China Semiconductor Device GB Standards Search Result |
1. Ready translated GB standards and Chinese version GB Standards, you can purchase directly in the web page; After receive your payment, we will send the GB Standards PDF file to your Email within
1~3 days.
2. Other English version GB Standards are not ready translated, only after get your order, then we translate them, time usually need 3-5 days . |
GB/T 43493.3-2023 Semiconductor Devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 3: Photoluminescence detection method of defects - 英文版 |
|||
GB/T 43493.2-2023 Semiconductor Devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 2: Optical detection methods for defects - 英文版 |
|||
GB/T 43493.1-2023 Semiconductor Devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 1: Defect classification - 英文版 |
|||
GB/T 43366-2023 General specification for semiconductor discrete devices for aerospace applications - 英文版 |
|||
GB/T 4937.26-2023 Semiconductor Devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) susceptibility testing Human Body Model (HBM) - 英文版 |
|||
GB/T 4587-2023 Semiconductor Devices Discrete Devices Part 7: Bipolar Transistors - 英文版 |
|||
GB/T 43035-2023 Semiconductor Devices Integrated Circuits Part 20: General Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits Part 1: Internal Visual Inspection Requirements - 英文版 |
|||
GB/T 20870.5-2023 Semiconductor Devices Part 16-5: Microwave integrated circuits Oscillators - 英文版 |
|||
GB/T 20870.2-2023 Semiconductor Devices Part 16-2: Microwave integrated circuits Prescalers - 英文版 |
|||
GB/T 20870.10-2023 Semiconductor Devices Part 16-10: Monolithic Microwave Integrated Circuit Technology Acceptable Procedures - 英文版 |
|||
GB/T 15651.6-2023 Semiconductor Devices Part 5-6: Optoelectronic devices Light emitting diodes - 英文版 |
|||
GB/T 42709.19-2023 Semiconductor Devices Microelectronic mechanical devices Part 19: Electronic compass - 英文版 |
|||
GB/T 4937.23-2023 Semiconductor Devices - Mechanical and climatic test methods - Part 23: High temperature operating life - 英文版 |
|||
GB/T 4937.27-2023 Semiconductor Devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) susceptibility test - Machine model (MM) - 英文版 |
|||
GB/T 4937.32-2023 Semiconductor Devices - Methods of mechanical and climatic tests - Part 32: Flammability of plastic encapsulated devices (externally induced) - 英文版 |
|||
GB/T 4937.31-2023 Semiconductor Devices - Methods of mechanical and climatic tests - Part 31: Flammability of plastic encapsulated devices (internal origin) - 英文版 |
|||
GB/T 42706.5-2023 Electronic components - Long term storage of Semiconductor Devices - Part 5: Chips and wafers - 英文版 |
|||
GB/T 42706.2-2023 Electronic components - Long-term storage of Semiconductor Devices - Part 2: Degradation mechanisms - 英文版 |
|||
GB/T 42706.1-2023 Electronic components - Long term storage of Semiconductor Devices - Part 1: General - 英文版 |
|||
GB/T 15879.604-2023 Mechanical standardization of Semiconductor Devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages - 英文版 |
|||
GB/T 4937.42-2023 Semiconductor Devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage - 英文版 |
|||
GB/T 42709.7-2023 Semiconductor Devices Microelectromechanical devices Part 7: MEMS bulk acoustic wave filters and duplexers for radio frequency control and selection - 英文版 |
|||
GB/T 42709.5-2023 Semiconductor Devices Microelectromechanical devices Part 5: RF MEMS switches - 英文版 |
|||
GB/T 8446.3-2022 Heat sinks for power Semiconductor Devices—Part 3: Insulators and fasteners - 英文版 |
|||
GB/T 8446.2-2022 Heat sinks for power Semiconductor Devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop - 英文版 |
|||
GB/T 8446.1-2022 Heat sinks for power Semiconductor Devices—Part 1: Radiators - 英文版 |
|||
GB/T 41852-2022 Semiconductor Devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures - 英文版 |
|||
GB/T 41853-2022 Semiconductor Devices MEMS devices Wafer-to-wafer bond strength measurement - 英文版 |
|||
GB/T 15879.4-2019 Mechanical standardization of Semiconductor Devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages - 英文版 |
|||
GB/T 11498-2018 Semiconductor Devices—Integrated circuits—Part 21:Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures - 英文版 |
Find out:123Items | To Page of: First -Previous-Next -Last | 1 2 3 4 5 |