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2. Other English version GB Standards are not ready translated, only after get your order, then we translate them, time usually need 3-5 days . |
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GB/T 43226-2023 Single-event soft error time domain testing method for Semiconductor integrated circuits used in aerospace applications - 英文版 |
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GB/T 43061-2023 Semiconductor integrated circuit PWM controller test method - 英文版 |
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GB/T 43040-2023 Semiconductor integrated circuit AC/DC converter test method - 英文版 |
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GB/T 43035-2023 Semiconductor Devices Integrated Circuits Part 20: General Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits Part 1: Internal Visual Inspection Requirements - 英文版 |
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GB/T 42975-2023 Semiconductor integrated circuit driver test methods - 英文版 |
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GB/T 42974-2023 Semiconductor integrated circuit flash memory (FLASH) - 英文版 |
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GB/T 42973-2023 Semiconductor integrated circuit Digital-to-analog (DA) converter - 英文版 |
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GB/T 42970-2023 Semiconductor integrated circuit video encoding and decoding circuit testing method - 英文版 |
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GB/T 20870.5-2023 Semiconductor devices Part 16-5: Microwave integrated circuits Oscillators - 英文版 |
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GB/T 20870.2-2023 Semiconductor devices Part 16-2: Microwave integrated circuits Prescalers - 英文版 |
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GB/T 20870.10-2023 Semiconductor Devices Part 16-10: Monolithic Microwave Integrated Circuit Technology Acceptable Procedures - 英文版 |
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GB/T 42848-2023 Semiconductor integrated circuits - Test methods for direct digital frequency synthesizers - 英文版 |
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GB/T 42839-2023 Semiconductor integrated circuit Analog-to-digital (AD) converter - 英文版 |
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GB/T 42838-2023 Semiconductor integrated circuit Hall circuit test method - 英文版 |
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GB/T 42837-2023 Microwave Semiconductor integrated circuit amplifier - 英文版 |
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GB/T 42836-2023 Microwave Semiconductor integrated circuit mixer - 英文版 |
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GB/T 42835-2023 Semiconductor integrated circuit system on chip (SoC) - 英文版 |
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GB/T 7092-2021 Outline dimensions of Semiconductor integrated circuits - 英文版 |
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GB/T 38345-2019 General design requirements of Semiconductor integrate circuit for space application - 英文版 |
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GB/T 37312.1-2019 Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability integrated circuits and discrete semiconductors - 英文版 |
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GB/T 11498-2018 Semiconductor devices—Integrated circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures - 英文版 |
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GB/T 13062-2018 Semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures - 英文版 |
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GB/T 36474-2018 Semiconductor integrated circuit—Measuring methods for double data rate 3 synchronous dynamic random access memory(DDR3 SDRAM) - 英文版 |
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GB/T 36477-2018 Semiconductor integrated circuit—Measuring methods for flash memory - 英文版 |
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GB/T 15879.5-2018 Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits - 英文版 |
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GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity） - 英文版 |
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GB/T 35007-2018 Semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry - 英文版 |
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GB/T 35006-2018 Semiconductor integrated circuits—Measuring method of level converter - 英文版 |
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GB/T 14028-2018 Semiconductor integrated circuits—Measuring method of analogue switch - 英文版 |
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GB/T 4377-2018 Semiconductor integrated circuits—Measuring method of voltage regulators - 英文版 |
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