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2. Other English version GB Standards are not ready translated, only after get your order, then we translate them, time usually need 3-5 days . |
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GB/T 43538-2023 Quality technical requirements for integrated circuit metal packaging casing - 英文版 |
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GB/T 43536.2-2023 Three-dimensional integrated circuits Part 2: Calibration requirements for fine-pitch stacked chips - 英文版 |
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GB/T 43536.1-2023 Three-dimensional integrated circuits Part 1: Terms and definitions - 英文版 |
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GB/T 43454-2023 Integrated circuit intellectual property (IP) core design requirements - 英文版 |
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GB/T 28511.2-2023 Planar optical waveguide integrated optical circuit devices Part 2: Dense wavelength division multiplexing (DWDM) filters based on arrayed waveguide grating (AWG) technology - 英文版 |
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GB/Z 43510-2023 Guide to Reliability Test Methods for Integrated Circuit TSV Three-Dimensional Packages - 英文版 |
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GB/T 43228-2023 Design requirements for radiation-hardened integrated circuit unit libraries for aerospace use - 英文版 |
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GB/T 43227-2023 Test method for vapor-deposited protective films for inner leads of integrated circuits for aerospace use - 英文版 |
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GB/T 43226-2023 Single-event soft error time domain testing method for semiconductor integrated circuits used in aerospace applications - 英文版 |
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GB/T 43063-2023 Integrated circuit CMOS image sensor test method - 英文版 |
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GB/T 43061-2023 Semiconductor integrated circuit PWM controller test method - 英文版 |
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GB/T 43041-2023 Hybrid integrated circuit DC/DC converter - 英文版 |
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GB/T 43040-2023 Semiconductor integrated circuit AC/DC converter test method - 英文版 |
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GB/T 43035-2023 Semiconductor Devices Integrated Circuits Part 20: General Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits Part 1: Internal Visual Inspection Requirements - 英文版 |
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GB/T 43034.3-2023 Integrated circuits - Measurement of pulse immunity - Part 3: Non-synchronous transient injection method - 英文版 |
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GB/T 42975-2023 Semiconductor integrated circuit driver test methods - 英文版 |
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GB/T 42974-2023 Semiconductor integrated circuit flash memory (FLASH) - 英文版 |
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GB/T 42973-2023 Semiconductor integrated circuit Digital-to-analog (DA) converter - 英文版 |
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GB/T 42970-2023 Semiconductor integrated circuit video encoding and decoding circuit testing method - 英文版 |
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GB/T 42968.8-2023 Integrated circuits - Electromagnetic immunity measurements - Part 8: Radiated immunity measurements - IC stripline method - 英文版 |
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GB/T 42968.1-2023 Integrated circuits - Electromagnetic immunity measurements - Part 1: General conditions and definitions - 英文版 |
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GB/T 20870.5-2023 Semiconductor devices Part 16-5: Microwave integrated circuits Oscillators - 英文版 |
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GB/T 20870.2-2023 Semiconductor devices Part 16-2: Microwave integrated circuits Prescalers - 英文版 |
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GB/T 20870.10-2023 Semiconductor Devices Part 16-10: Monolithic Microwave Integrated Circuit Technology Acceptable Procedures - 英文版 |
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GB/T 42848-2023 Semiconductor integrated circuits - Test methods for direct digital frequency synthesizers - 英文版 |
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GB/T 42839-2023 Semiconductor integrated circuit Analog-to-digital (AD) converter - 英文版 |
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GB/T 42838-2023 Semiconductor integrated circuit Hall circuit test method - 英文版 |
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GB/T 42837-2023 Microwave semiconductor integrated circuit amplifier - 英文版 |
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GB/T 42836-2023 Microwave semiconductor integrated circuit mixer - 英文版 |
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GB/T 42835-2023 Semiconductor integrated circuit system on chip (SoC) - 英文版 |
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