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GB/T 15972.53-2008 Specifications for optical fibre test methods - Part 53: Measurement methods and test procedures for environmental characteristics - Water immersion 光纤试验方法规范 第53部分：环境性能的测量方法和试验程序 浸水 - 中英文版 |
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GB/T 15972.52-2008 Specifications for optical fibre test methods - Part 52: Measurement methods and test procedures for environmental characteristics - Change of temperature 光纤试验方法规范 第52部分：环境性能的测量方法和试验程序 温度循环 - 中英文版 |
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GB/T 15972.51-2008 Specifications for optical fibre test methods - Part 51: Measurement methods and test procedures for environmental characteristics - Dry heat 光纤试验方法规范 第51部分: 环境性能的测量方法和试验程序 干热 - 中英文版 |
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GB/T 4219.1-2008 Plastics piping system for industrial applications - Unplasticized poly(vinyl chloride)(PVC-U) - Specifications for components and the system - Part 1: Pipes 工业用硬聚氯乙烯(PVC-U)管道系统 第1部分：管材 - 中英文版 |
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GB/T 21358-2008 Specifications for aviation jet fuel filter/separators 喷气燃料过滤分离器通用技术规范 - 中英文版 |
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GB/T 5019.6-2007 Specification for insulating materials based on mica - Part 3: Specifications for individual materials - Sheet 4: Polyester film-backed mica paper with a B-stage epoxy resin binder 以云母为基的绝缘材料 第6部分: 聚酯薄膜补强B阶环氧树脂粘合云母带 - 中英文版 |
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GB/T 21204.1-2007 Multicore and symmetrical pair/quad cables for digitai communications to be used in harsh environments-Part 1:Generic specifications 用于严酷环境的数字通信用对绞或星绞多芯对称电缆 第1部分:总规范 - 中英文版 |
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GB/T 21099.2-2007 Function blocks for process control - Part 2：Specification of FB concept and electronic device description language 过程控制用功能块 第2部分：功能块概念及电子设备描述语言的规范 - 中英文版 |
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GB/T 13309-2007 Specification for mechanical vibration generator systems 机械振动台 技术条件 - 中英文版 |
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GB/T 15157.14-2007 Connectors for frequencies below 3 MHz for use with printed boards - Part 14: Detail specification for circular connectors for low-frequency audio and video applications such as audio, video and audio-visual equipment 频率低于3MHz的印制板连接器 第14部分: 音频、视频和音像设备用低音频及视频圆形连接器详细规范 - 中英文版 |
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GB/T 20969.3-2007 Special environmental condition - Machinery for plateau - Part 3: The specification of select type and acceptance check for construction machinery on plateau 特殊环境条件 高原机械 第3部分：高原型工程机械选型、验收规范 - 中英文版 |
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GB/T 18802.321-2007 Components for low-voltage surge protective devices - Part 321: Specifications for avalanche breakdown diode(ABD) 低压电涌保护器元件 第321部分：雪崩击穿二极管（ABD）规范 - 中英文版 |
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GB/T 13606-2007 Instrument for geotechnical engineering - General specifications of vibrating wire sensor 土工试验仪器 岩土工程仪器 振弦式传感器通用技术条件 - 中英文版 |
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GB 4584-2007 Specification of active opto-electronic protective devices for presses 压力机用光电保护装置技术条件 - 中英文版 |
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GB/T 18802.311-2007 Components for low-voltage surge protective devices - Part 311: Specification for gas discharge tubes(GDT) 低压电涌保护器元件 第311部分：气体放电管（GDT）规范 - 中英文版 |
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GB/T 17574.9-2006 Semiconductor devices - Integrated circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories 半导体器件 集成电路 第2-9部分：数字集成电路 紫外光擦除电可编程MOS只读存储器空白详细规范 - 中英文版 |
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GB/T 17574.11-2006 Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory 半导体器件 集成电路 第2-11部分：数字集成电路 单电源集成电路电可擦可编程只读存储器 空白详细规范 - 中英文版 |
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GB/T 20626.2-2006 Specific environmental condition - Electrical and electronic products for plateau - Part 2: Selective types and testing specification 特殊环境条件 高原电工电子产品 第2部分：选型和检验规范 - 中英文版 |
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GB/Z 20541.1-2006 Digital data communication for measurement and control - Fieldbus for use in industrial control systems Type 10：PROFINET Specification - Part 1: Application layer service definition 测量和控制数字数据通信 工业控制系统用现场总线 类型10：PROFINET规范 第1部分：应用层服务定义 - 中英文版 |
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GB/T 20540.5-2006 Digital data communication for measurement and control - Fieldbus for use in industrial systems Type 3: PROFIBUS specification - Part 5: Application layer service definition 测量和控制数字数据通信 工业控制系统用现场总线 类型3：PROFIBUS规范 第5部分：应用层服务定义 - 中英文版 |
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GB/T 20540.3-2006 Digital data communication for measurement and control - Fieldbus for use in industrial systems Type 3: PROFIBUS specification -Part 3: Data link layer service definition 测量和控制数字数据通信 工业控制系统用现场总线 类型3：PROFIBUS规范 第3部分：数据链路层服务定义 - 中英文版 |
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GB/T 20540.2-2006 Digital data communication for measurement and control - Fieldbus for use in industrial systems Type 3: PROFIBUS specification - Part 2: Physical layer specification and service definition 测量和控制数字数据通信 工业控制系统用现场总线 类型3：PROFIBUS规范 第2部分：物理层规范和服务定义 - 中英文版 |
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GB/T 20540.1-2006 Digital data communication for measurement and control - Fieldbus for use in industrial systems Type 3: PROFIBUS specification - Part 1: Overview and guidance 测量和控制数字数据通信 工业控制系统用现场总线 类型3：PROFIBUS规范 第1部分：概述和导则 - 中英文版 |
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GB/T 4589.1-2006 Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits 半导体器件 第10部分：分立器件和集成电路总规范 - 中英文版 |
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GB/T 9239.1-2006 Mechanical vibration - Balance quality requirements for rotors in a constant (rigid) state - Part 1: Specification and verification of balance tolerances 机械振动 恒态（刚性）转子平衡品质要求 第1部分：规范与平衡允差的检验 - 中英文版 |
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GB/T 19363.2-2006 Specification for translation service―Part 2：Interpretation 翻译服务规范 第2部分 口译 - 中英文版 |
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GB/T 13154-2006 Cinematography - Colour motion-picture prints and slides for television-density specifications 电视用彩色电影拷贝和幻灯片的密度规范 - 中英文版 |
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GB/T 20519-2006 Information security technology - Public key infrastructures - Privilege Management Center technical specification 信息安全技术 公钥基础设施 特定权限管理中心技术规范 - 中英文版 |
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GB/T 12750-2006 Semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits 半导体器件 集成电路 第11部分：半导体集成电路分规范(不包括混合电路) - 中英文版 |
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GB/T 20268-2006 Specification for collecting and processing in-car navigable geographic data 车载导航地理数据采集处理技术规程 - 中英文版 |
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GB/T 20256-2006 Specifications for the gravimetry control 国家重力控制测量规范 - 中英文版 |
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GB/T 50363-2006 Technical specification for water-saving irrigation engineering 节水灌溉工程技术规范 - 中英文版 |
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GB/T 15819-2006 Polyethylene (PE) pipes for irrigation laterals - Susceptibility to envionmental stress cracking induced by insert-type fittings - Test method and specification 灌溉用聚乙烯(PE)管材由插入式管件引起环境应力开裂敏感性的试验方法和技术要求 - 中英文版 |
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GB/T 13151-2005 Semiconductor devices Discrete devices Part 6:Thyristors Section Three-Blank detail specification for reverse blocking triode thyristors,ambient and case-rated,for currents greater than 100A 半导体器件 分立器件 第6部分:晶闸管 第3篇 电流大于 100A、环境和管壳额定的反向阻断三极晶闸管空白详细规范 - 中英文版 |
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GB/T 13150-2005 Semiconductor devices Discret devices Blank detail specification for bidirectional triode thyristors(triacs),ambient and case-rated,for currents greater than 100A 半导体器件 分立器件 电流大于 100A、环境和管壳额定的双向三极晶闸管空白详细规范 - 中英文版 |
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GB/T 17574.10-2003 Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories 半导体器件 集成电路 第2-10部分:数字集成电路 集成电路动态读/写存储器空白详细规范 - 中英文版 |
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GB/T 18904.5-2003 Semiconductor devices--Part 12-5: Optoelectronic devices--Blank detail specification for pin-photodiodes with/without pigtail，for fibre optic systems or subsystems 半导体器件 第12-5部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的pin光电二极管空白详细规范 - 中英文版 |
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GB/T 6589-2002 Semiconductordevices--Discrete devices--Part 3-2:Signal (including switching) and regulator diodes--Blank detail specification for voltage-regulator diodes and voltage-reference diodes (excluding temperature-compensated precision reference diodes) 半导体器件 分立器件 第3-2部分:信号(包括开关)和调整二极管 电压调整二极管和电压基准二极管(不包括温度补偿精密基准二极管) 空白详细规范 - 中英文版 |
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GB/T 18904.4-2002 Semiconductor devices--Part 12-4:Optoelectronicdevices--Blank detail specification for pin-FET modules with/without pigtailfor fiber optic systems or sub-systems 半导体器件 第12-4部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的Pin-FET模块空白详细规范 - 中英文版 |
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GB/T 18904.3-2002 Semiconductor devices--Part 12-3:Optoelectronic devices--Blank detail specification for light-emitting diodes--Display application 半导体器件 第12-3部分:光电子器件 显示用发光二极管空白详细规范 - 中英文版 |
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GB/T 18904.2-2002 Semiconductor devices--Part 12-2:Optoelectronic devices--Blank detail specification for laser diodes modules with pigtail for fiber optic systems or sub-systems 半导体器件 第12-2部分:光电子器件 纤维光学系统或子系统用带尾纤的激光二极管模块空白详细规范 - 中英文版 |
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GB/T 18904.1-2002 Semiconductor devices--Part 12-1:Optoelectronic devices--Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fiber optic systems or sub-systems 半导体器件 第12-1部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的光发射或红外发射二极管空白详细规范 - 中英文版 |
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GB/T 18779.1-2002 Geometrical product specifications (GPS)--Inspection by measurement of workpieces and measuring equipment--Part 1:Decision rules for proving conformance or non-conformance with specifications 产品几何量技术规范(GPS) 工件与测量设备的测量检验 第1部分:按规范检验合格或不合格的判定规则 - 中英文版 |
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GB/T 1303.2-2002 Specification for industrial rigid laminated sheetsbased on thermosetting resins for electrical purposes--Part 3:Specifications for individual materials--Sheet 3:Requirements for rigid laminated sheets based onmelamine resins 电气用热固性树脂工业硬质层压板规范 第3部分:单项材料规范 第3篇:对三聚氰胺树脂硬质层压板的要求 - 中英文版 |
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GB/T 18500.2-2001 Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC) 半导体器件 集成电路 第4部分:接口集成电路 第二篇:线性模拟/数字转换器(ADC)空白详细规范 - 中英文版 |
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GB/T 18500.1-2001 Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC) 半导体器件 集成电路 第4部分:接口集成电路 第一篇:线性数字/模拟转换器(DAC)空白详细规范 - 中英文版 |
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GB 5294-2001 Specifications of individual monitoring for occupational exposure--Individual monitoring for external exposure 职业照射个人监测规范 外照射监测 - 中英文版 |
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GB/T 18275.2-2000 Specifications for automobile braking transmission device being overhauled--Hydraulic braking 汽车制动传动装置修理技术条件 液压制动 - 中英文版 |
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GB/T 18275.1-2000 Specifications for automobile braking transmission device being overhauled--Air braking 汽车制动传动装置修理技术条件 气压制动 - 中英文版 |
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GB/T 6588-2000 Semiconductor devices--Discrete devices--Part 3:Signal(including switching) and regulator diodes--Section One--Blank detail specification for signal diodes，switching diodes and controlled-avalanche diodes 半导体器件 分立器件 第3部分:信号(包括开关)和调整二极管 第1篇 信号二极管、开关二极管和可控雪崩二极管空白详细规范 - 中英文版 |
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