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GB/T 15879.604-2023 standards english version


NATIONAL STANDARD OF THE PEOPLE'S REPUBLIC OF CHINA

GB/T 15879.604-2023

 

Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages

 
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Issued by:   The Standardization Administration of the People's Republic of China
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GB Standard Code GB/T 15879.604-2023
Standard Category China National Standards
GB Standard English Title Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages
GB Standard Chinese Title 半导体器件的机械标准化 第6-4部分:表面安装半导体器件封装外形图绘制的一般规则 焊球阵列(BGA)封装的尺寸测量方法
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