Home   GB Standards Search   GB Standards Index GB Standards Testing   GB Standards Compliance Pricing & Payment Contact Us
 

China Specification for mo GB Standards Search Result

1. Ready translated GB standards and Chinese version GB Standards, you can purchase directly in the web page; After receive your payment, we will send the GB Standards PDF file to your Email within 1~3 days.
2. Other English version GB Standards are not ready translated, only after get your order, then we translate them, time usually need 3-5 days .
       
GB/T 514-2005
Specification for liquid-in-glass thermometers for testing of petroleum products
石油产品试验用玻璃液体温度计技术条件 - 中英文版
GB/T 19665-2005
General specification for electronic infrared imaging thermometer of body skin
电子红外成像人体表面测温仪通用规范 - 中英文版
GB/T 12357.4-2004
Multimode optical fibres fortelecommunication--Part 4:Sectional specification for category A4 multimode fibres
通信用多模光纤 第4部分:A4类多模光纤特性 - 中英文版
GB/T 12357.3-2004
Multimode optical fibres fortelecommunication--Part 3:Sectional specification for category A3 multimode fibres
通信用多模光纤 第3部分:A3类多模光纤特性 - 中英文版
GB/T 12357.2-2004
Multimode optical fibres fortelecommunication--Part 2:Sectional specification for category A2 multimode fibres
通信用多模光纤 第2部分:A2类多模光纤特性 - 中英文版
GB/T 19405.1-2003
Surface mounting technology--Part 1:Standard method for the specification of surface mounting components(SMDs)
表面安装技术 第1部分:表面安装元器件规范的标准方法 - 中英文版
GB/T 19247.3-2003
Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies
印制板组装 第3部分:分规范 通孔安装焊接组装的要求 - 中英文版
GB/T 17574.10-2003
Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories
半导体器件 集成电路 第2-10部分:数字集成电路 集成电路动态读/写存储器空白详细规范 - 中英文版
GB/T 6850-2003
Cinematography--Labelling of containers for raw-stock motion-picture films and magnetic films--Minimum information specifications
电影 电影生胶片和涂磁胶片片盒标签 最低限度内容规定 - 中英文版
GB/T 19290.2-2003
Modular order for the development of mechanical structures for electronic equipment practices--Part 2: Sectional specification--Interface co-ordination dimensions for the 25mm equipment practice
发展中的电子设备构体机械结构模数序列 第2部分: 分规范 25 mm设备构体的接口协调尺寸 - 中英文版
GB/T 19247.2-2003
Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies
印制板组装 第2部分: 分规范 表面安装焊接组装的要求 - 中英文版
GB/T 19247.1-2003
Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组装 第1部分:通用规范 采用表面安装和相关组装技术的电子和电气焊接组装的要求 - 中英文版
GB 19157-2003
General specification for remote-controlled fire monitor systems
远控消防炮系统通用技术条件 - 中英文版
GB 19156-2003
General specifications for fire monitors
消防炮通用技术条件 - 中英文版
GB/T 19117-2003
Specifications for monitoring of acid rain
酸雨观测规范 - 中英文版
GB/T 16857.4-2003
Geometrical Product Specifications(GPS)--Acceptance andreverification tests for coordinate measuring machines(CMM)--Part 4: CMMs used in scanning measuring mode
产品几何量技术规范(GPS) 坐标测量机的验收检测和复检检测 第4部分: 在扫描模式下使用的坐标测量机 - 中英文版
GB/T 18904.4-2002
Semiconductor devices--Part 12-4:Optoelectronicdevices--Blank detail specification for pin-FET modules with/without pigtailfor fiber optic systems or sub-systems
半导体器件 第12-4部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的Pin-FET模块空白详细规范 - 中英文版
GB/T 18904.2-2002
Semiconductor devices--Part 12-2:Optoelectronic devices--Blank detail specification for laser diodes modules with pigtail for fiber optic systems or sub-systems
半导体器件 第12-2部分:光电子器件 纤维光学系统或子系统用带尾纤的激光二极管模块空白详细规范 - 中英文版
GB/T 15157.7-2002
Connectors for frequencies below 3MHz for use with printed boards--Part 7:Detail specification for connectors,8-way,including fixed and free connectors with common mating features,with assessed quality
频率低于3 MHz的印制板连接器 第7部分:有质量评定的具有通用插合特性的8位固定和自由连接器详细规范 - 中英文版
GB/T 1303.2-2002
Specification for industrial rigid laminated sheetsbased on thermosetting resins for electrical purposes--Part 3:Specifications for individual materials--Sheet 3:Requirements for rigid laminated sheets based onmelamine resins
电气用热固性树脂工业硬质层压板规范 第3部分:单项材料规范 第3篇:对三聚氰胺树脂硬质层压板的要求 - 中英文版
GB/T 18470-2001
Technical specifications for passive sampler and monitor
无泵型采样(检测)器技术规范 - 中英文版
GB 5294-2001
Specifications of individual monitoring for occupational exposure--Individual monitoring for external exposure
职业照射个人监测规范 外照射监测 - 中英文版
GB/T 18344-2001
Specification for the inspection and maintenance of motor vehicle
汽车维护、检测、诊断技术规范 - 中英文版
GB/T 18343-2001
Specification for automobile disk brakes being overhauled
汽车盘式制动器修理技术条件 - 中英文版
GB/T 4063-2001
Specifications of coals for steam locomotive
蒸汽机车用煤技术条件 - 中英文版
GB/T 18275.2-2000
Specifications for automobile braking transmission device being overhauled--Hydraulic braking
汽车制动传动装置修理技术条件 液压制动 - 中英文版
GB/T 18275.1-2000
Specifications for automobile braking transmission device being overhauled--Air braking
汽车制动传动装置修理技术条件 气压制动 - 中英文版
GB/T 18274-2000
Technical specifications for motor vehicle drum brake being overhauled
汽车鼓式制动器修理技术条件 - 中英文版
GB/T 18236.1-2000
Information technology--Telecommunications and information exchange between systems--Local and metropolitan area networks--Common specifications--Part 1:Medium Access Control(MAC)service definition
信息技术 系统间远程通信和信息交换 局域网和城域网 公共规范 第1部分:媒体访问控制(MAC)服务定义 - 中英文版
GB/T 18049-2000
Moderate thermal environments--Determination of the PMV and PPD indices and specification of the conditions for thermal comfort
中等热环境 PMV和PPD指数的测定及热舒适条件的规定 - 中英文版
GB/T 18034-2000
Specification for the platinum rhodium thermocouple thin wires used in mini-thermocouples
微型热电偶用铂铑细偶丝规范 - 中英文版
GB/T 5965-2000
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays)
半导体器件 集成电路 第2部分:数字集成电路 第一篇 双极型单片数字集成电路门电路(不包括自由逻辑阵列) 空白详细规范 - 中英文版
GB/T 1845.1-1999
Polyethylene(PE) moulding and extrusion materials--Part 1:Designation system and basis for specifications
聚乙烯(PE)模塑和挤出材料 第1部分:命名系统和分类基础 - 中英文版
GB/T 17772-1999
Earth-moving machinery--Laboratory evaluations of protective structures--Specifications for deflection-limiting volume
土方机械 保护结构的实验室鉴定 挠曲极限量的规定 - 中英文版
GB/T 9424-1998
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Five:Blank detail specification for complementary MOS digital inte-grated circuits,series 4000B and 4000UB
半导体器件 集成电路 第2部分:数字集成电路 第五篇 CMOS数字集成电路4000B和4000UB系列空白详细规范 - 中英文版
GB/T 17572-1998
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Four:Family specification for complementary MOS digital integrated circuits,series 4000B and 4000UB
半导体器件 集成电路 第2部分:数字集成电路 第四篇 CMOS数字集成电路 4000B和4000UB系列族规范 - 中英文版
GB/T 15157.2-1998
Connectors for frequencies below 3MHz for use with printed boards--Part 2:Detail specification for two-part connectors with assessed quality,for printed boards,for basic grid of 2.54 mm(0.1in) with commonmounting features
印制板用频率低于3 MHz的连接器 第2部分:有质量评定的具有通用安装特征 基本网格2.54 mm(0.1in)的印制板用两件式连接器详细规范 - 中英文版
GB/T 6594.1-1998
Polystyrene (PS) moulding and extrusion materials--Part 1:Designation system and basis for specifications
聚苯乙烯(PS)模塑和挤出材料 第1部分:命名系统和分类基础 - 中英文版
GB/T 17024-1997
Semiconductor devices--integratedcircuits--Part 2:Digital integrated circuits--Section three--Blank detail specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU
半导体器件 集成电路 第2部分:数字集成电路 第三篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列空白详细规范 - 中英文版
GB/T 17023-1997
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section two--Family specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU
半导体器件 集成电路 第2部分:数字集成电路 第二篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列族规范 - 中英文版
GB/T 16975.3-1997
Information technology--Remote operations--Part 3:OSI realizations--Remote Operations Service Element(ROSE) protocol specification
信息技术 远程操作 第3部分:OSI实现 远程操作服务元素(ROSE)协议规范 - 中英文版
GB/T 16697-1996
General Specification for monochrome universal NBTV cameras
黑白通用型应用电视摄像机通用技术条件 - 中英文版
GB/T 16653-1996
ISDN data link layer specification for frame mode bearer services
综合业务数字网帧模式承载业务 数据链路层规范 - 中英文版
GB/T 16562-1996
Specifications for port rail-mounted high mast type crane
港口高塔柱式轨道起重机技术条件 - 中英文版
GB/T 11318.3-1996
Equipments and components used in cabled distribution systems primarily intended for television and sound signals--Part 3:Generic specifications for TV modulator
电视和声音信号的电缆分配系统设备与部件 第3部分:电视调制器通用规范 - 中英文版
GB/T 16284.6-1996
Information technology--Text communication--Message-oriented text interchange system (MOTIS)--Part 6:Protocol specifications
信息技术 文本通信 面向信报的文本交换系统 第6部分:协议规范 - 中英文版
GB/T 15874-1995
General specification for trunked mobile communication system
集群移动通信系统设备通用规范 - 中英文版
GB/T 15939-1995
General specification for land mobile communication system equipment using multi-channel access techniques without a central controller
无中心多信道选址移动通信系统设备通用规范 - 中英文版
GB/T 15844.1-1995
General specification for radio transceiver employing F3E emission used in the mobile services
移动通信调频无线电话机通用技术条件 - 中英文版
GB/T 15767-1995
General specification of infrared remote control radiation units for video tape recorders
录像机用红外遥控发射器通用技术条件 - 中英文版

Find out:615Items   |  To Page of: First -Previous-Next -Last  | [6] [7] [8] [9] [10] [11] [12]

 

1F Zhongmao Building, No.1 Beizhan Road, Luohu District, Shenzhen City, China
+86-755-2583-1330       [email protected]
©  Copyright  2001-2025 All Rights Reserved