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GB/T 15651.7-2024 Printed board assembly - Part 6: Evaluation requirements for voids in ball grid array (BGA) and land grid array (LGA) solder joints and test methods 半导体器件-第5-7部分：光电子器件-光电二极管和光电晶体管 - 中英文版 |
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GB/T 43059-2023 Flatness control requirements for printed boards and Printed board assemblies 印制板及印制板组装件的平整度控制要求 - 中英文版 |
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GB/T 38342-2019 Aerospace electronic product—Assembling requirements of printed circuit board assembly 宇航电子产品 印制板组装件组装要求 - 中英文版 |
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GB/T 33772.1-2017 Quality assessment systems—Part 1: Registration and analysis of defects on Printed board assemblies 质量评定体系 第1部分：印制板组件上缺陷的统计和分析 - 中英文版 |
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GB/T 19247.4-2003 Printed board assemblies--Part 4:Sectional specification--Requirements for terminal soldered assemblies 印制板组装 第4部分:分规范 引出端焊接组装的要求 - 中英文版 |
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GB/T 19247.3-2003 Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies 印制板组装 第3部分:分规范 通孔安装焊接组装的要求 - 中英文版 |
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GB/T 19247.2-2003 Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies 印制板组装 第2部分: 分规范 表面安装焊接组装的要求 - 中英文版 |
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GB/T 19247.1-2003 Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies 印制板组装 第1部分:通用规范 采用表面安装和相关组装技术的电子和电气焊接组装的要求 - 中英文版 |
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