Home   GB Standards Search   GB Standards Index GB Standards Testing   GB Standards Compliance Pricing & Payment Contact Us
 

China Integrated circuit i GB Standards Search Result

1. Ready translated GB standards and Chinese version GB Standards, you can purchase directly in the web page; After receive your payment, we will send the GB Standards PDF file to your Email within 1~3 days.
2. Other English version GB Standards are not ready translated, only after get your order, then we translate them, time usually need 3-5 days .
       
GB/T 16649.1-2006
Identification cards - Integrated circuit(s) cards with contacts - Part 1: Physical characteristics
识别卡 带触点的集成电路卡 第1部分:物理特性 - 中英文版
GB/T 19558-2004
General specifications for integrated circuit(IC)card payphone and system
集成电路(IC)卡公用付费电话系统总技术要求 - 中英文版
GB/T 2900.66-2004
Electrotechnical terminology--Semiconductor devices and integrated circuits
电工术语 半导体器件和集成电路 - 中英文版
GB/T 19403.1-2003
Semiconductor devices--Integrated circuits--Part 11:Section 1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits)
半导体器件 集成电路 第11部分:第1篇:半导体集成电路 内部目检 (不包括混合电路) - 中英文版
GB/T 17574.10-2003
Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories
半导体器件 集成电路 第2-10部分:数字集成电路 集成电路动态读/写存储器空白详细规范 - 中英文版
GB/T 15651.3-2003
Discrete semiconductor devices and integrated circuits--Part 5-3:Optoelectronic devices--Measuring methods
半导体分立器件和集成电路 第5-3部分:光电子器件 测试方法 - 中英文版
GB/T 15651.2-2003
Discrete semiconductor devices and integrated circuits--Part 5-2:Optoelectronic devices--Essential ratings and characteristics
半导体分立器件和集成电路 第5-2部分:光电子器件 基本额定值和特性 - 中英文版
GB/T 16649.5-2002
Identification cards--Integrated circuit(s) cards with contacts--Part 5:National numbering system and registration procedure for application identifiers
识别卡 带触点的集成电路卡 第5部分:应用标识符的国家编号体系和注册规程 - 中英文版
GB/T 18500.2-2001
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC)
半导体器件 集成电路 第4部分:接口集成电路 第二篇:线性模拟/数字转换器(ADC)空白详细规范 - 中英文版
GB/T 18500.1-2001
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC)
半导体器件 集成电路 第4部分:接口集成电路 第一篇:线性数字/模拟转换器(DAC)空白详细规范 - 中英文版
GB/T 18460.3-2001
Pre-payment vending system using integrated circuit(s)cards with contacts--Part 3:Pre-payment elect-ricity meters
IC卡预付费售电系统 第3部分:预付费电度表 - 中英文版
GB/T 18460.2-2001
Pre-payment vending system using integrated circuit(s)cards with contacts--Part 2:IC card and its management
IC卡预付费售电系统 第2部分:IC卡及其管理 - 中英文版
GB/T 18460.1-2001
Pre-payment vending system using integrated circuit(s)cards with contacts--Part 1:General principles
IC卡预付费售电系统 第1部分:总则 - 中英文版
GB/T 18392-2001
Norm of integrated circuit(IC) card of certificate of identity code for organizations institutions and enterprises of the People’s Republic of China
中华人民共和国组织机构代码证集成电路(IC)卡技术规范 - 中英文版
GB/T 18349-2001
Integrated Circuit/Computer Hardware Description Language Verilog
集成电路/计算机硬件描述语言Verilog - 中英文版
GB/T 16649.6-2001
Identification cards--Integrated circuit(s) cards with contacts--Part 6:Interindustrv data elements
识别卡 带触点的集成电路卡 第6部分:行业间数据元 - 中英文版
GB/T 16649.7-2000
Identification cards--Integrated circuit(s) cards with contacts--Part 7:Interindustry commands for Structured Card Query Language(SCQL)
识别卡 带触点的集成电路卡 第7部分:用于结构化卡查询语言(SCQL)的行业间命令 - 中英文版
GB/T 18239-2000
Generic specification for integrated circuit card reader
集成电路(IC)卡读写机通用规范 - 中英文版
GB/T 5965-2000
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays)
半导体器件 集成电路 第2部分:数字集成电路 第一篇 双极型单片数字集成电路门电路(不包括自由逻辑阵列) 空白详细规范 - 中英文版
GB/T 17940-2000
Semiconductor devices--Integrated circuits--Part 3:Analogue integrated circuits
半导体器件 集成电路 第3部分:模拟集成电路 - 中英文版
GB/T 17801-1999
Interface betweendata terminal equipment(DTE) and data circuit-terminating equipment (DCE) for terminals operating in the packet mode and accessing a packet switched public data network through a public switched telephone network or an integrated service
经公用交换电话网或综合业务数字网或电路交换公用数据网接入分组交换公用数据网的分组式数据终端设备(DTE)和数据电路终接设备(DCE)之间的接口 - 中英文版
GB/T 9424-1998
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Five:Blank detail specification for complementary MOS digital inte-grated circuits,series 4000B and 4000UB
半导体器件 集成电路 第2部分:数字集成电路 第五篇 CMOS数字集成电路4000B和4000UB系列空白详细规范 - 中英文版
GB/T 17574-1998
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits
半导体器件 集成电路 第2部分:数字集成电路 - 中英文版
GB/T 17573-1998
Semiconductor devices--Discrete devices and integrated circuits--Part 1:General
半导体器件 分立器件和集成电路 第1部分:总则 - 中英文版
GB/T 17572-1998
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Four:Family specification for complementary MOS digital integrated circuits,series 4000B and 4000UB
半导体器件 集成电路 第2部分:数字集成电路 第四篇 CMOS数字集成电路 4000B和4000UB系列族规范 - 中英文版
GB/T 4023-1997
Semiconductor devices--Discrete devices and integrated circuits--Part 2:Rectifier diodes
半导体器件 分立器件和集成电路 第2部分:整流二极管 - 中英文版
GB/T 17024-1997
Semiconductor devices--integratedcircuits--Part 2:Digital integrated circuits--Section three--Blank detail specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU
半导体器件 集成电路 第2部分:数字集成电路 第三篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列空白详细规范 - 中英文版
GB/T 17023-1997
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section two--Family specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU
半导体器件 集成电路 第2部分:数字集成电路 第二篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列族规范 - 中英文版
GB/T 16878-1997
Specification for metrology pattern cells for integrated circuit manufacture
用于集成电路制造技术的检测图形单元规范 - 中英文版
GB/T 16791.1-1997
Financial transaction cards--Messages between the integrated circuit card and the card accepting device--Part 1:Concepts and structures
金融交易卡 集成电路卡与卡接受设备之间的报文 第1部分:概念与结构 - 中英文版
GB/T 16790.1-1997
Financial transaction cards--Security architecture of financial transaction systems using integrated circuit cards--Part 1:Card life cycle
金融交易卡 使用集成电路卡的金融交易系统的安全结构 第1部分:卡的生命周期 - 中英文版
GB/T 8976-1996
Generic specification for film integrated circuits and hybrid film integrated circuits
膜集成电路和混合膜集成电路总规范 - 中英文版
GB/T 6798-1996
Semiconductor integrated circuits--General principles of measuring methods of voltage comparators
半导体集成电路 电压比较器测试方法的基本原理 - 中英文版
GB/T 4377-1996
Semiconductor integrated circuits--General principles of measuring methods of voltage regulator
半导体集成电路 电压调整器测试方法的基本原理 - 中英文版
GB/T 3436-1996
Semiconductor integrated circuits--Series and products of operational amplifier
半导体集成电路 运算放大器系列和品种 - 中英文版
GB/T 16466-1996
Blank detailspecification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
膜集成电路和混合膜集成电路空白详细规范(采用能力批准程序) - 中英文版
GB/T 16465-1996
Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
膜集成电路和混合膜集成电路分规范(采用能力批准程序) - 中英文版
GB/T 16464-1996
Semiconductor devices--Integrated circuits--Part 1:General
半导体器件 集成电路 第1部分:总则 - 中英文版
GB/T 15879-1995
Mechanical standardization of semiconductor devices--Part 5:Recommendations applying to tape automated bonding (TAB) of integrated circuits
半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值 - 中英文版
GB/T 15651-1995
Semiconductor devices--Discrete devices and integrated circuits--Part 5:Optoelectronic devices
半导体器件 分立器件和集成电路 第5部分:光电子器件 - 中英文版
GB/T 4587-1994
Semiconductor discrete devices and integrated circuits--Part 7:Bipolar transistors
半导体分立器件和集成电路 第7部分:双极型晶体管 - 中英文版
GB/T 4376-1994
Series and products of voltage regulators for semi-conductor integrated circuits
半导体集成电路 电压调整器系列和品种 - 中英文版
GB/T 15138-1994
Case outlines for film integrated circuits and hybrid integrated circuits
膜集成电路和混合集成电路外形尺寸 - 中英文版
GB/T 15136-1994
General principles of measuring methods for quartz clock and watch circuits of semiconductor integrated circuits
半导体集成电路石英钟表电路测试方法的基本原理 - 中英文版
GB/T 14862-1993
Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
半导体集成电路封装结到外壳热阻测试方法 - 中英文版
GB/T 14129-1993
Series and productsfor TTL semiconductor integrated circuits--Products of series PAL
半导体集成电路TTL电路系列和品种 PAL系列的品种 - 中英文版
GB/T 7092-1993
Outline dimensions of semiconductor integratedcircuits
半导体集成电路外形尺寸 - 中英文版
GB/T 14115-1993
General principles of measuring methods of Sample/Hold amplifiers for semiconductor integrated circuits
半导体集成电路采样/保持放大器测试方法的基本原理 - 中英文版
GB/T 14114-1993
General principles of measuring methods of V/F and F/V converters for semiconductor integrated circuits
半导体集成电路电压/频率和频率/电压转换器测试方法的基本原理 - 中英文版
GB/T 14032-1992
General principles of measuring methods of digital phase-locked loop for semiconductor integrated circuits
半导体集成电路数字锁相环测试方法的基本原理 - 中英文版

Find out:162Items   |  To Page of: First -Previous-Next -Last  | 1 2 3 4

 

1F Zhongmao Building, No.1 Beizhan Road, Luohu District, Shenzhen City, China
+86-755-2583-1330       [email protected]
©  Copyright  2001-2025 All Rights Reserved