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GB/T 30656-2023
Silicon carbide single crystal polished wafer
碳化硅单晶抛光片 - 中英文版
GB/T 41325-2022
Low-density crystal primary pit silicon single crystal polishing wafer for integrated circuits
集成电路用低密度晶体原生凹坑硅单晶抛光片 - 中英文版
GB/T 11094-2020
Gallium arsenide single crystal and cutting wafer grown by horizontal bridgman method
水平法砷化镓单晶及切割片 - 中英文版
GB/T 30118-2013
Single crystal wafers for surface acoustic wave (SAW) device applications―Specifications and measuring methods
声表面波(SAW)器件用单晶晶片规范与测量方法 - 中英文版
GB/T 13388-2009
Method for measuring crystallographic orientation of flats on single-crystal silicon slices and wafers by X-ray techniques
硅片参考面结晶学取向X射线测试方法 - 中英文版
GB/T 11094-2007
Horizontal bridgman grown gallium arsenide single crystal and cutting wafer
水平法砷化镓单晶及切割片 - 中英文版

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