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GB/T 4937.35-2024 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy of plastic encapsulated electronic components - 英文版 |
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GB/T 4937.32-2023 Semiconductor devices - Methods of mechanical and climatic tests - Part 32: Flammability of plastic encapsulated devices (externally induced) - 英文版 |
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GB/T 4937.31-2023 Semiconductor devices - Methods of mechanical and climatic tests - Part 31: Flammability of plastic encapsulated devices (internal origin) - 英文版 |
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GB/T 41852-2022 Semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures - 英文版 |
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GB/T 1550-2018 Test methods for conductivity type of extrinsic semiconducting materials - 英文版 |
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GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity） - 英文版 |
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GB/T 4937.201-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat - 英文版 |
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GB/T 4937.20-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - 英文版 |
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GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing - 英文版 |
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GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method - 英文版 |
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GB/T 31359-2015 Test methods of semiconductor lasers - 英文版 |
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GB/T 6616-2009 Test methods for measuring resistivity of semiconductor wafers or sheet resistance of semiconductor films with a noncontact eddy-current gauge - 英文版 |
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GB/T 1555-2009 Testing methods for determining the orientation of a semiconductor single crystal - 英文版 |
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GB/T 3048.3-2007 Test methods for electrical properties of electric cables and wires - Part 3：Test of volume resistivity of semi-conducting rubbers and plastics - 英文版 |
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GB/T 14862-1993 Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits - 英文版 |
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