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GB/T 30656-2023 Silicon carbide single crystal polished wafer 碳化硅单晶抛光片 - 中英文版 |
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GB/T 41325-2022 Low-density crystal primary pit silicon single crystal polishing wafer for integrated circuits 集成电路用低密度晶体原生凹坑硅单晶抛光片 - 中英文版 |
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GB/T 11094-2020 Gallium arsenide single crystal and cutting wafer grown by horizontal bridgman method 水平法砷化镓单晶及切割片 - 中英文版 |
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GB/T 30118-2013 Single crystal wafers for surface acoustic wave (SAW) device applications―Specifications and measuring methods 声表面波(SAW)器件用单晶晶片规范与测量方法 - 中英文版 |
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GB/T 13388-2009 Method for measuring crystallographic orientation of flats on single-crystal silicon slices and wafers by X-ray techniques 硅片参考面结晶学取向X射线测试方法 - 中英文版 |
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GB/T 11094-2007 Horizontal bridgman grown gallium arsenide single crystal and cutting wafer 水平法砷化镓单晶及切割片 - 中英文版 |
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