China Testing of semicondu GB Standards Search Result

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	GB/T 43493.3-2023 Semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 3: Photoluminescence detection method of defects 半导体器件功率器件用碳化硅同质外延片缺陷的无损检测识别判据第3部分：缺陷的光致发光检测方法 - 英文版
	GB/T 43226-2023 Single-event soft error time domain testing method for semiconductor integrated circuits used in aerospace applications 宇航用半导体集成电路单粒子软错误时域测试方法 - 英文版
	GB/T 42676-2023 Testing the quality of semiconductor single crystals X-ray diffraction method 半导体单晶晶体质量的测试 X射线衍射法 - 英文版
	GB/T 6616-2023 Testing of semiconductor wafer resistivity and semiconductor film sheet resistance non-contact eddy current method 半导体晶片电阻率及半导体薄膜薄层电阻的测试非接触涡流法 - 英文版
	GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing 半导体器件机械和气候试验方法第30部分：非密封表面安装器件在可靠性试验前的预处理 - 英文版
	GB/T 1555-2009 Testing methods for determining the orientation of a semiconductor single crystal 半导体单晶晶向测定方法 - 英文版

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