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GB/T 16850.5-2001 Basic specification for optical fibre amplifier test methods--Part 5:Test methods for reflectance parameters - 英文版 |
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GB/T 4588.12-2000 Specification for mass laminationpanels (semi-manufactured multilayer printed boards) - 英文版 |
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GB/T 17737.2-2000 Radio-frequency cables--Part 2:Sectional specification for semi-rigid radio-frequency and coaxial cables with polytetrafluoroethylene(PTFE) insulation - 英文版 |
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GB/T 18262-2000 General specifications for wood-based panel mach-inery - 英文版 |
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GB/T 6588-2000 Semiconductor devices--Discrete devices--Part 3:Signal(including switching) and regulator diodes--Section One--Blank detail specification for signal diodes，switching diodes and controlled-avalanche diodes - 英文版 |
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GB/T 18237.3-2000 Information technology--Open Systems Interconnection--Generic upper layers security--Part 3:Security Exchange Service Element(SESE) protocol specification - 英文版 |
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GB/T 18236.1-2000 Information technology--Telecommunications and information exchange between systems--Local and metropolitan area networks--Common specifications--Part 1:Medium Access Control(MAC)service definition - 英文版 |
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GB/T 18235.1-2000 Information technology--High-Performance Parallel Interface--Part 1:Mechanical，electrical and signaling protocol specification (HIPPI-PH) - 英文版 |
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GB/T 17192.5-2000 Information technology--Computer graphics--Interfacing techniques for dialogues with graphical devices(CGI)--Functional specification--Part 5:Inputand echoing - 英文版 |
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GB/T 17192.6-2000 Information technology--Computer graphics--Interfacing techniques for dialogues with graphical devices(CGI)--Functional specification--Part 6:Raster - 英文版 |
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GB/T 12507.1-2000 Connectors for optical fibres and cables--Part 1:Generic specification - 英文版 |
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GB/T 5965-2000 Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays) - 英文版 |
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GB/T 17904.2-1999 ISDN user-network interface data link layer specification and conformance testing method--Part 2:Data link layer protocol conformance testing method - 英文版 |
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GB/T 17904.1-1999 ISDN user-network interface data link layer specification and conformance testing method--Part 1:User-network interface data linklayer specification - 英文版 |
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GB/T 13621-1999 Capacity series and radio-frequency channel arrangement and equipment main technical specifications for 100～1000 MHz radio relay communication systems - 英文版 |
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GB/T 17850.3-1999 Preparation of steel substrates before application of paints and related products--Specifications for non-metallic blast-cleaning abrasives--Copper refinery slag - 英文版 |
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GB/T 1845.1-1999 Polyethylene(PE) moulding and extrusion materials--Part 1:Designation system and basis for specifications - 英文版 |
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GB/T 16850.3-1999 Basic specification for optical fibre amplifier test methods--Part 3:Test methods for noisefigure parameters - 英文版 |
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GB/T 16850.2-1999 Basic specification for optical fibre amplifier test methods--Part 2:Test methods for powerparameters - 英文版 |
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GB/T 17580.1-1998 Information technology--Open systems interconnection--Virtual terminal basic class protocol--Part 1:Specification - 英文版 |
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GB/T 17562.1-1998 Rectangular connectors for frequencies below 3 MHz--Part 1: Generic specification--General requirements and guide for the preparation of detail specifications for connectors with assessed quality - 英文版 |
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GB/T 9424-1998 Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Five:Blank detail specification for complementary MOS digital inte-grated circuits，series 4000B and 4000UB - 英文版 |
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GB/T 7576-1998 Semiconductor devices--Discrete devices--Part 7:Bipolar transistors--Section Four:Blank detail specification for case-rated bipolartransistors for high-frequency amplification - 英文版 |
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GB/T 6590-1998 Semiconductor devices--Discrete devices--Part6:Thyristors--Section Two:Blank detail specification for bidirectional triode thyristors(triacs)，ambient or case-rated，up to 100A - 英文版 |
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GB/T 6352-1998 Semiconductor devices--Discrete devices--Part 6:Thyristors--Section One:Blank detail specification for reverse blocking triode thyristors，ambient or case-rated，up to 100A - 英文版 |
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GB/T 6351-1998 Semiconductor devices--Discrete devices--Part 2:Rectifier diodes--Section One:Blank detail specification for rectifier diodes(including avalanche recti fier diodes)，ambient and case-rated，up to 100A - 英文版 |
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GB/T 6219-1998 Semiconductor devices--Discrete devices--Part 8:Field-effect transistors--Section One:Blank detail specification for single-gate field-effect transistors up to 5W and 1GHz - 英文版 |
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GB/T 17572-1998 Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Four:Family specification for complementary MOS digital integrated circuits，series 4000B and 4000UB - 英文版 |
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GB/T 15157.2-1998 Connectors for frequencies below 3MHz for use with printed boards--Part 2:Detail specification for two-part connectors with assessed quality，for printed boards，for basic grid of 2.54 mm(0.1in) with commonmounting features - 英文版 |
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GB/T 17546.1-1998 Information technology--Open systems interconnection--Connectionless presentation protocol--Part 1:Protocol specification - 英文版 |
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