GB/T 15879.604-2023 standards english version

NATIONAL STANDARD OF THE PEOPLE'S REPUBLIC OF CHINA

GB/T 15879.604-2023

Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages

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The Standardization Administration of the People's Republic of China

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GB Standard Code	GB/T 15879.604-2023
Standard Category	China National Standards
GB Standard English Title	Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages
GB Standard Chinese Title	半导体器件的机械标准化第6-4部分：表面安装半导体器件封装外形图绘制的一般规则焊球阵列（BGA）封装的尺寸测量方法
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