Blank detail specification for laser diodes modules with pigtail for fiber optic systems or sub-systems - 英文版 |
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GB/T 18904.1-2002 Semiconductor devices--Part 12-1:Optoelectronic devices--Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fiber optic systems or sub-systems - 英文版 |
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